5962-01-052-9506 datasheet, PDF

5962-01-052-9506: DescriptionIC,ROM,256X4,TTL,DIP,16PIN,CERAMIC; Categorystorage storage; File Size491KB，8 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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5962-01-052-9506 Overview

IC,ROM,256X4,TTL,DIP,16PIN,CERAMIC

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
package instruction	DIP, DIP16,.3
Reach Compliance Code	not_compliant
Maximum access time	60 ns
JESD-30 code	R-XDIP-T16
memory density	1024 bit
Memory IC Type	MASK ROM
memory width	4
Number of terminals	16
word count	256 words
character code	256
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256X4
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum slew rate	0.13 mA
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	TTL
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED

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