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CL10C391FB8NNNC

Description
Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, C0G, 30ppm/Cel TC, 0.00039uF, Surface Mount, 0603, CHIP, LEAD FREE
CategoryPassive components    capacitor   
File Size159KB,2 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Environmental Compliance  
Download Datasheet Parametric View All

CL10C391FB8NNNC Overview

Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, C0G, 30ppm/Cel TC, 0.00039uF, Surface Mount, 0603, CHIP, LEAD FREE

CL10C391FB8NNNC Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerSAMSUNG
package instruction, 0603
Reach Compliance Codecompliant
ECCN codeEAR99
capacitance0.00039 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
high0.8 mm
JESD-609 codee3
length1.6 mm
Installation featuresSURFACE MOUNT
multi-layerYes
negative tolerance1%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
Package formSMT
method of packingTR, CARDBOARD, 7 INCH
positive tolerance1%
Rated (DC) voltage (URdc)50 V
size code0603
surface mountYES
Temperature characteristic codeC0G
Temperature Coefficient-/+30ppm/Cel ppm/°C
Terminal surfaceMatte Tin (Sn) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
width0.8 mm
SPECIFICATION
Supplier : Samsung electro-mechanics
Product : Multi-layer Ceramic Capacitor
A. Samsung Part Number
CL
Series
Size
Dielectric
Capacitance
Capacitance
tolerance
Rated Voltage
Thickness
10
C
391
F
B
8
N
N
N
C
Part Number :
Description :
CL10C391FB8NNNC
CAP, 390㎊, 50V, ±1%, C0G, 0603
Samsung Multi-layer Ceramic Capacitor
0603 (inch code)
L: 1.6 ± 0.1
C0G
390
±1
%
50 V
0.8 ± 0.1
mm
W:
0.8 ± 0.1 mm
Ni
Cu
Sn 100%
Normal
Reserved for future use
Cardboard Type, 7" reel
Inner electrode
Termination
Plating
Product
mm
Special
Packaging
(Pb Free)
B. Samsung Reliablility Test and Judgement condition
Capacitance
Q
Insulation
Resistance
Appearance
Withstanding
Voltage
Temperature
Characterisitcs
Adhesive Strength
of Termination
Bending Strength
Solderability
Performance
Within specified tolerance
1000 min
10,000Mohm or 500Mohm⋅㎌
Whichever is Smaller
No abnormal exterior appearance
No dielectric breakdown or
mechanical breakdown
C0G
(From -55℃ to 125℃, Capacitance change shoud be within ±30PPM/℃)
No peeling shall be occur on the
500g⋅F, for 10±1 sec.
terminal electrode
Capacitance change :
Bending to the limit (1mm)
with 1.0mm/sec.
within ±5% or ±0.5㎊ whichever is larger
More than 95% of terminal surface
1) Sn63Pb37 solder
is to be soldered newly
235±5℃, 5±0.5sec.
2) SnAg3.0Cu0.5 solder
245±5℃, 3±0.3sec.
(preheating : 80~120℃ for 10~30sec.)
Resistance to
Soldering heat
Capacitance change :
within ±2.5% or ±0.25㎊ whichever is larger
Tan
δ,
IR : initial spec.
Solder pot : 270±5℃, 10±1sec.
1㎒±10%
Rated Voltage
Test condition
0.5~5Vrms
60~120 sec.
Microscope (×10)
300% of the rated voltage

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