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AS7C32098A-20TC

Description
3.3 V 128K x 16 CMOS SRAM
Categorystorage    storage   
File Size188KB,10 Pages
ManufacturerALSC [Alliance Semiconductor Corporation]
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AS7C32098A-20TC Overview

3.3 V 128K x 16 CMOS SRAM

AS7C32098A-20TC Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerALSC [Alliance Semiconductor Corporation]
Parts packaging codeTSOP2
package instructionTSOP2,
Contacts44
Reach Compliance Codeunknow
ECCN code3A991.B.2.A
Maximum access time20 ns
JESD-30 codeR-PDSO-G44
JESD-609 codee0
length18.415 mm
memory density2097152 bi
Memory IC TypeSTANDARD SRAM
memory width16
Number of functions1
Number of terminals44
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize128KX16
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP2
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)240
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTIN LEAD
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width10.16 mm
February 2005
Preliminary Information
AS7C32098A
®
3.3 V 128K × 16 CMOS SRAM
Features
• Industrial and commercial temperature
• Organization: 131,072 words × 16 bits
• Center power and ground pins
• High speed
- 10/12/15/20 ns address access time
- 4/5/6/7 ns output enable access time
- 28.8 mW /max CMOS
• Individual byte read/write controls
• Easy memory expansion with CE, OE inputs
• TTL- and CMOS-compatible, three-state I/O
• 44-pin JEDEC standard packages
• ESD protection
2000 volts
• Latch-up current
200 mA
- TSOP 2
• Low power consumption: ACTIVE
- 650 mW /max @ 10 ns
• Low power consumption: STANDBY
Logic block diagram
Pin arrangement for TSOP 2
A0
A1
A2
A3
A4
CE
I/O1
I/O2
I/O3
I/O4
V
CC
GND
I/O5
I/O6
I/O7
I/O8
WE
A5
A6
A7
A8
A9
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
A16
A15
A14
OE
UB
LB
I/O16
I/O15
I/O14
I/O13
GND
V
CC
I/O12
I/O11
I/O10
I/O9
NC
A13
A12
A11
A10
NC
A0
A1
A2
A3
A4
A6
A7
A8
A12
A13
I/O1–I/O8
I/O9–I/O16
WE
Row Decoder
V
CC
1024 × 128 × 16
Array
(2,097,152)
GND
I/O
buffer
Control circuit
Column decoder
A5
A9
A10
A11
A14
A15
A16
UB
OE
LB
CE
Selection guide
–10
Maximum address access time
Maximum output enable access time
Maximum operating current
Maximum CMOS standby current
Industrial
Commercial
10
4
180
170
8
–12
12
5
160
150
8
–15
15
6
140
130
8
–20
20
7
110
100
8
Unit
ns
ns
mA
mA
mA
2/24/05, v. 1.0
Alliance Semiconductor
P. 1 of 10
Copyright © Alliance Semiconductor. All rights reserved.

AS7C32098A-20TC Related Products

AS7C32098A-20TC AS7C32098A AS7C32098A-15TIN AS7C32098A-15TI
Description 3.3 V 128K x 16 CMOS SRAM 3.3 V 128K x 16 CMOS SRAM 3.3 V 128K x 16 CMOS SRAM 3.3 V 128K x 16 CMOS SRAM
Is it Rohs certified? incompatible - conform to incompatible
Maker ALSC [Alliance Semiconductor Corporation] - ALSC [Alliance Semiconductor Corporation] ALSC [Alliance Semiconductor Corporation]
Parts packaging code TSOP2 - TSOP2 TSOP2
package instruction TSOP2, - TSOP2, TSOP2,
Contacts 44 - 44 44
Reach Compliance Code unknow - unknow unknow
ECCN code 3A991.B.2.A - 3A991.B.2.A 3A991.B.2.A
Maximum access time 20 ns - 15 ns 15 ns
JESD-30 code R-PDSO-G44 - R-PDSO-G44 R-PDSO-G44
JESD-609 code e0 - e3 e0
length 18.415 mm - 18.415 mm 18.415 mm
memory density 2097152 bi - 2097152 bi 2097152 bi
Memory IC Type STANDARD SRAM - STANDARD SRAM STANDARD SRAM
memory width 16 - 16 16
Number of functions 1 - 1 1
Number of terminals 44 - 44 44
word count 131072 words - 131072 words 131072 words
character code 128000 - 128000 128000
Operating mode ASYNCHRONOUS - ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C - 85 °C 85 °C
organize 128KX16 - 128KX16 128KX16
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP2 - TSOP2 TSOP2
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE - SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL - PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 240 - 250 240
Certification status Not Qualified - Not Qualified Not Qualified
Maximum seat height 1.2 mm - 1.2 mm 1.2 mm
Maximum supply voltage (Vsup) 3.6 V - 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V - 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V - 3.3 V 3.3 V
surface mount YES - YES YES
technology CMOS - CMOS CMOS
Temperature level COMMERCIAL - INDUSTRIAL INDUSTRIAL
Terminal surface TIN LEAD - MATTE TIN TIN LEAD
Terminal form GULL WING - GULL WING GULL WING
Terminal pitch 0.8 mm - 0.8 mm 0.8 mm
Terminal location DUAL - DUAL DUAL
Maximum time at peak reflow temperature 30 - 40 30
width 10.16 mm - 10.16 mm 10.16 mm
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