AS7C251MPFS18A datasheet, PDF - EEWORLD Datasheet

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AS7C251MPFS18A: Description2.5V 1M x 18 pipelined burst synchronous SRAM; File Size492KB，19 Pages; ManufacturerALSC [Alliance Semiconductor Corporation]

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AS7C251MPFS18A Overview

2.5V 1M x 18 pipelined burst synchronous SRAM

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December 2004

AS7C251MPFS18A

2.5V 1M x 18 pipelined burst synchronous SRAM

Features

•

Organization: 1,048,576 x18 bits

Fast clock speeds to 166 MHz

Fast clock to data access: 3.5/3.8 ns

Fast OE access time: 3.5/3.8 ns

Fully synchronous register-to-register operation

Single-cycle deselect

Asynchronous output enable control

Available 100-pin TQFP package

•

Individual byte write and global write

Multiple chip enables for easy expansion

2.5V core power supply

Linear or interleaved burst control

Snooze mode for reduced power-standby

Common data inputs and data outputs

Logic block diagram

LBO

CLK

ADV

ADSC

ADSP

A[19:0]

CLK

CLR

Burst logic

Address

18 20

Memory

array

CLK

GWE

BWE

CE0

CE1

CE2

DQb

CLK

DQa

Byte Write

registers

Byte Write

registers

CLK

Enable

Output

registers

CLK

Input

registers

CLK

Power

down

Enable

delay

CLK

DQ[a,b]

Selection guide

-166

Minimum cycle time

Maximum clock frequency

Maximum clock access time

Maximum operating current

Maximum standby current

Maximum CMOS standby current (DC)

166

3.5

290

-133

7.5

133

3.8

270

Units

MHz

12/23/04, v. 2.2

Alliance Semiconductor

1 of 19

AS7C251MPFS18A Related Products

	AS7C251MPFS18A	AS7C251MPFS18A-133TQC	AS7C251MPFS18A-166TQCN	AS7C251MPFS18A-133TQCN	AS7C251MPFS18A-133TQIN	AS7C251MPFS18A-166TQC	AS7C251MPFS18A-166TQIN
Description	2.5V 1M x 18 pipelined burst synchronous SRAM	2.5V 1M x 18 pipelined burst synchronous SRAM	2.5V 1M x 18 pipelined burst synchronous SRAM	2.5V 1M x 18 pipelined burst synchronous SRAM	2.5V 1M x 18 pipelined burst synchronous SRAM	2.5V 1M x 18 pipelined burst synchronous SRAM	2.5V 1M x 18 pipelined burst synchronous SRAM
Is it Rohs certified?	-	incompatible	conform to	conform to	conform to	incompatible	conform to
Maker	-	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]
Parts packaging code	-	QFP	QFP	QFP	QFP	QFP	QFP
package instruction	-	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87
Contacts	-	100	100	100	100	100	100
Reach Compliance Code	-	unknow	unknow	unknow	unknow	unknow	unknow
ECCN code	-	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Maximum access time	-	3.8 ns	3.5 ns	3.8 ns	3.8 ns	3.5 ns	3.5 ns
Other features	-	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE
Maximum clock frequency (fCLK)	-	133 MHz	166 MHz	133 MHz	133 MHz	166 MHz	166 MHz
I/O type	-	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	-	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100
JESD-609 code	-	e0	e3	e3	e3	e0	e3
length	-	20 mm	20 mm	20 mm	20 mm	20 mm	20 mm
memory density	-	18874368 bi	18874368 bi	18874368 bi	18874368 bi	18874368 bi	18874368 bi
Memory IC Type	-	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	-	18	18	18	18	18	18
Number of functions	-	1	1	1	1	1	1
Number of terminals	-	100	100	100	100	100	100
word count	-	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words
character code	-	1000000	1000000	1000000	1000000	1000000	1000000
Operating mode	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	-	70 °C	70 °C	70 °C	85 °C	70 °C	85 °C
organize	-	1MX18	1MX18	1MX18	1MX18	1MX18	1MX18
Output characteristics	-	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	LQFP	LQFP	LQFP	LQFP	LQFP	LQFP
Encapsulate equivalent code	-	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87
Package shape	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	-	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE
Parallel/Serial	-	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	-	NOT SPECIFIED	245	245	245	NOT SPECIFIED	245
power supply	-	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
Certification status	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	-	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm
Maximum standby current	-	0.04 A	0.04 A	0.04 A	0.04 A	0.04 A	0.04 A
Minimum standby current	-	2.38 V	2.38 V	2.38 V	2.38 V	2.38 V	2.38 V
Maximum slew rate	-	0.27 mA	0.29 mA	0.27 mA	0.27 mA	0.29 mA	0.29 mA
Maximum supply voltage (Vsup)	-	2.625 V	2.625 V	2.625 V	2.625 V	2.625 V	2.625 V
Minimum supply voltage (Vsup)	-	2.375 V	2.375 V	2.375 V	2.375 V	2.375 V	2.375 V
Nominal supply voltage (Vsup)	-	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
surface mount	-	YES	YES	YES	YES	YES	YES
technology	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	-	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL
Terminal surface	-	Tin/Lead (Sn/Pb)	MATTE TIN	MATTE TIN	MATTE TIN	Tin/Lead (Sn/Pb)	MATTE TIN
Terminal form	-	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	-	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm
Terminal location	-	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	-	NOT SPECIFIED	30	30	30	NOT SPECIFIED	30
width	-	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm

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