EEWORLDEEWORLDEEWORLD

Part Number

Search

CHP1-502371FBLKLF

Description
Fixed Resistor, Metal Glaze/thick Film, 1W, 2370ohm, 350V, 1% +/-Tol, 50ppm/Cel, Surface Mount, 2512, ROHS COMPLIANT
CategoryPassive components    The resistor   
File Size382KB,3 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Environmental Compliance  
Download Datasheet Parametric View All

CHP1-502371FBLKLF Overview

Fixed Resistor, Metal Glaze/thick Film, 1W, 2370ohm, 350V, 1% +/-Tol, 50ppm/Cel, Surface Mount, 2512, ROHS COMPLIANT

CHP1-502371FBLKLF Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerTT Electronics plc
package instructionMELF, 2512
Reach Compliance Codecompliant
ECCN codeEAR99
structureCylindrical
JESD-609 codee1
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package diameter2.01 mm
Package length6.38 mm
Package shapeCYLINDRICAL PACKAGE
Package formMELF
method of packingBULK
Rated power dissipation(P)1 W
Rated temperature70 °C
resistance2370 Ω
Resistor typeFIXED RESISTOR
seriesCHP
size code2512
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient50 ppm/°C
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu) - hot dipped
Terminal shapeWRAPAROUND
Tolerance1%
Operating Voltage350 V
Cylindrical High Power
Surface Mount Metal Glaze™
CHP Series
·
Cylindrical High Power
Up to 2 watts
·
Surface Mount Metal Glaze
TM
Up to 1000 volts
·
0.2 ohm to 2.2 megohm range
·
Up to 2 watts
RoHS-compliant version available
·
Up to 1000 volts
150°C maximum operating temperature
0.2 ohm to 2.2 megohm range
RoHS-compliant version available
150°C maximum operating temperature
CHP
Metal Glaze™
thick fi lm element
fi red at 1000°C
to solid ceramic
Metal Glaze
TM
thick film element
fired at 1000°C
to solid ceramic
Solder over
nickel barrier
Solder over
nickel barrier
High
temperature
dielectric
coating
High
temperature
dielectric
coating
Electrical Data
IRC
Type
Indus-
try
Foot-
print
1206
Size
Code1
Maximum
Power Rating
Working
Voltage²
Maximum
Voltage
Resistance
Range (ohms)³
0.1 to 0.99
CHP 1/8
B&C
1/4W @ 70°C
200
400
1.0 to 1.0 M
20 to 348K
CHP 1/2
2010
D&E
1/2W @ 70°C
300
600
0.1 to 0.99
1.0 to 348K
0.1 to 0.99
CHP 1
2512
F
1W @ 70°C
350
700
1.0 to 2.21M
20 to 348K
CHP 2
3610
H
2W @ 25°C
1.33W @ 70°C
500
1000
0.2 to 0.99
1.0 to 2.21M
²Not to exceed
P x R
Product
Category
Low Range
Standard
Tight Tolerance
Low Range
Standard
Low Range
Standard
Tight Tolerance
Low Range
Standard
Tolerance
(±%)³
1, 2, 5
1, 2, 5
0.25, 0.5
1, 2, 5
1, 2, 5
1, 2, 5
1, 2, 5
0.25, 0.5
1, 2, 5
1, 2, 5
TCR
(ppm/°C)³
100
50, 100
50, 100
100
50, 100
100
50, 100
50, 100
100
50, 100
¹See pages 2 & 3 for product dimensions, recommended solder pads, and standard packaging.
³Consult factory for tighter TCR, tolerance, or resistance values.
Environmental Data
Characteristics
teristics
Charac
Thermal Shock
Temperature Coefficient
Thermal Shock
Low Temperature Operation
Maximum
m Change
Maximu
Change
±0.25% +.01 Ω
As specified
±0.5% + 0.01 ohm
±0.25% +.01 Ω
±0.25% + 0.01 ohm
±0.5% +.01 Ω
Test Method
MIL-PRF-55342H, §4.8.3
Test Method
MIL-R-55342H Par 3.16 (-55°C +
+150°C / -65°C)
(MIL-STD-202, Method 107G:
125°C)
MIL-PRF-55342H, §4.8.5
MIL-R-55342H Par 3.9 (-65°C + 150°C, 5 cycles)
(-65°C)
MIL-R-55342H Par 3.11 (-65°C @ working voltage)
MIL-R-55342H Par 3.12
2.5 x
P x R
for 5 seconds
MIL-PRF-55342H, §4.8.7
MIL-R-55342H Par 3.13 (-150°C for 100 hours)
MIL-R-55342H Par 3.14.2 (
Reflow soldered to board at 260°C for 10 seconds
)
MIL-PRF-55342H, §4.8.8.2
Short Time Overload
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding
Exposure
±1%
+ 0.01 ohm
±0.5%
for R>100KΩ
±1% for R>100K ohm
±0.5% + 0.01 ohm
±0.25% + 0.01 ohm
MIL-PRF-55342H, §4.8.6
(150°C x 100 Hours)
Resistance to Bonding Exposure
Moisture Resistance
Solderability
High Temperature Exposure
±0.5% +.01 Ω
±0.25% +.01 Ω
±0.5% +.01 Ω
As specified
MIL-PRF-55342H, §4.8.8.2
95% minimum coverage
±0.5% + 0.01 ohm
Temperature Coefficient
Life Test
Resistance
Moisture
Life Test
Solderability
Terminal Adhesion Strength
MIL-PRF-55342H, §4.8.10
(MIL-STD-202, Method 304)
MIL-R-55342H Par 3.18 (10 cycles, total 240 hours)
MIL-R-55342H Par 3.15 (2000 hours at 70°C intermittent)
(MIL-STD-202, Method 108A: 2000 Hours @ 70°C)
1200 gram push from underside of mounted chip for 60 seconds
(MIL-STD-202, Method 208H)
MIL-STD-202, Method 208 (245°C for 5 seconds)
(MIL-STD-202, Method 106G)
±1%
+ 0.01
±0.5%
+.01 Ω
ohm
±1% +
minimum coverage
95%
0.01 ohm
no mechanical damage
MIL-PRF-55342H, §4.8.11
MIL-PRF-55342H, §4.8.12
±1% +.01 Ω
IRC – defined
Chip mounted in center of 90mm long board, deflected 1mm so as to
Terminal Adhesion Strength (push)
±1% + 0.01 ohm
(no mechanical damage)
exert pull on chip contacts for 5 seconds
1200 gram push from underside of mounted device for 60 sec
no mechanical damage
IRC-defined
±1% +.01 Ω
General Note
Device mounted in center of 90mm long board, deflected 1 mm to exert
Terminal Adhesion Strength (flex)
cation without notice or liability.
IRC reserves the right to make changes in product specifi
(no mechanical damage)
All information is subject to IRC’s own data and is considered accurate at time of going to print.
pull on contacts for 5 seconds
A subsidiary of
© IRC Wire and Film Technologies Division
General Note
Telephone:
Facsimile:
Website: www.irctt.com
rpus Christi Te
TT electronics plc
ries Issue March
TT electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT electronics’ own data and is considered accurate at time of going to print.
www.bitechnologies.com www.irctt.com www.welwyn-tt.com
© TT electronics plc
09.12
[Theme Month] What are the two main types of LED power drive methods?
[size=5]What are the two main types of LED power drive methods? [/size]...
tiankai001 Power technology
Please recommend a freescale 16-bit microcontroller development board
I want to learn MC9S12DG128, but I don't know which development board to use~~~ Please recommend~~~~ Thank you...
跑跑老大 NXP MCU
Chipscope is really high-end
On-chip logic analyzer. I just realized how useful it is today.For the analysis of digital signal timing, if you use an oscilloscope probe to check one by one, it is troublesome, inefficient, and pron...
chenqizhou8 Talking
About LPC1788 online upgrade program cannot jump from IAP to APP
I am working on an online upgrade system for LPC1788. My solution is to develop a host computer to read the .hex file of the APP compiled by Keil, and send it to the CAN of LPC1788 via USB to CAN, and...
Heguoyao NXP MCU
There is information on the selling price. To whom did the chip coins paid when downloading go?
The price of the data I uploaded is 1 Core Coin. It has been downloaded more than 100 times, but why doesn't my Core Coin increase? Which moderator can help me explain it? [[i] This post was last edit...
ming1005 MCU
TGF4042 Function Signal Generator Review: Unboxing and Trial
[i=s]This post was last edited by zjd01 on 2019-7-19 18:18[/i]I was lucky enough to get the chance to review the TGF4042 . I unboxed the whole device and its accessories. The accessories only included...
zjd01 Test/Measurement

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1119  109  2633  23  2066  23  3  54  1  42 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号