P89V51RD2BN datasheet, PDF - EEWORLD Datasheet

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P89V51RD2BN: Description8-BIT, FLASH, 40 MHz, MICROCONTROLLER, PDIP40; CategoryThe embedded processor and controller Microcontrollers and processors; File Size322KB，80 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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P89V51RD2BN Overview

8-BIT, FLASH, 40 MHz, MICROCONTROLLER, PDIP40

P89V51RD2BN Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	DIP
package instruction	0.600 INCH, PLASTIC, MO-015, DIP-40
Contacts	40
Reach Compliance Code	unknow
ECCN code	3A991.A.2
Has ADC	NO
Address bus width	16
bit size	8
CPU series	8051
maximum clock frequency	40 MHz
DAC channel	NO
DMA channel	NO
External data bus width	8
JESD-30 code	R-PDIP-T40
JESD-609 code	e3
length	52 mm
Humidity sensitivity level	1
Number of I/O lines	32
Number of terminals	40
Maximum operating temperature	70 °C
Minimum operating temperature
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP40,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
RAM (bytes)	1024
rom(word)	65536
ROM programmability	FLASH
Maximum seat height	4.7 mm
speed	40 MHz
Maximum slew rate	50 mA
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Matte Tin (Sn)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

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P89V51RB2/RC2/RD2

8-bit 80C51 5 V low power 16/32/64 kB ﬂash microcontroller

with 1 kB RAM

Rev. 05 — 12 November 2009

Product data sheet

1. General description

The P89V51RB2/RC2/RD2 are 80C51 microcontrollers with 16/32/64 kB ﬂash and

1024 B of data RAM.

A key feature of the P89V51RB2/RC2/RD2 is its X2 mode option. The design engineer

can choose to run the application with the conventional 80C51 clock rate (12 clocks per

machine cycle) or select the X2 mode (six clocks per machine cycle) to achieve twice the

throughput at the same clock frequency. Another way to beneﬁt from this feature is to keep

the same performance by reducing the clock frequency by half, thus dramatically reducing

the EMI.

The ﬂash program memory supports both parallel programming and in serial ISP. Parallel

programming mode offers gang-programming at high speed, reducing programming costs

and time to market. ISP allows a device to be reprogrammed in the end product under

software control. The capability to ﬁeld/update the application ﬁrmware makes a wide

range of applications possible.

The P89V51RB2/RC2/RD2 is also capable of IAP, allowing the ﬂash program memory to

be reconﬁgured even while the application is running.

2. Features

80C51 CPU

5 V operating voltage from 0 MHz to 40 MHz

16/32/64 kB of on-chip ﬂash user code memory with ISP and IAP

Supports 12-clock (default) or 6-clock mode selection via software or ISP

SPI and enhanced UART

PCA with PWM and capture/compare functions

Four 8-bit I/O ports with three high-current port 1 pins (16 mA each)

Three 16-bit timers/counters

Programmable watchdog timer

Eight interrupt sources with four priority levels

Second DPTR register

Low EMI mode (ALE inhibit)

TTL- and CMOS-compatible logic levels

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Description	8-BIT, FLASH, 40 MHz, MICROCONTROLLER, PDIP40	8-BIT, FLASH, 40 MHz, MICROCONTROLLER, PQCC44	8-BIT, FLASH, 40 MHz, MICROCONTROLLER, PQCC44	8-BIT, FLASH, 40 MHz, MICROCONTROLLER, PQCC44	8-BIT, FLASH, 40 MHz, MICROCONTROLLER, PQCC44	8-BIT, FLASH, 40 MHz, MICROCONTROLLER, PQCC44	8-BIT, FLASH, 40 MHz, MICROCONTROLLER, PQCC44	8-BIT, FLASH, 40 MHz, MICROCONTROLLER, PQCC44	8-BIT, FLASH, 40 MHz, MICROCONTROLLER, PDIP40
Address bus width	16	16	16	16	16	16	16	16	16
External data bus width	8	8	8	8	8	8	8	8	8
Number of terminals	40	44	40	44	44	44	40	44	40
Maximum operating temperature	70 °C	85 °C	85 °C	85 Cel	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-	-40 °C	-40 °C	-40 Cel	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
PWM channel	YES	YES	YES	Yes	YES	YES	YES	YES	YES
surface mount	NO	YES	NO	Yes	YES	YES	NO	YES	NO
Temperature level	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	THROUGH-HOLE	J BEND	THROUGH-HOLE	J BEND	J BEND	GULL WING	THROUGH-HOLE	GULL WING	THROUGH-HOLE
Terminal location	DUAL	QUAD	DUAL	Four	QUAD	QUAD	DUAL	QUAD	DUAL
Is it Rohs certified?	conform to	-	conform to	-	conform to	conform to	conform to	conform to	conform to
Maker	NXP	NXP	NXP	-	NXP	NXP	NXP	NXP	NXP
Parts packaging code	DIP	LPCC	DIP	-	LPCC	QFP	DIP	QFP	DIP
package instruction	0.600 INCH, PLASTIC, MO-015, DIP-40	QCCJ, LDCC44,.7SQ	DIP, DIP40,.6	-	QCCJ, LDCC44,.7SQ	10 X 10 MM, 1 MM HEIGHT, PLASTIC, MS-026, TQFP-44	DIP, DIP40,.6	10 X 10 MM, 1 MM HEIGHT, PLASTIC, MS-026, TQFP-44	0.600 INCH, PLASTIC, MO-015, DIP-40
Contacts	40	44	40	-	44	44	40	44	40
Reach Compliance Code	unknow	unknow	unknow	-	unknow	unknow	unknow	unknow	unknow
ECCN code	3A991.A.2	3A991.A.2	3A991.A.2	-	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2
Has ADC	NO	NO	NO	-	NO	NO	NO	NO	NO
bit size	8	8	8	-	8	8	8	8	8
CPU series	8051	8051	8051	-	8051	8051	8051	8051	8051
maximum clock frequency	40 MHz	40 MHz	40 MHz	-	40 MHz	40 MHz	40 MHz	40 MHz	40 MHz
DAC channel	NO	NO	NO	-	NO	NO	NO	NO	NO
DMA channel	NO	NO	NO	-	NO	NO	NO	NO	NO
JESD-30 code	R-PDIP-T40	S-PQCC-J44	R-PDIP-T40	-	S-PQCC-J44	S-PQFP-G44	R-PDIP-T40	S-PQFP-G44	R-PDIP-T40
length	52 mm	16.585 mm	52 mm	-	16.585 mm	10 mm	52 mm	10 mm	52 mm
Humidity sensitivity level	1	-	-	-	3	3	-	3	1
Number of I/O lines	32	32	32	-	32	32	32	32	32
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	QCCJ	DIP	-	QCCJ	TQFP	DIP	TQFP	DIP
Encapsulate equivalent code	DIP40,.6	LDCC44,.7SQ	DIP40,.6	-	LDCC44,.7SQ	TQFP44,.47SQ,32	DIP40,.6	QFP44,.47SQ,32	DIP40,.6
Package shape	RECTANGULAR	SQUARE	RECTANGULAR	-	SQUARE	SQUARE	RECTANGULAR	SQUARE	RECTANGULAR
Package form	IN-LINE	CHIP CARRIER	IN-LINE	-	CHIP CARRIER	FLATPACK, THIN PROFILE	IN-LINE	FLATPACK, THIN PROFILE	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	-	245	-	245	260	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	-	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (bytes)	1024	1024	1024	-	1024	1024	1024	1024	1024
rom(word)	65536	16384	16384	-	32768	32768	32768	65536	65536
ROM programmability	FLASH	FLASH	FLASH	-	FLASH	FLASH	FLASH	FLASH	FLASH
Maximum seat height	4.7 mm	4.57 mm	4.7 mm	-	4.57 mm	1.2 mm	4.7 mm	1.2 mm	4.7 mm
speed	40 MHz	40 MHz	40 MHz	-	40 MHz	40 MHz	40 MHz	40 MHz	40 MHz
Maximum slew rate	50 mA	50 mA	50 mA	-	50 mA	50 mA	50 mA	50 mA	50 mA
Maximum supply voltage	5.5 V	5.5 V	5.5 V	-	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage	4.5 V	4.5 V	4.5 V	-	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage	5 V	5 V	5 V	-	5 V	5 V	5 V	5 V	5 V
technology	CMOS	CMOS	CMOS	-	CMOS	CMOS	CMOS	CMOS	CMOS
Terminal pitch	2.54 mm	1.27 mm	2.54 mm	-	1.27 mm	0.8 mm	2.54 mm	0.8 mm	2.54 mm
Maximum time at peak reflow temperature	NOT SPECIFIED	-	40	-	30	30	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	7.62 mm	16.585 mm	7.62 mm	-	16.585 mm	10 mm	7.62 mm	10 mm	7.62 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	-	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER

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