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5962-01-266-0869

Description
IC,PROM,2KX4,TTL,DIP,18PIN,CERAMIC
Categorystorage    storage   
File Size1MB,24 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Stay tuned Parametric

5962-01-266-0869 Overview

IC,PROM,2KX4,TTL,DIP,18PIN,CERAMIC

5962-01-266-0869 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerTexas Instruments
package instructionDIP, DIP18,.3
Reach Compliance Codenot_compliant
Maximum access time85 ns
JESD-30 codeR-XDIP-T18
memory density8192 bit
Memory IC TypeOTP ROM
memory width4
Number of terminals18
word count2048 words
character code2000
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize2KX4
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP18,.3
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Filter level38535Q/M;38534H;883B
Maximum slew rate0.175 mA
surface mountNO
technologyTTL
Temperature levelMILITARY
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
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