CMOS 4-BIT MICROCONTROLLER
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Toshiba Semiconductor |
| Parts packaging code | DIP |
| package instruction | SDIP, |
| Contacts | 30 |
| Reach Compliance Code | unknow |
| Has ADC | YES |
| Address bus width | |
| bit size | 4 |
| maximum clock frequency | 4.2 MHz |
| DAC channel | NO |
| DMA channel | NO |
| External data bus width | |
| JESD-30 code | R-PDIP-T30 |
| JESD-609 code | e0 |
| length | 27.4 mm |
| Number of I/O lines | 21 |
| Number of terminals | 30 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | -20 °C |
| PWM channel | YES |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SDIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE, SHRINK PITCH |
| Certification status | Not Qualified |
| ROM programmability | MROM |
| Maximum seat height | 4.45 mm |
| Maximum slew rate | 6 mA |
| Maximum supply voltage | 6 V |
| Minimum supply voltage | 4.5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 1.778 mm |
| Terminal location | DUAL |
| width | 10.16 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
| TMP47C236AN | TMP47C336AN | |
|---|---|---|
| Description | CMOS 4-BIT MICROCONTROLLER | CMOS 4-BIT MICROCONTROLLER |
| Maker | Toshiba Semiconductor | Toshiba Semiconductor |
| Parts packaging code | DIP | DIP |
| package instruction | SDIP, | SDIP, |
| Contacts | 30 | 30 |
| Reach Compliance Code | unknow | unknow |
| Has ADC | YES | YES |
| bit size | 4 | 4 |
| maximum clock frequency | 4.2 MHz | 4.2 MHz |
| DAC channel | NO | NO |
| DMA channel | NO | NO |
| JESD-30 code | R-PDIP-T30 | R-PDIP-T30 |
| length | 27.4 mm | 27.4 mm |
| Number of I/O lines | 21 | 21 |
| Number of terminals | 30 | 30 |
| Maximum operating temperature | 70 °C | 70 °C |
| Minimum operating temperature | -20 °C | -20 °C |
| PWM channel | YES | YES |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SDIP | SDIP |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE, SHRINK PITCH | IN-LINE, SHRINK PITCH |
| Certification status | Not Qualified | Not Qualified |
| ROM programmability | MROM | MROM |
| Maximum seat height | 4.45 mm | 4.45 mm |
| Maximum slew rate | 6 mA | 6 mA |
| Maximum supply voltage | 6 V | 6 V |
| Minimum supply voltage | 4.5 V | 4.5 V |
| surface mount | NO | NO |
| technology | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 1.778 mm | 1.778 mm |
| Terminal location | DUAL | DUAL |
| width | 10.16 mm | 10.16 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER | MICROCONTROLLER |