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25LC512T-I/P

Description
64K X 8 SPI BUS SERIAL EEPROM, PDIP8
Categorystorage   
File Size621KB,36 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Download Datasheet Parametric Compare View All

25LC512T-I/P Overview

64K X 8 SPI BUS SERIAL EEPROM, PDIP8

25LC512T-I/P Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals8
Maximum operating temperature85 Cel
Minimum operating temperature-40 Cel
Maximum supply/operating voltage5.5 V
Minimum supply/operating voltage2.5 V
Rated supply voltage5 V
maximum clock frequency20 MHz
Processing package description0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8
Lead-freeYes
EU RoHS regulationsYes
China RoHS regulationsYes
stateACTIVE
CraftsmanshipCMOS
packaging shapeRECTANGULAR
Package SizeIN-LINE
Terminal formTHROUGH-HOLE
Terminal spacing2.54 mm
terminal coatingMATTE TIN
Terminal locationDUAL
Packaging MaterialsPLASTIC/EPOXY
Temperature levelINDUSTRIAL
memory width8
organize64K X 8
storage density524288 deg
operating modeSYNCHRONOUS
Number of digits65536 words
Number of digits64K
Memory IC typeSPI BUS SERIAL EEPROM
serial parallelSERIAL
Maximum TWC of write cycle5 ms
25LC512
512 Kbit SPI Bus Serial EEPROM
Device Selection Table
Part Number
25LC512
V
CC
Range
2.5-5.5V
Page Size
128 Byte
Temp. Ranges
I,E
Packages
P, SN, SM, MF
Features:
• 20 MHz max. Clock Speed
• Byte and Page-level Write Operations:
- 128-byte page
- 5 ms max.
- No page or sector erase required
• Low-Power CMOS Technology:
- Max. Write Current: 5 mA at 5.5V, 20 MHz
- Read Current: 10 mA at 5.5V, 20 MHz
- Standby Current: 1A at 2.5V (Deep power-
down)
• Electronic Signature for Device ID
• Self-Timed Erase and Write cycles:
- Page Erase (5 ms, typical)
- Sector Erase (10 ms/sector, typical)
- Bulk Erase (10 ms, typical)
• Sector Write Protection (16K byte/sector):
- Protect none, 1/4, 1/2 or all of array
• Built-In Write Protection:
- Power-on/off data protection circuitry
- Write enable latch
- Write-protect pin
• High Reliability:
- Endurance: 1 Million erase/write cycles
- Data Retention: >200 years
- ESD Protection: >4000V
• Temperature Ranges Supported:
- Industrial (I):
-40C to +85C
- Automotive (E):
-40°C to +125°C
• Pb-free and RoHS Compliant
Description:
The Microchip Technology Inc. 25LC512 is a 512 Kbit
serial EEPROM memory with byte-level and page-level
serial EEPROM functions. It also features Page, Sector
and Chip erase functions typically associated with
Flash-based products. These functions are not required
for byte or page write operations. The memory is
accessed via a simple Serial Peripheral Interface (SPI)
compatible serial bus. The bus signals required are a
clock input (SCK) plus separate data in (SI) and data out
(SO) lines. Access to the device is controlled by a Chip
Select (CS) input.
Communication to the device can be paused via the
hold pin (HOLD). While the device is paused, transi-
tions on its inputs will be ignored, with the exception of
Chip Select, allowing the host to service higher priority
interrupts.
The 25LC512 is available in standard packages includ-
ing 8-lead PDIP, SOIC, and advanced 8-lead DFN
package. All packages are Pb-free and RoHS
compliant.
Package Types (not to scale)
DFN
25LC512
CS 1
SO 2
WP 3
V
SS
4
(MF)
8
7
6
5
V
CC
HOLD
SCK
SI
PDIP/SOIC/SOIJ
(P, SN, SM)
25LC512
8
7
6
5
CS
SO
WP
V
SS
1
2
3
4
V
CC
HOLD
SCK
SI
Pin Function Table
Name
CS
SO
WP
V
SS
SI
SCK
HOLD
V
CC
Function
Chip Select Input
Serial Data Output
Write-Protect
Ground
Serial Data Input
Serial Clock Input
Hold Input
Supply Voltage
2010 Microchip Technology Inc.
DS22065C-page 1

25LC512T-I/P Related Products

25LC512T-I/P 25LC512-E/SM 25LC512-I/MF 25LC512T-E/SM 25LC512T-I/MF 25LC512T-I/SM 25LC512_10
Description 64K X 8 SPI BUS SERIAL EEPROM, PDIP8 64K X 8 SPI BUS SERIAL EEPROM, PDIP8 64K X 8 SPI BUS SERIAL EEPROM, PDIP8 64K X 8 SPI BUS SERIAL EEPROM, PDSO8 64K X 8 SPI BUS SERIAL EEPROM, PDIP8 64K X 8 SPI BUS SERIAL EEPROM, PDIP8 64K X 8 SPI BUS SERIAL EEPROM, PDIP8
Number of functions 1 1 1 1 1 1 1
Number of terminals 8 8 8 8 8 8 8
Maximum operating temperature 85 Cel 125 °C 85 °C 125 °C 85 °C 85 °C 85 Cel
Minimum operating temperature -40 Cel -40 °C -40 °C -40 °C -40 °C -40 °C -40 Cel
Terminal form THROUGH-HOLE GULL WING NO LEAD GULL WING NO LEAD GULL WING THROUGH-HOLE
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Temperature level INDUSTRIAL AUTOMOTIVE INDUSTRIAL AUTOMOTIVE INDUSTRIAL INDUSTRIAL INDUSTRIAL
memory width 8 8 8 8 8 8 8
organize 64K X 8 64KX8 64KX8 64KX8 64KX8 64KX8 64K X 8
Is it lead-free? - Lead free Lead free Lead free Lead free Lead free -
Is it Rohs certified? - conform to conform to conform to conform to conform to -
Parts packaging code - SOIC DFN SOIC DFN SOIC -
package instruction - 5.28 MM, ROHS COMPLIANT, PLASTIC, SOIJ-8 6 X 5 MM, ROHS COMPLIANT, PLASTIC, DFN-8 5.28 MM, ROHS COMPLIANT, PLASTIC, SOIJ-8 6 X 5 MM, ROHS COMPLIANT, PLASTIC, DFN-8 5.28 MM, ROHS COMPLIANT, PLASTIC, SOIJ-8 -
Contacts - 8 8 8 8 8 -
Reach Compliance Code - compli compli compli compli compli -
ECCN code - EAR99 EAR99 EAR99 EAR99 EAR99 -
Factory Lead Time - 29 weeks 13 weeks 29 weeks 14 weeks 29 weeks -
Maximum clock frequency (fCLK) - 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz -
Data retention time - minimum - 200 200 200 200 200 -
Durability - 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles -
JESD-30 code - R-PDSO-G8 R-PDSO-N8 R-PDSO-G8 R-PDSO-N8 R-PDSO-G8 -
JESD-609 code - e3 e3 e3 e3 e3 -
length - 5.26 mm 6 mm 5.26 mm 6 mm 5.26 mm -
memory density - 524288 bi 524288 bi 524288 bi 524288 bi 524288 bi -
Memory IC Type - EEPROM EEPROM EEPROM EEPROM EEPROM -
Humidity sensitivity level - 3 3 3 3 3 -
word count - 65536 words 65536 words 65536 words 65536 words 65536 words -
character code - 64000 64000 64000 64000 64000 -
Operating mode - SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS -
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
encapsulated code - SOP HVSON SOP HVSON SOP -
Encapsulate equivalent code - SOP8,.3 SOLCC8,.25 SOP8,.3 SOLCC8,.25 SOP8,.3 -
Package shape - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR -
Package form - SMALL OUTLINE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE -
Parallel/Serial - SERIAL SERIAL SERIAL SERIAL SERIAL -
Peak Reflow Temperature (Celsius) - NOT SPECIFIED 260 NOT SPECIFIED 260 NOT SPECIFIED -
power supply - 3/5 V 2.5/5 V 3/5 V 2.5/5 V 2.5/5 V -
Certification status - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified -
Maximum seat height - 2.03 mm 1 mm 2.03 mm 1 mm 2.03 mm -
Serial bus type - SPI SPI SPI SPI SPI -
Maximum standby current - 0.000001 A 0.000001 A 0.000001 A 0.000001 A 0.000001 A -
Maximum slew rate - 0.01 mA 0.01 mA 0.01 mA 0.01 mA 0.01 mA -
Maximum supply voltage (Vsup) - 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V -
Minimum supply voltage (Vsup) - 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V -
Nominal supply voltage (Vsup) - 5 V 5 V 5 V 5 V 5 V -
surface mount - YES YES YES YES YES -
technology - CMOS CMOS CMOS CMOS CMOS -
Terminal surface - Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) -
Terminal pitch - 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm -
Maximum time at peak reflow temperature - NOT SPECIFIED 40 NOT SPECIFIED 40 NOT SPECIFIED -
width - 5.25 mm 5 mm 5.25 mm 5 mm 5.25 mm -
Maximum write cycle time (tWC) - 5 ms 5 ms 5 ms 5 ms 5 ms -
write protect - HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE -
Base Number Matches - 1 1 1 1 1 -

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