Cylindrical High Power
Surface Mount Metal Glaze™
CHP Series
·
Cylindrical High Power
Up to 2 watts
·
Surface Mount Metal Glaze
TM
Up to 1000 volts
·
0.2 ohm to 2.2 megohm range
·
Up to 2 watts
RoHS-compliant version available
·
Up to 1000 volts
150°C maximum operating temperature
0.2 ohm to 2.2 megohm range
RoHS-compliant version available
150°C maximum operating temperature
CHP
Metal Glaze™
thick fi lm element
fi red at 1000°C
to solid ceramic
Metal Glaze
TM
thick film element
fired at 1000°C
to solid ceramic
Solder over
nickel barrier
Solder over
nickel barrier
High
temperature
dielectric
coating
High
temperature
dielectric
coating
Electrical Data
IRC
Type
Indus-
try
Foot-
print
1206
Size
Code1
Maximum
Power Rating
Working
Voltage²
Maximum
Voltage
Resistance
Range (ohms)³
0.1 to 0.99
CHP 1/8
B&C
1/4W @ 70°C
200
400
1.0 to 1.0 M
20 to 348K
CHP 1/2
2010
D&E
1/2W @ 70°C
300
600
0.1 to 0.99
1.0 to 348K
0.1 to 0.99
CHP 1
2512
F
1W @ 70°C
350
700
1.0 to 2.21M
20 to 348K
CHP 2
3610
H
2W @ 25°C
1.33W @ 70°C
500
1000
0.2 to 0.99
1.0 to 2.21M
²Not to exceed
P x R
Product
Category
Low Range
Standard
Tight Tolerance
Low Range
Standard
Low Range
Standard
Tight Tolerance
Low Range
Standard
Tolerance
(±%)³
1, 2, 5
1, 2, 5
0.25, 0.5
1, 2, 5
1, 2, 5
1, 2, 5
1, 2, 5
0.25, 0.5
1, 2, 5
1, 2, 5
TCR
(ppm/°C)³
100
50, 100
50, 100
100
50, 100
100
50, 100
50, 100
100
50, 100
¹See pages 2 & 3 for product dimensions, recommended solder pads, and standard packaging.
³Consult factory for tighter TCR, tolerance, or resistance values.
Environmental Data
Characteristics
teristics
Charac
Thermal Shock
Temperature Coefficient
Thermal Shock
Low Temperature Operation
Maximum
m Change
Maximu
Change
±0.25% +.01 Ω
As specified
±0.5% + 0.01 ohm
±0.25% +.01 Ω
±0.25% + 0.01 ohm
±0.5% +.01 Ω
Test Method
MIL-PRF-55342H, §4.8.3
Test Method
MIL-R-55342H Par 3.16 (-55°C +
+150°C / -65°C)
(MIL-STD-202, Method 107G:
125°C)
MIL-PRF-55342H, §4.8.5
MIL-R-55342H Par 3.9 (-65°C + 150°C, 5 cycles)
(-65°C)
MIL-R-55342H Par 3.11 (-65°C @ working voltage)
MIL-R-55342H Par 3.12
2.5 x
P x R
for 5 seconds
MIL-PRF-55342H, §4.8.7
MIL-R-55342H Par 3.13 (-150°C for 100 hours)
MIL-R-55342H Par 3.14.2 (
Reflow soldered to board at 260°C for 10 seconds
)
MIL-PRF-55342H, §4.8.8.2
Short Time Overload
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding
Exposure
±1%
+ 0.01 ohm
±0.5%
for R>100KΩ
±1% for R>100K ohm
±0.5% + 0.01 ohm
±0.25% + 0.01 ohm
MIL-PRF-55342H, §4.8.6
(150°C x 100 Hours)
Resistance to Bonding Exposure
Moisture Resistance
Solderability
High Temperature Exposure
±0.5% +.01 Ω
±0.25% +.01 Ω
±0.5% +.01 Ω
As specified
MIL-PRF-55342H, §4.8.8.2
95% minimum coverage
±0.5% + 0.01 ohm
Temperature Coefficient
Life Test
Resistance
Moisture
Life Test
Solderability
Terminal Adhesion Strength
MIL-PRF-55342H, §4.8.10
(MIL-STD-202, Method 304)
MIL-R-55342H Par 3.18 (10 cycles, total 240 hours)
MIL-R-55342H Par 3.15 (2000 hours at 70°C intermittent)
(MIL-STD-202, Method 108A: 2000 Hours @ 70°C)
1200 gram push from underside of mounted chip for 60 seconds
(MIL-STD-202, Method 208H)
MIL-STD-202, Method 208 (245°C for 5 seconds)
(MIL-STD-202, Method 106G)
±1%
+ 0.01
±0.5%
+.01 Ω
ohm
±1% +
minimum coverage
95%
0.01 ohm
no mechanical damage
MIL-PRF-55342H, §4.8.11
MIL-PRF-55342H, §4.8.12
±1% +.01 Ω
IRC – defined
Chip mounted in center of 90mm long board, deflected 1mm so as to
Terminal Adhesion Strength (push)
±1% + 0.01 ohm
(no mechanical damage)
exert pull on chip contacts for 5 seconds
1200 gram push from underside of mounted device for 60 sec
no mechanical damage
IRC-defined
±1% +.01 Ω
General Note
Device mounted in center of 90mm long board, deflected 1 mm to exert
Terminal Adhesion Strength (flex)
cation without notice or liability.
IRC reserves the right to make changes in product specifi
(no mechanical damage)
All information is subject to IRC’s own data and is considered accurate at time of going to print.
pull on contacts for 5 seconds
A subsidiary of
© IRC Wire and Film Technologies Division
General Note
Telephone:
Facsimile:
Website: www.irctt.com
rpus Christi Te
TT electronics plc
ries Issue March
TT electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT electronics’ own data and is considered accurate at time of going to print.
www.bitechnologies.com www.irctt.com www.welwyn-tt.com
© TT electronics plc
09.12
Cylindrical High Power
Surface Mount Metal Glaze™
Cylindrical High Power
CHP Series
Surface Mount Metal Glaze
TM
CHP
Physical Data
L
C
W
IRC Type
CHP 1/8
MRC 1/2
CHP 1/2
CHP 1
CHP 2
Size Code
B
C
D
F
H
Industry
Footprint
1206
1206
2010
2512
3610
Dimensions (Inches and (mm))
Actual Size
L
0.128 ± 0.007
(3.25 ± 0.18)
0.128 ± 0.007
(3.25 ± 0.18)
W
0.057 ± 0.006
(1.45 ± 0.15)
0.063 ± 0.010
(1.60 ± 0.25)
C
0.020 ± 0.010
(0.51 ± 0.25)
0.020 ± 0.010
(0.51 ± 0.25)
0.030 ± 0.010
(0.761 ± 0.25)
0.040 ± 0.010
(1.02 ± 0.25)
0.050 ± 0.010
(1.27 ± 0.25)
0.200 ± 0.010 0.079 (nom.) -0.006 / +0.011
(2.01 (nom.) -0.15 / +0.28)
(5.08 ± 0.25)
0.251 ± 0.010
(6.38 ± 0.25)
0.079 (nom.) -0.006 / +0.011
(2.01 (nom.) -0.15 / +0.28)
0.367 ± 0.010 0.105 (nom.) -0.006 / +0.011
(2.67 (nom.) -0.15 / +0.28)
(9.32 ± 0.25)
Recommended Solder Pad Dimensions (Reflow):
F
A
C
A
B
E
D
Size
Code
B&C
D
E
F
H
Industry
Footprint
1206
2010
2010
2512
3610
Dimensions (Inches and mm))
A
0.076
(1.93)
0.111
(2.82)
0.170
(4.32)
0.121
(3.07)
0.170
(4.32)
B
0.093
(2.36)
0.126
(3.20)
0.160
(4.06)
0.126
(3.20)
0.160
(4.06)
C
0.058
(1.47)
0.096
(2.44)
0.072
(1.83)
0.127
(3.23)
0.213
(5.41)
D
0.098
(2.49)
0.152
(3.86)
0.132
(3.35)
0.183
(4.65)
0.273
(6.93)
E
0.032
(0.81)
0.040
(1.02)
0.044
(1.12)
0.040
(1.02)
0.044
(1.12)
F
0.211
(5.36)
0.318
(8.08)
0.412
(10.46)
0.369
(9.37)
0.553
(14.05)
© IRC Wire and Film Technologies Division
T
:
F
:
W
:
T
General Note
TT electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT electronics’ own data and is considered accurate at time of going to print.
www.bitechnologies.com www.irctt.com www.welwyn-tt.com
© TT electronics plc
09.12
Cylindrical High Power
Surface Mount Metal Glaze™
Cylindrical High Power
CHP Series
Surface Mount Metal Glaze
TM
IRC
Type
CHP 1/8
MRC 1/2
CHP 1/2
MRC 1
CHP 1
CHP 2
Size
Code
B
C
D
E
F
H
Industry
Footprint
1206
2010
2512
3610
Reel
Diameter*
7
13
7
13
7
13
13
Quantity
Per Reel
2,500 max.
10,000 max.
1,500 max.
5,000 max.
1,500 max.
5,000 max.
1,500 max.
Carrier Tape
Width
8mm
12mm
12mm
24mm
Component
Pitch
4mm
4mm
4mm
4mm
CHP
Standard Reel Packaging per EIA-481:
*The 13 reel is considered standard and will be supplied unless otherwise specified.
Power Derating Curve
100
CHP 1/8, 1/2, 1
Repetitive Surge Curve
1000
CHP 2
100
CHP 1
% of Rated Power
80
60
CHP 2
40
20
0
Peak Power (watts)
10
CHP 1/8
30
40
50 60
70
80
90 100 110 120 130 140 150
1
0.0001
.1msec
Ambient Temperature (°C)
0.0010
1msec
0.0100
10msec
100msec
0.1000
10000msec
1.0000
Surge or Pulse Duration (seconds)
Note: Use for repetitive pulses where the average power dissipation is
not to exceed the component rating at 70°C. Surge handling capacity
for low-repetitive surges may be significantly greater than shown above.
Contact factory for recommendations.
Ordering Data
Sample Part No.
IRC Type
(CHP 1/8, CHP 1/2, CHP 1, or CHP 2)
CHP 1
- 100
2203
F
13
LF
Temperature Coefficient
(50 ppm, 100 ppm)
Resistance Value
(100 ohms and greater - First 3 significant digits plus 4th digit multiplier)
Example: 100 ohms = 1000, 1000 ohms = 1001, 150,000 ohms = 1503
(Less than 100 ohms - "R" is used to designate decimal)
Example: 51 ohms = 51R0, 1 ohm = 1R00, 0.25 ohms = R250
Tolerance
(C = 0.25%, D = 0.5%, F = 1.0%; G = 2.0%; J = 5.0%)
Packaging Code*
(BLK = Bulk, 7 = 7" Reel, 13 = 13" Reel)
Lead Free Construction
© IRC Wire and Film Technologies Division
T
:
F
:
W
:
T
General Note
TT electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT electronics’ own data and is considered accurate at time of going to print.
www.bitechnologies.com www.irctt.com www.welwyn-tt.com
© TT electronics plc
09.12
Embedded System
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