|
TMP47C850N |
TMP47C850 |
TMP47C850F |
| Description |
CMOS 4-BIT MICROCONTROLLER |
CMOS 4-BIT MICROCONTROLLER |
CMOS 4-BIT MICROCONTROLLER |
| Is it Rohs certified? |
incompatible |
- |
incompatible |
| Maker |
Toshiba Semiconductor |
- |
Toshiba Semiconductor |
| Parts packaging code |
DIP |
- |
QFP |
| package instruction |
SDIP, SDIP64,.75 |
- |
QFP, QFP64,.7X.95,40 |
| Contacts |
64 |
- |
64 |
| Reach Compliance Code |
unknow |
- |
unknow |
| Has ADC |
YES |
- |
YES |
| Other features |
ALSO OPERATES AT 2.7V MINIMUM SUPPLY |
- |
ALSO OPERATES AT 2.7V MINIMUM SUPPLY |
| bit size |
4 |
- |
4 |
| CPU series |
TLCS-470 |
- |
TLCS-470 |
| maximum clock frequency |
3.5831 MHz |
- |
3.5831 MHz |
| DAC channel |
NO |
- |
NO |
| DMA channel |
NO |
- |
NO |
| JESD-30 code |
R-PDIP-T64 |
- |
R-PQFP-G64 |
| length |
57.5 mm |
- |
20 mm |
| Number of I/O lines |
51 |
- |
51 |
| Number of terminals |
64 |
- |
64 |
| Maximum operating temperature |
60 °C |
- |
60 °C |
| Minimum operating temperature |
-30 °C |
- |
-30 °C |
| PWM channel |
NO |
- |
NO |
| Package body material |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
| encapsulated code |
SDIP |
- |
QFP |
| Encapsulate equivalent code |
SDIP64,.75 |
- |
QFP64,.7X.95,40 |
| Package shape |
RECTANGULAR |
- |
RECTANGULAR |
| Package form |
IN-LINE, SHRINK PITCH |
- |
FLATPACK |
| Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
- |
NOT SPECIFIED |
| power supply |
3/5 V |
- |
3/5 V |
| Certification status |
Not Qualified |
- |
Not Qualified |
| RAM (bytes) |
256 |
- |
256 |
| rom(word) |
8192 |
- |
8192 |
| ROM programmability |
MROM |
- |
MROM |
| Maximum seat height |
5 mm |
- |
3.05 mm |
| speed |
3.5831 MHz |
- |
3.5831 MHz |
| Maximum slew rate |
14 mA |
- |
14 mA |
| Maximum supply voltage |
5.5 V |
- |
5.5 V |
| Minimum supply voltage |
4.5 V |
- |
4.5 V |
| Nominal supply voltage |
5 V |
- |
5 V |
| surface mount |
NO |
- |
YES |
| technology |
CMOS |
- |
CMOS |
| Temperature level |
OTHER |
- |
OTHER |
| Terminal form |
THROUGH-HOLE |
- |
GULL WING |
| Terminal pitch |
1.778 mm |
- |
1 mm |
| Terminal location |
DUAL |
- |
QUAD |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
- |
NOT SPECIFIED |
| width |
19.05 mm |
- |
14 mm |
| uPs/uCs/peripheral integrated circuit type |
MICROCONTROLLER |
- |
MICROCONTROLLER |