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342000F00000

Description
Heat Sink, Adhesive, Copper
CategoryThermal management products    Heat resisting bracing   
File Size34KB,2 Pages
ManufacturerAavid Thermalloy
Download Datasheet Parametric Compare View All

342000F00000 Overview

Heat Sink, Adhesive, Copper

342000F00000 Parametric

Parameter NameAttribute value
MakerAavid Thermalloy
Reach Compliance Codeunknown
Main materialCOPPER
colorBLACK
structureADHESIVE
high25.4 mm
length76.2 mm
Heat Resistant Support Device TypeHEAT SINK
width25.4 mm
THIN-FIN
HEAT SINKS
T H E R M A L P R O D U C T S, I N C.
FOR COMPUTER AND CUSTOM APPLICATIONS
LOW PROFILE COPPER HEAT SINKS IDEAL FOR PCI AND AGP CHIP SETS
When space is at a premium, Aavid’s Thin-fin
heat sinks reduce package case temperature
by as much as 20º C. These flexible, copper
spreaders attach to the electronic package using
pre-applied adhesive, providing an off-the-shelf
solution for PCI and AGP chip sets. A laminated
dielectric coating prevents shorting, making the
Thin-Fin ideal for BGA devices and multimedia
appliances.
THIN FIN HEAT SINKS OFFER:
• Significant cooling with limited headroom
• Pre-applied adhesive for rapid assembly
• Dielectric coating to prevent shorting
THERMAL PERFORMANCE
T H E R M A L R E S I S TA N C E ( C - A )
°
C / Wa t t
ORDERING INFORMATION:
Part Number
“A”
“B”
“C”
341600F00000
50.8 (2.0)
12.7 (0.5)
12.7 (0.5)
341700F00000
76.2 (3.0)
12.7 (0.5)
12.7 (0.5)
341800F00000
76.2 (3.0)
19.1 (0.75)
19.1 (0.75)
341900F00000*
76.2 (3.0)
25.4 (1.0)
25.4 (1.0)
342000F00000
101.6 (4.0)
25.4 (1.0)
25.4 (1.0)
342100F00000
101.6 (4.0)
38.1 (1.5)
38.1 (1.5)
*
Recommended for use in cooling microprocessor chip sets, such as PCI and AGP.
Notes:
Dimensions are in mm (inches)
Contact our Applications Engineering Department for custom configurations
25
20
15
10
5
0
50
100
3416
3417
3418
PRODUCT SPECIFICATIONS:
Properties
Color
Value
Black
0.33 mm (0.013 inches)
16.8 Pa (0.039 oz/in
2
Polyvinylfluoride
Silicone PSA
>1600 Volts/mil (ASTM D149)
150
200
Total thickness
(including adhesive)
Weight
Insulator
A I R F L OW ( F t / M i n )
T H E R M A L R E S I S TA N C E ( C - A )
°
C / Wa t t
25
20
15
10
5
0
50
100
3419
3420
3421
Adhesive
Dielectric Strength
Adhesion Performance
Lap Shear
(at room temperature
Lap Shear (at 100º C)
90º Peel
(at room temperature)
90º Peel (at 100º C)
414 kPa (960 oz/in
2
)
23 kPa (53 oz/in
2
)
441 g/cm (20 oz/in)
220 g/cm (20 oz/in)
150
200
A I R F L OW ( F t / M i n )
Thin-fin heat sinks have passed the following tests: heat aging, high
temperature and humidity, temperature cycling, and temperature
shock. Thin-fins meet UL 94V-0 flammability specification.

342000F00000 Related Products

342000F00000
Description Heat Sink, Adhesive, Copper
Maker Aavid Thermalloy
Reach Compliance Code unknown
Main material COPPER
color BLACK
structure ADHESIVE
high 25.4 mm
length 76.2 mm
Heat Resistant Support Device Type HEAT SINK
width 25.4 mm

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