LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LUG3330
Page 1/4
Package Dimensions
5.0
5.9
7.6
8.6
1.5MAX
□
0.5
TYP
25.0MIN
1.0MIN
2.54TYP
Note : 1.All dimension are in millimeter tolerance is
±
0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
Directivity Radiation
0
°
-30
°
30
°
-60
°
60
°
100%
75%
50%
25%
0
25%
50%
75% 100%
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LUG3330
Page 2/4
Absolute Maximum Ratings at Ta=25
℃
Ratings
Parameter
Symbol
UG
Forward Current
Peak Forward Current
Duty 1/10@10KHz
Power Dissipation
Reverse Current @5V
Electrostatic Discharge
Operating Temperature
Storage Temperature
Soldering Temperature
I
F
I
FP
PD
Ir
ESD
T
opr
Tstg
Tsol
30
120
100
10
2000
-40 ~ +85
-40 ~ +100
Max 260
℃
for 5 sec Max
(2mm from body)
mA
mA
mW
UNIT
μ
A
V
℃
℃
Typical Electrical & Optical Characteristics (Ta=25
℃
)
PART NO
MATERIAL
Emitted
COLOR
Forward
Dominant
Spectral
voltage
wave
halfwidth
length
△λ
nm
@ 20mA(V)
λ
Dnm
Luminous
intensity
@20mA(mcd)
Viewing
angle
2
θ
1/2
(deg)
Lens
574
20
Min. Max. Min.
1.7
2.6
160
Typ.
260
36
LUG3330
AlGaInP
Green Green Diffused
Note : 1.The forward voltage data did not including
±
0.1V testing tolerance.
2. The luminous intensity data did not including
±
15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LUG3330
Page3/4
Typical Electro-Optical Characteristics Curve
UG CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
1000
3.0
Forward Current(mA)
100
10
Relative Intensity
Normalize @20mA
1.0
2.0
3.0
4.0
5.0
2.5
2.0
1.5
1.0
0.5
0.0
1.0
10
100
1000
1.0
0.1
Forward Voltage(V)
Fig.3 Forward Voltage vs. Temperature
1.2
Forward Current(mA)
Fig.4 Relative Intensity vs. Temperature
3.0
Forward Voltage@20mA
Normalize @25
℃
Relative Intensity@20mA
Normalize @25
℃
-40
-20
0
20
40
60
80
100
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
80
100
1.1
1.0
0.9
0.8
Ambient Temperature(
℃
)
Ambient Temperature(
℃
)
Fig.5 Relative Intensity vs. Wavelength
1.0
Relative Intensity@20mA
0.5
0.0
500
550
600
650
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LUG3330
Page 4/4
Reliability Test:
Test Item
Test Condition
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
Description
This test is conducted for the purpose
of detemining the resisance of a part
in electrical and themal stressed.
Reference
Standard
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
Operating Life Test
High Temperature
Storage Test
1.Ta=105
℃±
5
℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under ondition
of high temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40
℃±
5
℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
JIS C 7021: B-12
High Temperature
High Humidity Test
1.Ta=65
℃±
5
℃
2.RH=90 %~95 %
3.t=240hrs
±
2hrs
The purpose of this test is the resistance
of the device under tropical for hous.
MIL-STD-202:103B
JIS C 7021: B-11
Thermal Shock Test
1.Ta=105
℃±
5
℃
&-40
℃±
5
℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260
℃±
5
℃
2.Dwell time= 10
±
1sec.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230
℃±
5
℃
2.Dwell time=5
±
1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
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