Surface mount capacitors
1.1 to 1.3
1.1 - Production process flowchart
Ceramic powder
preparation
Electrode ink
material
1.2 - Syfer reliability grades
High reliability
(space quality)
Space
Grade
ESCC 3009
(1)
MIL Grade
(2)
IECQ-CECC
(3)
AEC-Q200
(4)
Standard components
Multilayer build
(wet process)
Fire
Standard
reliability
Rumble
Notes:
(1) Space grade tested in accordance with ESCC 3009. Refer to Syfer
specification S02A 0100.
Internal inspection
(2) MIL Grade. Released in accordance with US standards available on
request.
(3) IECQ-CECC. The International Electrotechnical Commission (IEC)
Quality Assessment System for Electronic Components. This is an
internationally recognised product quality certification which
provides customers with assurance that the product supplied
meets high quality standards.
View Syfer’s IECQ-CECC approvals at http://www.iecq.org or at
www.syfer.com
Termination
(if specified)
Plating
(4) AEC-Q200. Automotive Electronics Council Stress Test Qualification
For Passive Components. Refer to Syfer application note reference
AN0009.
Printing
(if specified)
1.3 - Syfer reliability surface mount product
groups
Electrical test
Tandem
FlexiCap
TM
capacitors
(1)
Open Mode
FlexiCap
TM
capacitors
(2)
Standard FlexiCap
TM
capacitors
(3)
Standard MLC capacitor
(4)
High reliability
Test verification
Additional sample
Rel tests
(if specified)
Standard
reliability
Notes:
QC inspection
Additional Hi Rel
activities
(S02A & S05
100% burn-in, QC insp)
(1) “Tandem” construction capacitors, ie internally having the
equivalent of 2 series capacitors. If one of these should fail
short-circuit, there is still capacitance end to end and the chip will
still function as a capacitor, although capacitance maybe affected.
Refer to application note AN0021. Also available qualified to
AEC-Q200.
(2) “Open Mode” capacitors with FlexiCap
TM
termination also reduce
the possibility of a short circuit by utilising inset electrode margins.
Refer to application note AN0022. Also available qualified to
AEC-Q200.
(3) Multilayer capacitors with Syfer FlexiCap
TM
termination. By using
FlexiCap
TM
termination, there is a reduced possibility of the
mechanical cracking occurring.
(4) “Standard” capacitors includes MLCCs with tin finish over nickel,
but no FlexiCap
TM
.
Packaging
4
Finished goods store
1.4
Surface mount capacitors
1.4 - FlexiCap™ termination
MLCCs are widely used in electronic circuit design for a
multitude of applications. Their small package size, technical
performance and suitability for automated assembly makes
them the component of choice for the specifier.
However, despite the technical benefits, ceramic components
are brittle and need careful handling on the production floor.
In some circumstances they may be prone to mechanical
stress damage if not used in an appropriate manner. Board
flexing, depanelisation, mounting through hole components,
poor storage and automatic testing may all result in cracking.
Careful process control is important at all stages of circuit
board assembly and transportation - from component
placement to test and packaging. Any significant board flexing
may result in stress fractures in ceramic devices that may
not always be evident during the board assembly process.
Sometimes it may be the end customer who finds out - when
equipment fails!
Syfer has delivered millions of FlexiCap
TM
components and
during that time has collected substantial test and reliability
data, working in partnership with customers world wide, to
eliminate mechanical cracking.
An additional benefit of FlexiCap™ is that MLCCs can
withstand temperature cycling -55ºC to 125ºC in excess of
1,000 times without cracking.
●
Picture taken at
1,000x magnification
using a SEM
to demonstrate the
fibrous nature of the
FlexiCap
TM
termination
that absorbs increased
levels of mechanical
stress.
Syfer has the solution -
FlexiCap™
FlexiCap
TM
has been developed as a result of listening to
customers’ experiences of stress damage to MLCCs from
many manufacturers, often caused by variations in production
processes.
Our answer is a proprietary flexible epoxy polymer termination
material, that is applied to the device under the usual nickel
barrier finish. FlexiCap
TM
will accommodate a greater degree
of board bending than conventional capacitors.
Available on the following ranges:
●
All High Reliability ranges
●
Standard and High Voltage chips
●
Surge Protection and Safety capacitor chips
●
3 terminal EMI chips
●
X2Y Integrated Passive Components
●
X8R High Temperature capacitors
Syfer FlexiCap™ termination
All ranges are available with FlexiCap™ termination material
offering increased reliability and superior mechanical
performance (board flex and temperature cycling) when
compared with standard termination materials. Refer to Syfer
application note reference AN0001. FlexiCap™ capacitors
enable the board to be bent almost twice as much before
mechanical cracking occurs. Refer to application note AN0002.
FlexiCap™ is also suitable for Space applications having
passed thermal vacuum outgassing tests. Refer to Syfer
application note reference AN0026.
Fired ceramic
dielectric
Summary of PCB bend test results
The bend tests conducted on X7R have proven that
the FlexiCap
TM
termination withstands a greater level of
mechanical stress before mechanical cracking occurs.
The AEC-Q200 test for X7R requires a bend level of 2mm
minimum and a cap change of less than 10%.
Product
X7R
Standard termination
FlexiCap™
Typical bend performance under
AEC-Q200 test conditions
2mm to 3mm
Typically 8mm to 10mm
Application notes
FlexiCap
TM
may be handled, stored and transported in
the same manner as standard terminated capacitors. The
requirements for mounting and soldering FlexiCap
TM
are the
same as for standard SMD capacitors.
Tin outer
layer
FlexiCap
TM
termination
base
Metal
electrodes
Intermediate
nickel layer
TM
For customers currently using standard terminated capacitors
there should be no requirement to change the assembly
process when converting to FlexiCap
TM
.
Based upon board bend tests in accordance with IEC 60384-1
the amount of board bending required to mechanically crack
a FlexiCap
TM
terminated capacitor is significantly increased
compared with standard terminated capacitors.
It must be stressed however, that capacitor users must not
assume that the use of FlexiCap
TM
terminated capacitors will
totally eliminate mechanical cracking. Good process controls
are still required for this objective to be achieved.
FlexiCap MLCC cross section
FlexiCap™ benefits
With traditional termination materials and assembly, the chain
of materials from bare PCB to soldered termination, provides
no flexibility. In circumstances where excessive stress is
applied - the weakest link fails. This means the ceramic itself,
which may fail short circuit.
The benefit to the user is to facilitate a wider process window
- giving a greater safety margin and substantially reducing the
typical root causes of mechanical stress cracking.
FlexiCap
TM
may be soldered using your traditional wave
or reflow solder techniques and needs no adjustment to
equipment or current processes.
5
Surface mount capacitors
1.5 to 1.7
1.5 - Tests conducted during
batch manufacture
Solderability
Resistance to soldering heat
Plating thickness verification (if plated)
Destructive Physical Analysis (DPA)
Voltage proof test (DWV / Flash)
Insulation Resistance
Capacitance test
Dissipation Factor test
100% visual inspection
100% burn-in
(2)
. (2xRV @125ºC for 100 hours)
100% burn-in
(2)
. (2xRV @125ºC for 168 hours)
Load sample test @ 125ºC. (Life at elevated
temperature test).
Humidity sample test. 85ºC/85%RH
Hot IR sample test
Axial pull sample test (MIL-STD-123)
Breakdown voltage sample test
Deflection (bend) sample test
SAM (Scanning Acoustic Microscopy)
LAT1 (4 x adhesion, 8 x rapid temp change + LAT2 and
LAT3)
LAT2 (20 x 1000 hour life test + LAT3)
LAT3 (6 x TC and 4 x solderability)
●
Test conducted as standard.
m
Optional test. Please discuss with Syfer Sales.
Syfer reliability SM product group
Standard
SM
capacitors
●
●
●
●
●
●
●
●
m
m
m
m
m
m
m
m
m
m
-
-
-
IECQ-CECC
●
●
●
●
●
●
●
●
m
m
m
m
m
m
m
m
m
m
-
-
-
AEC-Q200
●
●
●
●
●
●
●
●
●
m
m
m
m
m
m
m
m
m
-
-
-
MIL - PRF
55681
(1)
●
●
●
●
●
●
●
●
m
●
-
m
m
●
m
m
m
m
-
-
-
S (space grade) High Rel
S05
●
●
●
●
●
●
●
●
●
-
●
m
m
m
m
m
m
m
-
-
-
S02A
●
●
●
●
●
●
●
●
●
-
●
LAT1 & LAT2
(1000 hours)
240 hours
m
m
m
m
m
m
m
m
(3)
Notes:
1) In accordance with MIL-PRF-55681 group A. Additional optional tests available.
2) Burn-in also referred to as Voltage conditioning.
3) In accordance with ESCC 3009.
Multilayer ceramic capacitors typically require sintering temperatures
in excess of 1000ºC, which presents no problems to capacitors that
employ a Precious Metal Electrode (PME) system. However, for Base
Metal Electrode (BME) systems additional processes are required,
including the use of a reducing atmosphere to prevent oxidation of the
electrodes.
Despite the manufacturing problems, BME multilayer ceramic
capacitors have proven to be a good choice for commercial products as
they have reasonable electrical properties and life expectancy and can
be used for some high reliability applications when properly qualified
and screened.
At Syfer Technology we have been developing PME systems for over
thirty years and use them exclusively for all our product lines. It
produces capacitors to the highest reliability that can be used in all
applications including the very demanding space requirements.
A recent Highly Accelerated Life Test (HALT) programme was
undertaken to compare Syfer PME with equivalent BME capacitors.
Capacitors rated at 50 volts were tested at 400 volts and at a
temperature of 180ºC. The programme used three capacitor types
from Syfer and two BME manufacturers.
Median Time to Failure
1.6 - Precious Metal Electrodes Vs. Base
Metal Electrodes
25
20
15
10
5
0
0603 50V 33nF
Syfer PME
0805 50V 100nF
BME1
1206 50V 220nF
BME2
In all cases the Syfer PME parts out-performed the BME capacitors
suggesting that the long term reliability of PME systems is superior to
BME, and PME parts should be regarded as the component of choice
for high reliability applications.
6
1.7 - RoHS compliance
All Syfer surface mount capacitors (excluding Sn/Pb plated)
are compliant with the EU RoHS directive. Breakdown of
materials content is available on request.
1.8 to 1.10
Surface mount capacitors
1.8 - Release documentation
Standard SM
capacitors
Certificate of conformance
IECQ-CECC Release certificate of conformity
Batch electrical test report
S (space grade) data documentation package
●
Release documentation supplied as standard.
m
Original documentation.
●
-
m
-
Syfer reliability SM product group
IECQ-CECC
-
●
m
-
AEC-Q200
MIL grade
●
-
m
-
S (space grade) High Rel
S05
●
-
Included in
data pack
●
S02A
●
-
Included in
data pack
●
1.9 - Technical summary
C0G/NP0
Dielectric characteristics
IECQ-CECC
EIA
MIL
Rated temperature range
Maximum capacitance change over
temperature range
No DC voltage applied
Rated DC voltage applied
Syfer dielectric ordering code
Tangent of loss angle (tan δ)
0 ± 30 ppm/ºC
-
C
Cr > 50pF ≤ 0.0015
Cr ≤ 50pF = 0.0015 (15
+ 0.7)
Cr
± 20%
+20-30%
R
± 15%
-
X
± 15%
+15-25%
B
-55ºC to +125ºC
1B/CG
C0G/NP0
CG(BP)
BZ
-55ºC to +125ºC
Ultra stable
2C1
X7R
Stable
2R1
X7R
BX
2X1
The table above highlights the difference in coding for IECQ-CECC, EIA and MIL standards when defining the temperature coeffiecient and the
voltage coefficient.
1.10 - Periodic tests conducted and
reliability data availability
Standard Surface Mount Capacitors
Components are randomly selected on a sample basis and the
following routine tests are conducted:
●
Load Test. 1000 hours @125ºC. Applied voltage depends
on components tested.
●
Humidity Test. 168 hours @ 85ºC/85%RH.
●
Board Deflection (bend test).
Test results are available on request.
Example of FIT (Failure In Time) data available:
10000
RV
50% of RV
Component type: 0805 (C0G/NP0 and X7R).
Testing location: Syfer reliability test department.
Results based on: 14,942,000 component test hours.
Conversion factors:
From
FITS
To
MTBF (hours)
MTBF (years)
Operation
10
9
÷ FITS
10
9
÷ (FITS x 8760)
10
FIT
25% of RV
10% of RV
0.01
FITS
0.00001
25ºC
50ºC
75ºC
100ºC
125ºC
FITS = Failures in 10
9
hours.
MTBF = Mean time between failures.
7
Surface mount capacitors
1.10
1.10 - Periodic tests conducted for IECQ-CECC and AEC-Q200
Test
ref
Test
Termination
type
D or
ND
Additional requirements
P
Sample
acceptance
n
c
Reference
P1
High
temperature
exposure
(storage)
All types
D
Un-powered. 1000 hours @ T=150ºC.
Measurement at 24 ± 2 hours after test conclusion
12
77
0
MIL-STD-202
Method 108
P2
Temperature
cycling
C0G/NP0: All
types X7R: Y
and H only
D
1000 cycles -55ºC to +125ºC
Measurement at 24 ± 2 hours after test conclusion
T = 24 hours/cycle. Note: Steps 7a and 7b not
required. Un-powered.
Measurement at 24 ± 2 hours after test conclusion
1000 hours 85ºC/85%RH. Rated voltage or 50V
whichever is the least and 1.5V.
Measurement at 24 ± 2 hours after test conclusion
Condition D steady state TA=125ºC at full rated.
Measurement at 24 ± 2 hours after test conclusion
Note: Add aqueous wash chemical.
Do not use banned solvents
12
77
0
JESD22
Method JA-104
P3
Moisture
resistance
Biased
humidity
Operational
life
Resistance
to solvents
All types
D
12
77
0
MIL-STD-202
Method 106
MIL-STD-202
Method 103
MIL-STD-202
Method 108
MIL-STD-202
Method 215
P4
All types
D
12
77
0
P5
All types
D
12
77
0
P6
All types
D
12
5
0
P7
Mechanical
shock
C0G/NP0: All
types X7R: Y
and H only
D
Figure 1 of Method 213. Condition F
12
30
0
MIL-STD-202
Method 213
P8
Vibration
C0G/NP0: All
types X7R: Y
and H only
D
5g for 20 minutes, 12 cycles each of 3 orientations.
Note: Use 8” x 5” PCB 0.031” thick 7 secure points
on one long side and 2 secure points at corners of
opposite sides. Parts mounted within 2” from any
secure point. Test from 10-2000Hz
Condition B, no pre-heat of samples:
Single wave solder - Procedure 2
12
30
0
MIL-STD-202
Method 204
P9
Resistance to
soldering heat
All types
D
3
12
0
MIL-STD-202
Method 210
P10
Thermal shock
C0G/NP0: All
types X7R: Y
and H only
D
-55ºC/+125ºC. Number of cycles 300.
Maximum transfer time - 20 seconds,
Dwell time - 15 minutes. Air-Air
12
30
0
MIL-STD-202
Method 107
P11
Adhesion,
rapid temp
change and
climatic
sequence
X7R: A, F and
J only
D
5N force applied for 10s, -55ºC/ +125ºC for 5 cycles,
damp heat cycles
12
27
0
BS EN132100
Clause 4.8, 4.12
and 4.13
P12
Board flex
P13
Terminal
strength
Beam load
test
Damp heat
steady state
C0G/NP0: All
types X7R: Y
and H only
X7R: A, F and
J only
All types
D
3mm deflection Class I
2mm deflection Class II
12
30
0
AEC-Q200-005
D
1mm deflection.
12
12
0
BS EN132100
Clause 4.9
AEC-Q200-006
P14
D
Force of 1.8kg for 60 seconds
12
30
0
P15
All types
D
-
12
30
0
AEC-Q200-003
P16
All types
D
8
56 days, 40°C/93%RH, 15 x no volts, 15 x 5Vdc,
15 x rated voltage or 50V whichever is the less
12
45
0
BS EN132100
Clause 4.14
Test results are available on request.
NXP MCU
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