AS7C251MPFS32A-200TQIN datasheet, PDF

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AS7C251MPFS32A-200TQIN: Description2.5V 1M x 32/36 pipelined burst synchronous SRAM; Categorystorage storage; File Size509KB，19 Pages; ManufacturerALSC [Alliance Semiconductor Corporation]; Environmental Compliance

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AS7C251MPFS32A-200TQIN Overview

2.5V 1M x 32/36 pipelined burst synchronous SRAM

AS7C251MPFS32A-200TQIN Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	ALSC [Alliance Semiconductor Corporation]
Parts packaging code	QFP
package instruction	LQFP, QFP100,.63X.87
Contacts	100
Reach Compliance Code	unknow
ECCN code	3A991.B.2.A
Maximum access time	3.1 ns
Other features	PIPELINED ARCHITECTURE
Maximum clock frequency (fCLK)	200 MHz
I/O type	COMMON
JESD-30 code	R-PQFP-G100
JESD-609 code	e3
length	20 mm
memory density	33554432 bi
Memory IC Type	STANDARD SRAM
memory width	32
Number of functions	1
Number of terminals	100
word count	1048576 words
character code	1000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	1MX32
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	LQFP
Encapsulate equivalent code	QFP100,.63X.87
Package shape	RECTANGULAR
Package form	FLATPACK, LOW PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	245
power supply	2.5 V
Certification status	Not Qualified
Maximum seat height	1.6 mm
Maximum standby current	0.06 A
Minimum standby current	2.38 V
Maximum slew rate	0.4 mA
Maximum supply voltage (Vsup)	2.625 V
Minimum supply voltage (Vsup)	2.375 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	MATTE TIN
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	30
width	14 mm

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February 2005

AS7C251MPFS32A

AS7C251MPFS36A

2.5V 1M

32/36 pipelined burst synchronous SRAM

Features

•

Organization: 1,048,576 words × 32 or 36 bits

Fast clock speeds to 200 MHz

Fast clock to data access: 3.1/3.5/3.8 ns

Fast OE access time: 3.1/3.5/3.8 ns

Fully synchronous register-to-register operation

Single-cycle deselect

Asynchronous output enable control

Available in 100-pin TQFP package

•

Individual byte write and global write

Multiple chip enables for easy expansion

2.5V core power supply

Linear or interleaved burst control

Snooze mode for reduced power-standby

Common data inputs and data outputs

Logic block diagram

LBO

CLK

ADV

ADSC

ADSP

A[19:0]

CLK

CLR

Burst logic

Address

CLK

Byte write

registers

CLK

Byte write

registers

CLK

Byte write

registers

CLK

Byte write

registers

CLK

Enable

CLK

1M × 32/36

Memory

array

32/36

GWE

BWE

CE0

CE1

CE2

Output

registers

CLK

Input

registers

CLK

Power

down

Enable

delay

CLK

32/36

DQ[a:d]

Selection guide

Minimum cycle time

Maximum clock frequency

Maximum clock access time

Maximum operating current

Maximum standby current

Maximum CMOS standby current (DC)

-200

200

3.1

450

170

-166

166

3.5

400

150

-133

7.5

133

3.8

350

140

Units

MHz

2/14/05, v.1.3

Alliance Semiconductor

1 of 19

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Description	2.5V 1M x 32/36 pipelined burst synchronous SRAM	2.5V 1M x 32/36 pipelined burst synchronous SRAM	2.5V 1M x 32/36 pipelined burst synchronous SRAM	2.5V 1M x 32/36 pipelined burst synchronous SRAM	2.5V 1M x 32/36 pipelined burst synchronous SRAM	2.5V 1M x 32/36 pipelined burst synchronous SRAM	2.5V 1M x 32/36 pipelined burst synchronous SRAM	2.5V 1M x 32/36 pipelined burst synchronous SRAM	2.5V 1M x 32/36 pipelined burst synchronous SRAM
Is it Rohs certified?	conform to	-	incompatible	incompatible	conform to	conform to	-	conform to	incompatible
Maker	ALSC [Alliance Semiconductor Corporation]	-	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	-	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]
Parts packaging code	QFP	-	QFP	QFP	QFP	QFP	-	QFP	QFP
package instruction	LQFP, QFP100,.63X.87	-	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87	-	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87
Contacts	100	-	100	100	100	100	-	100	100
Reach Compliance Code	unknow	-	unknow	unknow	unknow	unknow	-	unknow	unknow
ECCN code	3A991.B.2.A	-	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	-	3A991.B.2.A	3A991.B.2.A
Maximum access time	3.1 ns	-	3.8 ns	3.8 ns	3.8 ns	3.8 ns	-	3.8 ns	3.8 ns
Other features	PIPELINED ARCHITECTURE	-	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	-	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE
Maximum clock frequency (fCLK)	200 MHz	-	133 MHz	133 MHz	133 MHz	133 MHz	-	133 MHz	133 MHz
I/O type	COMMON	-	COMMON	COMMON	COMMON	COMMON	-	COMMON	COMMON
JESD-30 code	R-PQFP-G100	-	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	-	R-PQFP-G100	R-PQFP-G100
JESD-609 code	e3	-	e0	e0	e3	e3	-	e3	e0
length	20 mm	-	20 mm	20 mm	20 mm	20 mm	-	20 mm	20 mm
memory density	33554432 bi	-	33554432 bi	33554432 bi	33554432 bi	33554432 bi	-	37748736 bi	37748736 bi
Memory IC Type	STANDARD SRAM	-	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	-	STANDARD SRAM	STANDARD SRAM
memory width	32	-	32	32	32	32	-	36	36
Number of functions	1	-	1	1	1	1	-	1	1
Number of terminals	100	-	100	100	100	100	-	100	100
word count	1048576 words	-	1048576 words	1048576 words	1048576 words	1048576 words	-	1048576 words	1048576 words
character code	1000000	-	1000000	1000000	1000000	1000000	-	1000000	1000000
Operating mode	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	-	70 °C	85 °C	70 °C	85 °C	-	70 °C	85 °C
organize	1MX32	-	1MX32	1MX32	1MX32	1MX32	-	1MX36	1MX36
Output characteristics	3-STATE	-	3-STATE	3-STATE	3-STATE	3-STATE	-	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LQFP	-	LQFP	LQFP	LQFP	LQFP	-	LQFP	LQFP
Encapsulate equivalent code	QFP100,.63X.87	-	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87	-	QFP100,.63X.87	QFP100,.63X.87
Package shape	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR
Package form	FLATPACK, LOW PROFILE	-	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	-	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE
Parallel/Serial	PARALLEL	-	PARALLEL	PARALLEL	PARALLEL	PARALLEL	-	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	245	-	NOT SPECIFIED	NOT SPECIFIED	245	245	-	245	NOT SPECIFIED
power supply	2.5 V	-	2.5 V	2.5 V	2.5 V	2.5 V	-	2.5 V	2.5 V
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified
Maximum seat height	1.6 mm	-	1.6 mm	1.6 mm	1.6 mm	1.6 mm	-	1.6 mm	1.6 mm
Maximum standby current	0.06 A	-	0.06 A	0.06 A	0.06 A	0.06 A	-	0.06 A	0.06 A
Minimum standby current	2.38 V	-	2.38 V	2.38 V	2.38 V	2.38 V	-	2.38 V	2.38 V
Maximum slew rate	0.4 mA	-	0.325 mA	0.325 mA	0.325 mA	0.325 mA	-	0.325 mA	0.325 mA
Maximum supply voltage (Vsup)	2.625 V	-	2.625 V	2.625 V	2.625 V	2.625 V	-	2.625 V	2.625 V
Minimum supply voltage (Vsup)	2.375 V	-	2.375 V	2.375 V	2.375 V	2.375 V	-	2.375 V	2.375 V
Nominal supply voltage (Vsup)	2.5 V	-	2.5 V	2.5 V	2.5 V	2.5 V	-	2.5 V	2.5 V
surface mount	YES	-	YES	YES	YES	YES	-	YES	YES
technology	CMOS	-	CMOS	CMOS	CMOS	CMOS	-	CMOS	CMOS
Temperature level	INDUSTRIAL	-	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	-	COMMERCIAL	INDUSTRIAL
Terminal surface	MATTE TIN	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	MATTE TIN	MATTE TIN	-	MATTE TIN	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	-	GULL WING	GULL WING	GULL WING	GULL WING	-	GULL WING	GULL WING
Terminal pitch	0.65 mm	-	0.65 mm	0.65 mm	0.65 mm	0.65 mm	-	0.65 mm	0.65 mm
Terminal location	QUAD	-	QUAD	QUAD	QUAD	QUAD	-	QUAD	QUAD
Maximum time at peak reflow temperature	30	-	NOT SPECIFIED	NOT SPECIFIED	30	30	-	30	NOT SPECIFIED
width	14 mm	-	14 mm	14 mm	14 mm	14 mm	-	14 mm	14 mm

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