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AS7C3256A-12TCN

Description
32K X 8 STANDARD SRAM, 12 ns, PDSO28
Categorystorage    storage   
File Size232KB,9 Pages
ManufacturerALSC [Alliance Semiconductor Corporation]
Environmental Compliance
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AS7C3256A-12TCN Overview

32K X 8 STANDARD SRAM, 12 ns, PDSO28

AS7C3256A-12TCN Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerALSC [Alliance Semiconductor Corporation]
Parts packaging codeTSOP
package instructionTSOP1, TSSOP28,.53,22
Contacts28
Reach Compliance Codeunknow
ECCN codeEAR99
Maximum access time12 ns
I/O typeCOMMON
JESD-30 codeR-PDSO-G28
length11.8 mm
memory density262144 bi
Memory IC TypeSTANDARD SRAM
memory width8
Number of functions1
Number of terminals28
word count32768 words
character code32000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize32KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP1
Encapsulate equivalent codeTSSOP28,.53,22
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
power supply3.3 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum standby current0.002 A
Minimum standby current3 V
Maximum slew rate0.045 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formGULL WING
Terminal pitch0.55 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
width8 mm
April 2004
®
AS7C3256A
3.3V 32K X 8 CMOS SRAM (Common I/O)
Features
Pin compatible with AS7C3256
Industrial and commercial temperature options
Organization: 32,768 words × 8 bits
High speed
- 10/12/15/20 ns address access time
- 5, 6, 7, 8 ns output enable access time
• Very low power consumption: ACTIVE
- 180mW max @ 10 ns
• Very low power consumption: STANDBY
- 7.2 mW max CMOS I/O
• Easy memory expansion with CE and OE inputs
• TTL-compatible, three-state I/O
• 28-pin JEDEC standard packages
- 300 mil SOJ
- 8
×
13.4 mm TSOP 1
• ESD protection
2000 volts
• Latch-up current
200 mA
Logic block diagram
V
CC
GND
Input buffer
Pin arrangement
28-pin TSOP 1 (8×13.4 mm)
28-pin SOJ (300 mil)
A0
A1
A2
A3
A4
A5
A6
A7
I/O7
Row decoder
Sense amp
256 X 128 X 8
Array
(262,144)
I/O0
OE
A11
A9
A8
A13
WE
V
CC
A14
A12
A7
A6
A5
A4
A3
1
2
3
4
5
6
7
8
9
10
11
12
13
14
AS7C3256A
28
27
26
25
24
23
22
21
20
19
18
17
16
15
A10
CE
I/O7
I/O6
I/O5
I/O4
I/O3
GND
I/O2
I/O1
I/O0
A0
A1
A2
Column decoder
WE
Control
circuit
OE
CE
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
I/O1
I/O2
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
V
CC
WE
A13
A8
A9
A11
OE
A10
CE
I/O7
I/O6
I/O5
I/O4
I/O3
A A A A A A A
8 9 10 11 12 13 14
Selection guide
-10
Maximum address access time
Maximum output enable access time
Maximum operating current
Maximum CMOS standby current
10
5
50
2
-12
12
6
45
2
-15
15
7
40
2
-20
20
8
35
2
Unit
ns
ns
mA
mA
4/23/04; v.2.0
Alliance Semiconductor
P. 1 of 9
Copyright © Alliance Semiconductor. All rights reserved.
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