PIC18F13K22-I/ML datasheet, PDF

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PIC18F13K22-I/ML: Description16-BIT, FLASH, 48 MHz, RISC MICROCONTROLLER, PDSO20; CategoryThe embedded processor and controller Microcontrollers and processors; File Size3MB，387 Pages; ManufacturerMicrochip; Websitehttps://www.microchip.com; Environmental Compliance

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PIC18F13K22-I/ML Overview

16-BIT, FLASH, 48 MHz, RISC MICROCONTROLLER, PDSO20

PIC18F13K22-I/ML Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Microchip
Parts packaging code	QFN
package instruction	4 X 4 MM, 0.90 MM HEIGHT, LEAD FREE, PLASTIC, QFN-20
Contacts	20
Reach Compliance Code	compli
ECCN code	3A991.A.2
Factory Lead Time	30 weeks
Samacsys Descripti	Flash Microcontrollers
Has ADC	YES
Other features	ALSO OPERATES AT 2.3 V MINIMUM SUPPLY AT 20 MHZ
Address bus width
bit size	16
CPU series	PIC
maximum clock frequency	64 MHz
DAC channel	YES
DMA channel	NO
External data bus width
JESD-30 code	S-PQCC-N20
JESD-609 code	e3
length	4 mm
Humidity sensitivity level	3
Number of I/O lines	18
Number of terminals	20
On-chip program ROM width	16
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	HVQCCN
Encapsulate equivalent code	LCC20,.16SQ,20
Package shape	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	260
power supply	2/5 V
Certification status	Not Qualified
RAM (bytes)	256
rom(word)	4096
ROM programmability	FLASH
Maximum seat height	1 mm
speed	64 MHz
Maximum slew rate	15.6 mA
Maximum supply voltage	5.5 V
Minimum supply voltage	2.7 V
Nominal supply voltage	3.6 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Matte Tin (Sn) - annealed
Terminal form	NO LEAD
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	40
width	4 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC

User Manual

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PIC18(L)F1XK22

20-Pin Flash Microcontrollers with XLP Technology

High-Performance RISC CPU

• C Compiler Optimized Architecture:

- Optional extended instruction set designed to

optimize re-entrant code

• 256 bytes Data EEPROM

• Up to 16 Kbytes Linear Program Memory

Addressing

• Up to 512 bytes Linear Data Memory Addressing

• Up to 16 MIPS Operation

• 16-bit Wide Instructions, 8-bit Wide Data Path

• Priority Levels for Interrupts

• 31-Level, Software Accessible Hardware Stack

• 8 x 8 Single-Cycle Hardware Multiplier

Analog Features

• Analog-to-Digital Converter (ADC) module

- 10-bit resolution, 12 channels

- Auto-acquisition capability

- Conversion available during Sleep

• Analog Comparator module:

- Two rail-to-rail analog comparators

- Independent input multiplexing

- Inputs and outputs externally accessible

• Voltage Reference module:

- Fixed Voltage Reference (FVR) with 1.024V,

2.048V and 4.096V output levels

- 5-bit rail-to-rail resistive Digital-to-Analog

Converter (DAC) with positive and negative

reference selection

Flexible Oscillator Structure

• Precision 16 MHz Internal Oscillator Block:

- Factory calibrated to ± 1%

- Software selectable frequencies range of

31 kHz to 16 MHz

- 64 MHz performance available using PLL –

no external components required

• Four Crystal modes up to 64 MHz

• Two External Clock modes up to 64 MHz

• 4X Phase Lock Loop (PLL)

• Secondary Oscillator using Timer1 @ 32 kHz

• Fail-Safe Clock Monitor

- Allows for safe shutdown if peripheral clock

stops

• Two-Speed Oscillator Start-up

Peripheral Highlights

• 17 I/O Pins and 1 Input-only Pin:

- High current sink/source 25 mA/25 mA

- Programmable weak pull-ups

- Programmable interrupt-on- change

- Three external interrupt pins

• Four Timer modules:

- Three 16-bit timers/counters with prescaler

- One 8-bit timer/counter with 8-bit period

- Dedicated, low-power Timer1 oscillator

• Enhanced Capture/Compare/PWM (ECCP)

module:

- One, two or four PWM outputs

- Selectable polarity

- Programmable dead time

- Auto-shutdown and Auto-restart

- PWM output steering control

• Master Synchronous Serial Port (MSSP) module

- 3-wire SPI (supports all four SPI modes)

- I

C Master and Slave modes (Slave mode

address masking)

• Enhanced Universal Synchronous Asynchronous

Receiver Transmitter module (EUSART)

- Supports RS-232, RS-485 and LIN 2.0

- Auto-Baud Detect

- Auto Wake-up on Break

• SR Latch (555 Timer) module with:

- Configurable inputs and outputs

- Supports mTouch

capacitive sensing

applications

Special Microcontroller Features

•

2.3V - 5.5V Operation – PIC18F1XK22

1.8V-3.6V Operation – PIC18LF1XK22

Self-reprogrammable under Software Control

Power-on Reset (POR), Power-up Timer (PWRT)

and Oscillator Start-up Timer (OST)

Programmable Brown-out Reset (BOR)

Extended Watchdog Timer (WDT):

- Programmable period from 4 ms to 131s

Programmable Code Protection

In-Circuit Serial Programming™ (ICSP™) via

two pins

In-Circuit Debug via Two Pins

Extreme Low-Power Management

PIC18LF1XK22 with XLP Technology

• Sleep mode: 34 nA

• Watchdog Timer: 460 nA

• Timer1 Oscillator: 650 nA @ 32 kHz



2009-2016 Microchip Technology Inc.

DS40001365F-page 1

PIC18(L)F1XK22

Table of Contents

1.0 Device Overview .......................................................................................................................................................................... 6

2.0 Oscillator Module........................................................................................................................................................................ 12

3.0 Memory Organization ................................................................................................................................................................. 24

4.0 Flash Program Memory .............................................................................................................................................................. 45

5.0 Data EEPROM Memory ............................................................................................................................................................. 54

6.0 8 x 8 Hardware Multiplier............................................................................................................................................................ 58

7.0 Interrupts .................................................................................................................................................................................... 60

8.0 I/O Ports ..................................................................................................................................................................................... 73

9.0 Timer0 Module ........................................................................................................................................................................... 91

10.0 Timer1 Module ........................................................................................................................................................................... 94

11.0 Timer2 Module ......................................................................................................................................................................... 100

12.0 Timer3 Module ......................................................................................................................................................................... 102

13.0 Enhanced Capture/Compare/PWM (ECCP) Module................................................................................................................ 106

14.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 127

15.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) ............................................................... 170

16.0 Analog-to-Digital Converter (ADC) Module .............................................................................................................................. 197

17.0 Comparator Module.................................................................................................................................................................. 210

18.0 Power-Managed Modes ........................................................................................................................................................... 222

19.0 SR Latch................................................................................................................................................................................... 228

20.0 Fixed Voltage Reference (FVR)................................................................................................................................................ 231

21.0 Digital-to-Analog Converter (DAC) Module .............................................................................................................................. 233

22.0 Reset ........................................................................................................................................................................................ 237

23.0 Special Features of the CPU .................................................................................................................................................... 249

24.0 Instruction Set Summary .......................................................................................................................................................... 265

25.0 Development Support............................................................................................................................................................... 315

26.0 Electrical Specifications............................................................................................................................................................ 319

27.0 DC and AC Characteristics Graphs and Charts ....................................................................................................................... 356

28.0 Packaging Information.............................................................................................................................................................. 372

Appendix A: Revision History............................................................................................................................................................. 382

Appendix B: Device Differences......................................................................................................................................................... 383

The Microchip WebSite ...................................................................................................................................................................... 384

Customer Change Notification Service .............................................................................................................................................. 384

Customer Support .............................................................................................................................................................................. 384

Product Identification System............................................................................................................................................................. 385

Worldwide Sales and Service ............................................................................................................................................................ 387

DS40001365F-page 4



2009-2016 Microchip Technology Inc.

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