IC,EPROM,8KX8,MOS,DIP,28PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| package instruction | DIP, DIP28,.6 |
| Reach Compliance Code | not_compliant |
| Maximum access time | 350 ns |
| I/O type | COMMON |
| JESD-30 code | R-XDIP-T28 |
| memory density | 65536 bit |
| memory width | 8 |
| Number of terminals | 28 |
| word count | 8192 words |
| character code | 8000 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 8KX8 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP28,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Programming voltage | 21 V |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | MOS |
| Temperature level | COMMERCIAL |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| TMS2764-35JL | TMS2764-20JL | TMS27P64-25NL | TMS27P64-30NL | TMS2764-17JL | TMS2764-25JL | TMS2764-45JL | TMS27P64-45NL | |
|---|---|---|---|---|---|---|---|---|
| Description | IC,EPROM,8KX8,MOS,DIP,28PIN,CERAMIC | 8KX8 UVPROM, 200ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | 8KX8 OTPROM, 250ns, PDIP28 | 8KX8 OTPROM, 300ns, PDIP28 | 8KX8 UVPROM, 170ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | 8KX8 UVPROM, 250ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | 8KX8 UVPROM, 450ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | 8KX8 OTPROM, 450ns, PDIP28 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP28,.6 | WDIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | WDIP, DIP28,.6 | WDIP, DIP28,.6 | WDIP, DIP28,.6 | DIP, DIP28,.6 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | _compli |
| Maximum access time | 350 ns | 200 ns | 250 ns | 300 ns | 170 ns | 250 ns | 450 ns | 450 ns |
| I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | R-XDIP-T28 | R-CDIP-T28 | R-PDIP-T28 | R-PDIP-T28 | R-CDIP-T28 | R-CDIP-T28 | R-CDIP-T28 | R-PDIP-T28 |
| memory density | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bi |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of terminals | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| word count | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words |
| character code | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY |
| encapsulated code | DIP | WDIP | DIP | DIP | WDIP | WDIP | WDIP | DIP |
| Encapsulate equivalent code | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE, WINDOW | IN-LINE | IN-LINE | IN-LINE, WINDOW | IN-LINE, WINDOW | IN-LINE, WINDOW | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Programming voltage | 21 V | 21 V | 21 V | 21 V | 21 V | 21 V | 21 V | 21 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO | NO | NO | NO |
| technology | MOS | NMOS | NMOS | NMOS | NMOS | NMOS | NMOS | NMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maker | Texas Instruments | Texas Instruments | - | - | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| ECCN code | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| length | - | 36.83 mm | 36.32 mm | 36.32 mm | 36.83 mm | 36.83 mm | 36.83 mm | 36.32 mm |
| Memory IC Type | - | UVPROM | OTP ROM | OTP ROM | UVPROM | UVPROM | UVPROM | OTP ROM |
| Number of functions | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Operating mode | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Parallel/Serial | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Maximum seat height | - | 4.907 mm | 5.08 mm | 5.08 mm | 4.907 mm | 4.907 mm | 4.907 mm | 5.08 mm |
| Maximum supply voltage (Vsup) | - | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| Minimum supply voltage (Vsup) | - | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| Maximum time at peak reflow temperature | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | - | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm |
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