AS7C331MNTD18A-133TQI datasheet, PDF

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AS7C331MNTD18A-133TQI: Description3.3V 1M x 18 Pipelined SRAM with NTD; Categorystorage storage; File Size406KB，18 Pages; ManufacturerALSC [Alliance Semiconductor Corporation]

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AS7C331MNTD18A-133TQI Overview

3.3V 1M x 18 Pipelined SRAM with NTD

AS7C331MNTD18A-133TQI Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	ALSC [Alliance Semiconductor Corporation]
Parts packaging code	QFP
package instruction	LQFP, QFP100,.63X.87
Contacts	100
Reach Compliance Code	unknow
ECCN code	3A991.B.2.A
Maximum access time	3.8 ns
Other features	PIPELINED ARCHITECTURE
Maximum clock frequency (fCLK)	133 MHz
I/O type	COMMON
JESD-30 code	R-PQFP-G100
JESD-609 code	e0
length	20 mm
memory density	18874368 bi
Memory IC Type	ZBT SRAM
memory width	18
Number of functions	1
Number of terminals	100
word count	1048576 words
character code	1000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	1MX18
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	LQFP
Encapsulate equivalent code	QFP100,.63X.87
Package shape	RECTANGULAR
Package form	FLATPACK, LOW PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	2.5/3.3,3.3 V
Certification status	Not Qualified
Maximum seat height	1.6 mm
Maximum standby current	0.05 A
Minimum standby current	3.14 V
Maximum slew rate	0.27 mA
Maximum supply voltage (Vsup)	3.465 V
Minimum supply voltage (Vsup)	3.135 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	14 mm

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December 2004

AS7C331MNTD18A

3.3V 1M x 18 Pipelined SRAM with NTD

Features

•

Organization: 1,048,576 words × 18 bits

NTD

™

architecture for efficient bus operation

Fast clock speeds to 166 MHz

Fast clock to data access: 3.4/3.8 ns

Fast OE access time: 3.4/3.8 ns

Fully synchronous operation

Asynchronous output enable control

Available in 100-pin TQFP package

•

Individual byte write and global write

Clock enable for operation hold

Multiple chip enables for easy expansion

3.3V core power supply

2.5V or 3.3V I/O operation with separate V

DDQ

Self-timed write cycles

Interleaved or linear burst modes

Snooze mode for standby operation

Logic block diagram

A[19:0]

Address

burst logic

CLK

CE0

CE1

CE2

R/W

BWa

BWb

ADV / LD

LBO

CLK

Write delay

addr. registers

CLK

Control

logic

CLK

Write Buffer

1M x 18

SRAM

array

DQ [a,b]

Data

input

CLK

CEN

CLK

Output

DQ [a,b]

Selection guide

-166

Minimum cycle time

Maximum clock frequency

Maximum clock access time

Maximum operating current

Maximum standby current

Maximum CMOS standby current (DC)

166

3.4

290

-133

7.5

133

3.8

270

Units

MHz

12/24/04, v 2.7

Alliance Semiconductor

P. 1 of 18

AS7C331MNTD18A-133TQI Related Products

	AS7C331MNTD18A-133TQI	AS7C331MNTD18A	AS7C331MNTD18A-166TQC	AS7C331MNTD18A-166TQCN	AS7C331MNTD18A-166TQI	AS7C331MNTD18A-166TQIN
Description	3.3V 1M x 18 Pipelined SRAM with NTD	3.3V 1M x 18 Pipelined SRAM with NTD	3.3V 1M x 18 Pipelined SRAM with NTD	3.3V 1M x 18 Pipelined SRAM with NTD	3.3V 1M x 18 Pipelined SRAM with NTD	3.3V 1M x 18 Pipelined SRAM with NTD
Is it Rohs certified?	incompatible	-	incompatible	conform to	incompatible	conform to
Maker	ALSC [Alliance Semiconductor Corporation]	-	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]
Parts packaging code	QFP	-	QFP	QFP	QFP	QFP
package instruction	LQFP, QFP100,.63X.87	-	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87
Contacts	100	-	100	100	100	100
Reach Compliance Code	unknow	-	unknow	unknow	unknow	unknow
ECCN code	3A991.B.2.A	-	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Maximum access time	3.8 ns	-	3.4 ns	3.4 ns	3.4 ns	3.4 ns
Other features	PIPELINED ARCHITECTURE	-	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE
Maximum clock frequency (fCLK)	133 MHz	-	166 MHz	166 MHz	166 MHz	166 MHz
I/O type	COMMON	-	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PQFP-G100	-	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100
JESD-609 code	e0	-	e0	e3	e0	e3
length	20 mm	-	20 mm	20 mm	20 mm	20 mm
memory density	18874368 bi	-	18874368 bi	18874368 bi	18874368 bi	18874368 bi
Memory IC Type	ZBT SRAM	-	ZBT SRAM	ZBT SRAM	ZBT SRAM	ZBT SRAM
memory width	18	-	18	18	18	18
Number of functions	1	-	1	1	1	1
Number of terminals	100	-	100	100	100	100
word count	1048576 words	-	1048576 words	1048576 words	1048576 words	1048576 words
character code	1000000	-	1000000	1000000	1000000	1000000
Operating mode	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	-	70 °C	70 °C	85 °C	85 °C
organize	1MX18	-	1MX18	1MX18	1MX18	1MX18
Output characteristics	3-STATE	-	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LQFP	-	LQFP	LQFP	LQFP	LQFP
Encapsulate equivalent code	QFP100,.63X.87	-	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87
Package shape	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	FLATPACK, LOW PROFILE	-	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE
Parallel/Serial	PARALLEL	-	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	-	NOT SPECIFIED	245	NOT SPECIFIED	245
power supply	2.5/3.3,3.3 V	-	2.5/3.3,3.3 V	2.5/3.3,3.3 V	2.5/3.3,3.3 V	2.5/3.3,3.3 V
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.6 mm	-	1.6 mm	1.6 mm	1.6 mm	1.6 mm
Maximum standby current	0.05 A	-	0.05 A	0.05 A	0.05 A	0.05 A
Minimum standby current	3.14 V	-	3.14 V	3.14 V	3.14 V	3.14 V
Maximum slew rate	0.27 mA	-	0.29 mA	0.29 mA	0.29 mA	0.29 mA
Maximum supply voltage (Vsup)	3.465 V	-	3.465 V	3.465 V	3.465 V	3.465 V
Minimum supply voltage (Vsup)	3.135 V	-	3.135 V	3.135 V	3.135 V	3.135 V
Nominal supply voltage (Vsup)	3.3 V	-	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	-	YES	YES	YES	YES
technology	CMOS	-	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	-	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	MATTE TIN	Tin/Lead (Sn/Pb)	MATTE TIN
Terminal form	GULL WING	-	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.65 mm	-	0.65 mm	0.65 mm	0.65 mm	0.65 mm
Terminal location	QUAD	-	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	-	NOT SPECIFIED	30	NOT SPECIFIED	30
width	14 mm	-	14 mm	14 mm	14 mm	14 mm

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