CMOS 8-BIT SINGLE-CHIP MICROCOMPUTER (TLCS-48C)
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Toshiba Semiconductor |
| Parts packaging code | DIP |
| package instruction | PLASTIC, DIP-40 |
| Contacts | 40 |
| Reach Compliance Code | unknown |
| Has ADC | NO |
| Address bus width | 12 |
| bit size | 8 |
| maximum clock frequency | 11 MHz |
| DAC channel | NO |
| DMA channel | NO |
| External data bus width | 8 |
| JESD-30 code | R-PDIP-T40 |
| JESD-609 code | e0 |
| length | 52.07 mm |
| Number of I/O lines | 19 |
| Number of terminals | 40 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| PWM channel | NO |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| Maximum seat height | 5.08 mm |
| speed | 11 MHz |
| Maximum slew rate | 15 mA |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 4.5 V |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 15.24 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
| Base Number Matches | 1 |
| TMP80C35AP | TMP80C48AU-6 | TMP80C48AP-6 | TMP80C48AU | TMP80C48A | TMP80C48AP | TMP80C35AP-6 | |
|---|---|---|---|---|---|---|---|
| Description | CMOS 8-BIT SINGLE-CHIP MICROCOMPUTER (TLCS-48C) | CMOS 8-BIT SINGLE-CHIP MICROCOMPUTER (TLCS-48C) | CMOS 8-BIT SINGLE-CHIP MICROCOMPUTER (TLCS-48C) | CMOS 8-BIT SINGLE-CHIP MICROCOMPUTER (TLCS-48C) | CMOS 8-BIT SINGLE-CHIP MICROCOMPUTER (TLCS-48C) | CMOS 8-BIT SINGLE-CHIP MICROCOMPUTER (TLCS-48C) | CMOS 8-BIT SINGLE-CHIP MICROCOMPUTER (TLCS-48C) |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | - | incompatible | incompatible |
| Maker | Toshiba Semiconductor | - | Toshiba Semiconductor | - | - | Toshiba Semiconductor | Toshiba Semiconductor |
| Parts packaging code | DIP | QFP | DIP | QFP | - | DIP | DIP |
| package instruction | PLASTIC, DIP-40 | 10 X 10 MM, MICRO, PLASTIC, QFP-44 | PLASTIC, DIP-40 | QFP, | - | PLASTIC, DIP-40 | DIP, DIP40,.6 |
| Contacts | 40 | 44 | 40 | 44 | - | 40 | 40 |
| Reach Compliance Code | unknown | unknow | unknow | unknow | - | unknow | unknown |
| Has ADC | NO | NO | NO | NO | - | NO | NO |
| Address bus width | 12 | 12 | 12 | 12 | - | 12 | 12 |
| bit size | 8 | 8 | 8 | 8 | - | 8 | 8 |
| maximum clock frequency | 11 MHz | 6 MHz | 6 MHz | 11 MHz | - | 11 MHz | 6 MHz |
| DAC channel | NO | NO | NO | NO | - | NO | NO |
| DMA channel | NO | NO | NO | NO | - | NO | NO |
| External data bus width | 8 | 8 | 8 | 8 | - | 8 | 8 |
| JESD-30 code | R-PDIP-T40 | S-PQFP-G44 | R-PDIP-T40 | S-PQFP-G44 | - | R-PDIP-T40 | R-PDIP-T40 |
| JESD-609 code | e0 | e0 | e0 | e0 | - | e0 | e0 |
| length | 52.07 mm | 10 mm | 52.07 mm | 10 mm | - | 52.07 mm | 52.07 mm |
| Number of I/O lines | 19 | 27 | 27 | 27 | - | 27 | 19 |
| Number of terminals | 40 | 44 | 40 | 44 | - | 40 | 40 |
| Maximum operating temperature | 70 °C | 85 °C | 80 °C | 85 °C | - | 70 °C | 80 °C |
| Minimum operating temperature | - | -40 °C | -40 °C | -40 °C | - | - | -40 °C |
| PWM channel | NO | NO | NO | NO | - | NO | NO |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | QFP | DIP | QFP | - | DIP | DIP |
| Package shape | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | - | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | FLATPACK | IN-LINE | FLATPACK | - | IN-LINE | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | - | 240 | NOT SPECIFIED | - | NOT SPECIFIED | 240 |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| Maximum seat height | 5.08 mm | 3.05 mm | 5.08 mm | 3.05 mm | - | 5.08 mm | 5.08 mm |
| speed | 11 MHz | 6 MHz | 6 MHz | - | - | 11 MHz | 6 MHz |
| Maximum slew rate | 15 mA | 10 mA | 10 mA | 15 mA | - | 15 mA | 10 mA |
| Maximum supply voltage | 5.5 V | 6 V | 6 V | 5.5 V | - | 5.5 V | 6 V |
| Minimum supply voltage | 4.5 V | 4 V | 4 V | 4.5 V | - | 4.5 V | 4 V |
| Nominal supply voltage | 5 V | 5 V | 5 V | - | - | 5 V | 5 V |
| surface mount | NO | YES | NO | YES | - | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | - | CMOS | CMOS |
| Temperature level | COMMERCIAL | INDUSTRIAL | OTHER | INDUSTRIAL | - | COMMERCIAL | OTHER |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | - | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 0.8 mm | 2.54 mm | 0.8 mm | - | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | QUAD | DUAL | QUAD | - | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| width | 15.24 mm | 10 mm | 15.24 mm | 10 mm | - | 15.24 mm | 15.24 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | - | MICROCONTROLLER | MICROCONTROLLER |
| Base Number Matches | 1 | 1 | - | 1 | - | - | 1 |
| ROM programmability | - | MROM | MROM | MROM | - | MROM | - |
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