TMS320VC5409ZGU-80 datasheet, PDF

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TMS320VC5409ZGU-80: DescriptionFixed-Point Digital Signal Processor (DSP) 144-BGA MICROSTAR -40 to 100; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，93 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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TMS320VC5409ZGU-80 Overview

Fixed-Point Digital Signal Processor (DSP) 144-BGA MICROSTAR -40 to 100

TMS320VC5409ZGU-80 Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it Rohs certified?	conform to
Maker	Texas Instruments
Parts packaging code	BGA
package instruction	LFBGA, BGA144,13X13,32
Contacts	144
Reach Compliance Code	compli
Factory Lead Time	1 week
Other features	ALSO REQUIRES 3.3V SUPPLY
Address bus width	23
barrel shifter	YES
bit size	16
boundary scan	YES
maximum clock frequency	20 MHz
External data bus width	16
Format	FIXED POINT
Internal bus architecture	MULTIPLE
JESD-30 code	S-PBGA-B144
JESD-609 code	e1
length	12 mm
low power mode	YES
Humidity sensitivity level	3
Number of terminals	144
Maximum operating temperature	100 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Encapsulate equivalent code	BGA144,13X13,32
Package shape	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
power supply	1.8,3.3 V
Certification status	Not Qualified
RAM (number of words)	32768
Maximum seat height	1.4 mm
Maximum supply voltage	1.98 V
Minimum supply voltage	1.71 V
Nominal supply voltage	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	12 mm
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, OTHER

TMS320VC5409ZGU-80 Related Products

	TMS320VC5409ZGU-80	TMS320VC5409GGU-80	TMS320VC5409ZGU100	TMS320VC5409PGE100	TMS320VC5409PGE-80	TMS320VC5409GGU100
Description	Fixed-Point Digital Signal Processor (DSP) 144-BGA MICROSTAR -40 to 100	Fixed-Point Digital Signal Processor (DSP) 144-BGA MICROSTAR -40 to 100	Fixed-Point Digital Signal Processor (DSP) 144-BGA MICROSTAR -40 to 100	Fixed-Point Digital Signal Processor (DSP) 144-LQFP -40 to 100	Fixed-Point Digital Signal Processor (DSP) 144-LQFP -40 to 100	Fixed-Point Digital Signal Processor (DSP) 144-BGA MICROSTAR -40 to 100
Brand Name	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Is it Rohs certified?	conform to	incompatible	conform to	conform to	conform to	incompatible
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Parts packaging code	BGA	BGA	BGA	QFP	QFP	BGA
package instruction	LFBGA, BGA144,13X13,32	LFBGA, BGA144,13X13,32	LFBGA, BGA144,13X13,32	LFQFP, QFP144,.87SQ,20	LFQFP, QFP144,.87SQ,20	LFBGA, BGA144,13X13,32
Contacts	144	144	144	144	144	144
Reach Compliance Code	compli	_compli	compli	compli	compli	_compli
Other features	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY
Address bus width	23	23	23	23	23	23
barrel shifter	YES	YES	YES	YES	YES	YES
bit size	16	16	16	16	16	16
boundary scan	YES	YES	YES	YES	YES	YES
maximum clock frequency	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz
External data bus width	16	16	16	16	16	16
Format	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT
Internal bus architecture	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE
JESD-30 code	S-PBGA-B144	S-PBGA-B144	S-PBGA-B144	S-PQFP-G144	S-PQFP-G144	S-PBGA-B144
JESD-609 code	e1	e0	e1	e4	e4	e0
length	12 mm	12 mm	12 mm	20 mm	20 mm	12 mm
low power mode	YES	YES	YES	YES	YES	YES
Humidity sensitivity level	3	3	3	1	1	3
Number of terminals	144	144	144	144	144	144
Maximum operating temperature	100 °C	100 °C	100 °C	100 °C	100 °C	100 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFBGA	LFBGA	LFBGA	LFQFP	LFQFP	LFBGA
Encapsulate equivalent code	BGA144,13X13,32	BGA144,13X13,32	BGA144,13X13,32	QFP144,.87SQ,20	QFP144,.87SQ,20	BGA144,13X13,32
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260	220	260	260	260	220
power supply	1.8,3.3 V	1.8,3.3 V	1.8,3.3 V	1.8,3.3 V	1.8,3.3 V	1.8,3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (number of words)	32768	32768	32768	32768	32768	32768
Maximum seat height	1.4 mm	1.4 mm	1.4 mm	1.6 mm	1.6 mm	1.4 mm
Maximum supply voltage	1.98 V	1.98 V	1.98 V	1.98 V	1.98 V	1.98 V
Minimum supply voltage	1.71 V	1.71 V	1.71 V	1.71 V	1.71 V	1.71 V
Nominal supply voltage	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Lead (Sn/Pb)	Tin/Silver/Copper (Sn/Ag/Cu)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Tin/Lead (Sn/Pb)
Terminal form	BALL	BALL	BALL	GULL WING	GULL WING	BALL
Terminal pitch	0.8 mm	0.8 mm	0.8 mm	0.5 mm	0.5 mm	0.8 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	QUAD	QUAD	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	12 mm	12 mm	12 mm	20 mm	20 mm	12 mm
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER
Factory Lead Time	1 week	1 week	1 week	-	1 week	-

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