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PAL20RA10ML/883B

Description
OT PLD, 40ns, PAL-Type, TTL, CQCC28, CERAMIC, LCC-28
CategoryProgrammable logic devices    Programmable logic   
File Size438KB,15 Pages
ManufacturerAMD
Websitehttp://www.amd.com
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PAL20RA10ML/883B Overview

OT PLD, 40ns, PAL-Type, TTL, CQCC28, CERAMIC, LCC-28

PAL20RA10ML/883B Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerAMD
Parts packaging codeQLCC
package instructionQCCN, LCC28,.45SQ
Contacts28
Reach Compliance Codeunknown
ECCN code3A001.A.2.C
ArchitecturePAL-TYPE
maximum clock frequency16.7 MHz
JESD-30 codeS-CQCC-N28
JESD-609 codee0
Dedicated input times10
Number of I/O lines10
Number of entries20
Output times10
Number of product terms80
Number of terminals28
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize10 DEDICATED INPUTS, 10 I/O
Output functionMACROCELL
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQCCN
Encapsulate equivalent codeLCC28,.45SQ
Package shapeSQUARE
Package formCHIP CARRIER
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Programmable logic typeOT PLD
propagation delay40 ns
Certification statusNot Qualified
Filter level38535Q/M;38534H;883B
Maximum supply voltage5.5 V
Minimum supply voltage4.5 V
Nominal supply voltage5 V
surface mountYES
technologyTTL
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED

PAL20RA10ML/883B Related Products

PAL20RA10ML/883B PAL20RA10MJS/883B PAL20RA10MW/883B
Description OT PLD, 40ns, PAL-Type, TTL, CQCC28, CERAMIC, LCC-28 OT PLD, 40ns, PAL-Type, TTL, CDIP24, 0.300 INCH, SKINNY, CERAMIC, DIP-24 OT PLD, 40ns, PAL-Type, TTL, CDFP24, CERAMIC, FP-24
Is it Rohs certified? incompatible incompatible incompatible
Maker AMD AMD AMD
Parts packaging code QLCC DIP DFP
package instruction QCCN, LCC28,.45SQ DIP, DIP24,.3 DFP, FL24,.4
Contacts 28 24 24
Reach Compliance Code unknown unknown unknown
ECCN code 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C
Architecture PAL-TYPE PAL-TYPE PAL-TYPE
maximum clock frequency 16.7 MHz 16.7 MHz 16.7 MHz
JESD-30 code S-CQCC-N28 R-GDIP-T24 R-GDFP-F24
JESD-609 code e0 e0 e0
Dedicated input times 10 10 10
Number of I/O lines 10 10 10
Number of entries 20 20 20
Output times 10 10 10
Number of product terms 80 80 80
Number of terminals 28 24 24
Maximum operating temperature 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C
organize 10 DEDICATED INPUTS, 10 I/O 10 DEDICATED INPUTS, 10 I/O 10 DEDICATED INPUTS, 10 I/O
Output function MACROCELL MACROCELL MACROCELL
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
encapsulated code QCCN DIP DFP
Encapsulate equivalent code LCC28,.45SQ DIP24,.3 FL24,.4
Package shape SQUARE RECTANGULAR RECTANGULAR
Package form CHIP CARRIER IN-LINE FLATPACK
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V
Programmable logic type OT PLD OT PLD OT PLD
propagation delay 40 ns 40 ns 40 ns
Certification status Not Qualified Not Qualified Not Qualified
Filter level 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B
Maximum supply voltage 5.5 V 5.5 V 5.5 V
Minimum supply voltage 4.5 V 4.5 V 4.5 V
Nominal supply voltage 5 V 5 V 5 V
surface mount YES NO YES
technology TTL TTL TTL
Temperature level MILITARY MILITARY MILITARY
Terminal form NO LEAD THROUGH-HOLE FLAT
Terminal pitch 1.27 mm 2.54 mm 1.27 mm
Terminal location QUAD DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Terminal surface Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb)
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