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AS7C33256PFS32A-133TQCN

Description
3.3V 256K x 32/36 pipelined burst synchronous SRAM
Categorystorage    storage   
File Size507KB,20 Pages
ManufacturerALSC [Alliance Semiconductor Corporation]
Environmental Compliance
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AS7C33256PFS32A-133TQCN Overview

3.3V 256K x 32/36 pipelined burst synchronous SRAM

AS7C33256PFS32A-133TQCN Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerALSC [Alliance Semiconductor Corporation]
Parts packaging codeQFP
package instructionLQFP, QFP100,.63X.87
Contacts100
Reach Compliance Codeunknow
ECCN code3A991.B.2.A
Maximum access time10 ns
Other featuresFLOW-THROUGH OR PIPELINED ARCHITECTURE
I/O typeCOMMON
JESD-30 codeR-PQFP-G100
JESD-609 codee3
length20 mm
memory density8388608 bi
Memory IC TypeSTANDARD SRAM
memory width32
Number of functions1
Number of terminals100
word count262144 words
character code256000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX32
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeLQFP
Encapsulate equivalent codeQFP100,.63X.87
Package shapeRECTANGULAR
Package formFLATPACK, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)245
power supply2.5/3.3,3.3 V
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum standby current0.03 A
Minimum standby current3.14 V
Maximum slew rate0.425 mA
Maximum supply voltage (Vsup)3.465 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceMATTE TIN
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationQUAD
Maximum time at peak reflow temperature30
width14 mm
November 2004
®
AS7C33256PFS32A
AS7C33256PFS36A
3.3V 256K
×
32/36 pipelined burst synchronous SRAM
Features
Organization: 262,144 words x 32 or 36 bits
Fast clock speeds to 166 MHz
Fast clock to data access: 3.5/4.0 ns
Fast OE access time: 3.5/4.0 ns
Fully synchronous register-to-register operation
Single-cycle deselect
Asynchronous output enable control
Available in100-pin TQFP
Individual byte write and global write
Multiple chip enables for easy expansion
3.3V core power supply
2.5V or 3.3V I/O operation with separate V
DDQ
Linear or interleaved burst control
Snooze mode for reduced power-standby
Common data inputs and data outputs
30 mW typical standby power in power down mode
Logic block diagram
LBO
CLK
ADV
ADSC
ADSP
A[17:0]
18
Q0
Burst logic
Q1
18 2 16
D
Q
CE
Address
register
CLK
D
DQ
d
Q
Byte write
registers
CLK
D
DQ
Q
c
Byte write
registers
CLK
D
DQ
b
Q
Byte write
registers
CLK
D
DQ
Q
a
Byte write
registers
CLK
D
Enable
CE
register
CLK
Q
CLK
CE
CLR
2 18
256K × 32/36
Memory
array
BWE
GWE
36/32
36/32
BW
d
BW
c
BW
b
BW
a
CE0
CE1
CE2
4
OE
Output
registers
CLK
Input
registers
CLK
ZZ
Power
down
D
Enable
Q
delay
register
CLK
36/32
DQ[a:d]
OE
Selection guide
–166
Minimum cycle time
Maximum clock frequency
Maximum clock access time
Maximum operating current
Maximum standby current
Maximum CMOS standby current (DC)
11/30/04, v.3.1
–133
7.5
133
4
425
100
30
Units
ns
MHz
ns
mA
mA
mA
P. 1 of 20
6
166
3.5
475
130
30
Alliance Semiconductor
Copyright ©Alliance Semiconductor. All rights reserved.
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