CMOS 4-BIT MICROCONTROLLER
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Toshiba Semiconductor |
| Parts packaging code | DIP |
| package instruction | SDIP, |
| Contacts | 64 |
| Reach Compliance Code | unknow |
| Has ADC | YES |
| Address bus width | |
| bit size | 4 |
| maximum clock frequency | 6 MHz |
| DAC channel | NO |
| DMA channel | NO |
| External data bus width | |
| JESD-30 code | R-PDIP-T64 |
| JESD-609 code | e0 |
| length | 57.5 mm |
| Number of I/O lines | 56 |
| Number of terminals | 64 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | -40 °C |
| PWM channel | NO |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SDIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE, SHRINK PITCH |
| Certification status | Not Qualified |
| ROM programmability | OTPROM |
| Maximum seat height | 5 mm |
| Maximum slew rate | 10 mA |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 4.5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | OTHER |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 1.778 mm |
| Terminal location | DUAL |
| width | 19.05 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
| TMP47P860N | TMP47P860F | TMP47P860 | |
|---|---|---|---|
| Description | CMOS 4-BIT MICROCONTROLLER | CMOS 4-BIT MICROCONTROLLER | CMOS 4-BIT MICROCONTROLLER |
| Is it Rohs certified? | incompatible | incompatible | - |
| Maker | Toshiba Semiconductor | Toshiba Semiconductor | - |
| Parts packaging code | DIP | QFP | - |
| package instruction | SDIP, | QFP, | - |
| Contacts | 64 | 64 | - |
| Reach Compliance Code | unknow | unknow | - |
| Has ADC | YES | YES | - |
| JESD-30 code | R-PDIP-T64 | S-PQFP-G64 | - |
| JESD-609 code | e0 | e0 | - |
| length | 57.5 mm | 14 mm | - |
| Number of I/O lines | 56 | 56 | - |
| Number of terminals | 64 | 64 | - |
| Maximum operating temperature | 70 °C | 70 °C | - |
| Minimum operating temperature | -40 °C | -40 °C | - |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| encapsulated code | SDIP | QFP | - |
| Package shape | RECTANGULAR | SQUARE | - |
| Package form | IN-LINE, SHRINK PITCH | FLATPACK | - |
| Certification status | Not Qualified | Not Qualified | - |
| ROM programmability | OTPROM | OTPROM | - |
| Maximum seat height | 5 mm | 3.15 mm | - |
| Maximum supply voltage | 5.5 V | 6 V | - |
| Minimum supply voltage | 4.5 V | 4.5 V | - |
| surface mount | NO | YES | - |
| technology | CMOS | CMOS | - |
| Temperature level | OTHER | OTHER | - |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| Terminal form | THROUGH-HOLE | GULL WING | - |
| Terminal pitch | 1.778 mm | 0.8 mm | - |
| Terminal location | DUAL | QUAD | - |
| width | 19.05 mm | 14 mm | - |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER | MICROCONTROLLER | - |
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