EEWORLDEEWORLDEEWORLD

Part Number

Search

1206Y5000150JAB

Description
Ceramic Capacitor, Multilayer, Ceramic, 500V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.000015uF, Surface Mount, 1206, CHIP, ROHS COMPLIANT
CategoryPassive components    capacitor   
File Size562KB,9 Pages
ManufacturerSyfer
Environmental Compliance  
Download Datasheet Parametric View All

1206Y5000150JAB Overview

Ceramic Capacitor, Multilayer, Ceramic, 500V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.000015uF, Surface Mount, 1206, CHIP, ROHS COMPLIANT

1206Y5000150JAB Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerSyfer
package instruction, 1206
Reach Compliance Codecompliant
ECCN codeEAR99
capacitance0.000015 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
high1.6 mm
JESD-609 codee3
length3.2 mm
Manufacturer's serial number1206
Installation featuresSURFACE MOUNT
multi-layerYes
negative tolerance5%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
Package formSMT
method of packingBULK
positive tolerance5%
Rated (DC) voltage (URdc)500 V
GuidelineAEC-Q200
seriesAEC-Q200
size code1206
surface mountYES
Temperature characteristic codeC0G
Temperature Coefficient-/+30ppm/Cel ppm/°C
Terminal surfaceMatte Tin (Sn) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
width1.6 mm
Surface mount capacitors
1.1 to 1.3
1.1 - Production process flowchart
Ceramic powder
preparation
Electrode ink
material
1.2 - Syfer reliability grades
High reliability
(space quality)
Space
Grade
ESCC 3009
(1)
MIL Grade
(2)
IECQ-CECC
(3)
AEC-Q200
(4)
Standard components
Multilayer build
(wet process)
Fire
Standard
reliability
Rumble
Notes:
(1) Space grade tested in accordance with ESCC 3009. Refer to Syfer
specification S02A 0100.
Internal inspection
(2) MIL Grade. Released in accordance with US standards available on
request.
(3) IECQ-CECC. The International Electrotechnical Commission (IEC)
Quality Assessment System for Electronic Components. This is an
internationally recognised product quality certification which
provides customers with assurance that the product supplied
meets high quality standards.
View Syfer’s IECQ-CECC approvals at http://www.iecq.org or at
www.syfer.com
Termination
(if specified)
Plating
(4) AEC-Q200. Automotive Electronics Council Stress Test Qualification
For Passive Components. Refer to Syfer application note reference
AN0009.
Printing
(if specified)
1.3 - Syfer reliability surface mount product
groups
Electrical test
Tandem
FlexiCap
TM
capacitors
(1)
Open Mode
FlexiCap
TM
capacitors
(2)
Standard FlexiCap
TM
capacitors
(3)
Standard MLC capacitor
(4)
High reliability
Test verification
Additional sample
Rel tests
(if specified)
Standard
reliability
Notes:
QC inspection
Additional Hi Rel
activities
(S02A & S05
100% burn-in, QC insp)
(1) “Tandem” construction capacitors, ie internally having the
equivalent of 2 series capacitors. If one of these should fail
short-circuit, there is still capacitance end to end and the chip will
still function as a capacitor, although capacitance maybe affected.
Refer to application note AN0021. Also available qualified to
AEC-Q200.
(2) “Open Mode” capacitors with FlexiCap
TM
termination also reduce
the possibility of a short circuit by utilising inset electrode margins.
Refer to application note AN0022. Also available qualified to
AEC-Q200.
(3) Multilayer capacitors with Syfer FlexiCap
TM
termination. By using
FlexiCap
TM
termination, there is a reduced possibility of the
mechanical cracking occurring.
(4) “Standard” capacitors includes MLCCs with tin finish over nickel,
but no FlexiCap
TM
.
Packaging
4
Finished goods store
Uboot cannot be transplanted into the development board, I don't know what the problem is
Uboot cannot be transplanted into the development board (OMAP core). I wonder if there is a problem with JTAG? Here are the error details: Error connecting to the target: Error 0x80000240/-180 Fatal E...
kof2ooo Embedded System
【MXCHIP Open1081】WiFi——Summary of problems encountered during compilation
[i=s]This post was last edited by 770781327 on 2014-12-5 16:20[/i] [font=Tahoma][color=#000000]1[/color][/font] [font=Tahoma][color=#000000]Demo1_WiFi_Link[/color][/font] [font=Tahoma][color=#000000][...
770781327 RF/Wirelessly
Commissioned to develop industrial robot control system, if interested, please reply QQ79500116
Commissioned to develop industrial robot control system, if interested, please reply QQ79500116...
fjj252630 Robotics Development
M430 FLASH seg-A seg-B read and write problem
After writing characters to FLASH, sometimes errors occur when reading them out. Most of the time, they are normal. I don't know much about FLASH, but occasional abnormalities can cause information er...
ivan1022 Microcontroller MCU
Single chip microcomputer controls GSM module
I am currently experimenting with a microcontroller controlling a GSM module. First, I connected the microcontroller to the GSM module via a serial port. Does anyone know what data the microcontroller...
lilong8470 RF/Wirelessly
wince usb disk? FAT32?
Dear moderator and experts, I have been following this forum! Now I want to ask a question? My wince5.0 system can recognize the USB flash drive, but if it is a FAT32 USB flash drive, it takes 1 and a...
jiaoxianyao Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 505  612  2728  927  363  11  13  55  19  8 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号