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MIC5303_08

Description
Single 300mA CMOS Ultra Small ULDO
File Size247KB,8 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
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MIC5303_08 Overview

Single 300mA CMOS Ultra Small ULDO

MIC5303
Single 300mA CMOS
Ultra Small ULDO™
General Description
The MIC5303 is an ultra small, Ultra Low Dropout CMOS
regulator, ULDO™ that is ideal for today’s most demand-
ing portable applications including cellular phone RF
power, camera modules, imaging sensors for digital still
and video cameras, PDAs, portable media players (PMP)
and PC cameras where board space is limited. It offers
extremely low dropout voltage, very low output noise and
can operate from a 2.3V to 5.5V input while delivering up
to 300mA.
It offers 2% initial accuracy, low ground current (typically
85µA total), thermal and current limit protection. The
MIC5303 can also be put into a zero-off-mode current
state, drawing no current when disabled.
The MIC5303 is available in the ultra small 4-pin 1.2mm x
1.6mm Thin MLF
®
package, occupying only 1.92mm
2
of
PCB area, a 50% reduction in board area compared to
SC-70 and 2mm x 2mm MLF
®
packages. It’s operating
junction temperature range is –40°C to +125°C and is
available in fixed output voltages in lead-free (RoHS
compliant) Thin MLF
®
package.
Data sheets and support documentation can be found on
Micrel’s web site at www.micrel.com.
Features
Ultra Small 1.2mm x 1.6mm Thin MLF
®
package
Low Dropout Voltage: 100mV at 300mA
Output noise 120µVrms
Input voltage range: 2.3V to 5.5V
300mA guaranteed output current
Stable with ceramic output capacitors
Low quiescent current 85µA total
35µs turn-on time
High output accuracy
– ±2% initial accuracy
– ±3% over temperature
Thermal shutdown and current limit protection
Applications
Mobile Phones
PDAs
GPS Receivers
Portable Media Players
Portable Electronics
Digital Still & Video Cameras
Typical Application
MIC5303-x.xYMT
150
VIN
EN
VOUT
Dropout Voltage
vs. Output Current
125
100
1µF
GND
1µF
75
50
25
V
OUT
= 2.8V
C
OUT
= 1µF
50 100 150 200 250 300
OUTPUT CURRENT (mA)
RF LDO Application
0
0
ULDO is a trademark of Micrel, Inc.
MLF and
MicroLeadFrame
are registered trademarks of Amkor Technology, Inc.
Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com
May 2008
M9999-051508-D

MIC5303_08 Related Products

MIC5303_08 MIC5303-2.5YMT MIC5303-2.6YMT MIC5303-2.8YMT
Description Single 300mA CMOS Ultra Small ULDO Single 300mA CMOS Ultra Small ULDO Single 300mA CMOS Ultra Small ULDO Single 300mA CMOS Ultra Small ULDO
Is it Rohs certified? - conform to conform to conform to
Maker - Microchip Microchip Microchip
package instruction - 1.20 X 1.60 MM, ROHS COMPLIANT, MLF-4 1.20 X 1.60 MM, ROHS COMPLIANT, MLF-4 1.20 X 1.60 MM, ROHS COMPLIANT, MLF-4
Reach Compliance Code - compli compli compli
ECCN code - EAR99 EAR99 EAR99
Maximum drop-back voltage 1 - 0.2 V 0.2 V 0.2 V
Maximum input voltage - 5.5 V 5.5 V 5.5 V
Minimum input voltage - 2.3 V 2.3 V 2.3 V
JESD-30 code - R-XDSO-N4 R-XDSO-N4 R-XDSO-N4
JESD-609 code - e4 e4 e3
length - 1.6 mm 1.6 mm 1.6 mm
Humidity sensitivity level - 1 1 1
Number of functions - 1 1 1
Number of terminals - 4 4 4
Working temperatureTJ-Max - 125 °C 125 °C 125 °C
Operating temperatureTJ-Mi - -40 °C -40 °C -40 °C
Maximum output current 1 - 0.3 A 0.3 A 0.3 A
Maximum output voltage 1 - 2.575 V 2.675 V 2.884 V
Minimum output voltage 1 - 2.425 V 2.525 V 2.716 V
Nominal output voltage 1 - 2.5 V 2.6 V 2.8 V
Package body material - UNSPECIFIED UNSPECIFIED UNSPECIFIED
encapsulated code - HVSON HVSON HVSON
Package shape - RECTANGULAR RECTANGULAR RECTANGULAR
Package form - SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius) - 260 260 260
Certification status - Not Qualified Not Qualified Not Qualified
Regulator type - FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
Maximum seat height - 0.6 mm 0.6 mm 0.6 mm
surface mount - YES YES YES
technology - CMOS CMOS CMOS
Terminal surface - NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD MATTE TIN
Terminal form - NO LEAD NO LEAD NO LEAD
Terminal pitch - 0.5 mm 0.5 mm 0.5 mm
Terminal location - DUAL DUAL DUAL
Maximum time at peak reflow temperature - 40 40 40
width - 1.2 mm 1.2 mm 1.2 mm

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