AS7C33512NTD18A-133TQIN datasheet, PDF

Datasheet> All Categories > storage> storage> AS7C33512NTD18A-133TQIN

AS7C33512NTD18A-133TQIN: Description3.3V 512K x 18 Pipelined burst Synchronous SRAM with NTD; Categorystorage storage; File Size429KB，19 Pages; ManufacturerALSC [Alliance Semiconductor Corporation]; Environmental Compliance

Download Datasheet Parametric Compare View All

AS7C33512NTD18A-133TQIN Overview

3.3V 512K x 18 Pipelined burst Synchronous SRAM with NTD

AS7C33512NTD18A-133TQIN Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	ALSC [Alliance Semiconductor Corporation]
Parts packaging code	QFP
package instruction	LQFP, QFP100,.63X.87
Contacts	100
Reach Compliance Code	unknow
ECCN code	3A991.B.2.A
Maximum access time	4.5 ns
Other features	PIPELINED ARCHITECTURE; LATE WRITE
Maximum clock frequency (fCLK)	133 MHz
I/O type	COMMON
JESD-30 code	R-PQFP-G100
JESD-609 code	e3
length	20 mm
memory density	9437184 bi
Memory IC Type	ZBT SRAM
memory width	18
Number of functions	1
Number of terminals	100
word count	524288 words
character code	512000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	512KX18
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	LQFP
Encapsulate equivalent code	QFP100,.63X.87
Package shape	RECTANGULAR
Package form	FLATPACK, LOW PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	245
power supply	2.5/3.3,3.3 V
Certification status	Not Qualified
Maximum seat height	1.6 mm
Maximum standby current	0.03 A
Minimum standby current	3.14 V
Maximum slew rate	0.4 mA
Maximum supply voltage (Vsup)	3.465 V
Minimum supply voltage (Vsup)	3.135 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	MATTE TIN
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	30
width	14 mm

Preview

Download Datasheet

View All

November 2004

AS7C33512NTD18A

3.3V 512K

18 Pipelined burst Synchronous SRAM with NTD

Features

• Organization: 524,288 words × 18 bits

• NTD

™

architecture for efficient bus operation

• Fast clock speeds to 166 MHz

• Fast clock to data access: 3.5/4.0 ns

• Fast OE access time: 3.5/4.0 ns

• Fully synchronous operation

• Common data inputs and data outputs

• Asynchronous output enable control

• Available in100-pin TQFP

• Byte write enables

• Clock enable for operation hold

• Multiple chip enables for easy expansion

• 3.3V core power supply

• 2.5V or 3.3V I/O operation with separate V

DDQ

• Self-timed WRITE cycles

• “Interleaved” or “Linear burst” modes

• Snooze mode for standby operation

Logic block diagram

A[18:0]

Address

Burst logic

CLK

CE0

CE1

CE2

R/W

BWa

BWb

ADV/LD

LBO

CLK

Write delay

addr. registers

CLK

Control

logic

CLK

Write Buffer

512K x 18

SRAM

Array

DQ [a:b]

Data

Input

CLK

CEN

CLK

Output

DQ[a:b]

Selection Guide

-166

Minimum cycle time

Maximum clock frequency

Maximum clock access time

Maximum operating current

Maximum standby current

Maximum CMOS standby current (DC)

11/30/04

;

v.2.1

–133

7.5

133

400

100

Units

MHz

1 of 19

166

3.5

475

130

Alliance Semiconductor

AS7C33512NTD18A-133TQIN Related Products

	AS7C33512NTD18A-133TQIN	AS7C33512NTD18A	AS7C33512NTD18A-133TQC	AS7C33512NTD18A-133TQCN	AS7C33512NTD18A-133TQI	AS7C33512NTD18A-166TQCN	AS7C33512NTD18A-166TQC	AS7C33512NTD18A-166TQIN	AS7C33512NTD18A-166TQI
Description	3.3V 512K x 18 Pipelined burst Synchronous SRAM with NTD	3.3V 512K x 18 Pipelined burst Synchronous SRAM with NTD	3.3V 512K x 18 Pipelined burst Synchronous SRAM with NTD	3.3V 512K x 18 Pipelined burst Synchronous SRAM with NTD	3.3V 512K x 18 Pipelined burst Synchronous SRAM with NTD	3.3V 512K x 18 Pipelined burst Synchronous SRAM with NTD	3.3V 512K x 18 Pipelined burst Synchronous SRAM with NTD	3.3V 512K x 18 Pipelined burst Synchronous SRAM with NTD	3.3V 512K x 18 Pipelined burst Synchronous SRAM with NTD
Is it Rohs certified?	conform to	-	incompatible	conform to	incompatible	conform to	incompatible	conform to	incompatible
Maker	ALSC [Alliance Semiconductor Corporation]	-	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]
Parts packaging code	QFP	-	QFP	QFP	QFP	QFP	QFP	QFP	QFP
package instruction	LQFP, QFP100,.63X.87	-	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87
Contacts	100	-	100	100	100	100	100	100	100
Reach Compliance Code	unknow	-	unknow	unknow	unknow	unknow	unknow	unknow	unknow
ECCN code	3A991.B.2.A	-	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Maximum access time	4.5 ns	-	4.5 ns	4.5 ns	4.5 ns	4 ns	4 ns	4 ns	4 ns
Other features	PIPELINED ARCHITECTURE; LATE WRITE	-	PIPELINED ARCHITECTURE; LATE WRITE	PIPELINED ARCHITECTURE; LATE WRITE	PIPELINED ARCHITECTURE; LATE WRITE	PIPELINED ARCHITECTURE; LATE WRITE	PIPELINED ARCHITECTURE; LATE WRITE	PIPELINED ARCHITECTURE; LATE WRITE	PIPELINED ARCHITECTURE; LATE WRITE
Maximum clock frequency (fCLK)	133 MHz	-	133 MHz	133 MHz	133 MHz	166 MHz	166 MHz	166 MHz	166 MHz
I/O type	COMMON	-	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PQFP-G100	-	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100
JESD-609 code	e3	-	e0	e3	e0	e3	e0	e3	e0
length	20 mm	-	20 mm	20 mm	20 mm	20 mm	20 mm	20 mm	20 mm
memory density	9437184 bi	-	9437184 bi	9437184 bi	9437184 bi	9437184 bi	9437184 bi	9437184 bi	9437184 bi
Memory IC Type	ZBT SRAM	-	ZBT SRAM	ZBT SRAM	ZBT SRAM	ZBT SRAM	ZBT SRAM	ZBT SRAM	ZBT SRAM
memory width	18	-	18	18	18	18	18	18	18
Number of functions	1	-	1	1	1	1	1	1	1
Number of terminals	100	-	100	100	100	100	100	100	100
word count	524288 words	-	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words
character code	512000	-	512000	512000	512000	512000	512000	512000	512000
Operating mode	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	-	70 °C	70 °C	85 °C	70 °C	70 °C	85 °C	85 °C
organize	512KX18	-	512KX18	512KX18	512KX18	512KX18	512KX18	512KX18	512KX18
Output characteristics	3-STATE	-	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LQFP	-	LQFP	LQFP	LQFP	LQFP	LQFP	LQFP	LQFP
Encapsulate equivalent code	QFP100,.63X.87	-	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87
Package shape	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	FLATPACK, LOW PROFILE	-	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE
Parallel/Serial	PARALLEL	-	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	245	-	NOT SPECIFIED	245	NOT SPECIFIED	245	NOT SPECIFIED	245	NOT SPECIFIED
power supply	2.5/3.3,3.3 V	-	2.5/3.3,3.3 V	2.5/3.3,3.3 V	2.5/3.3,3.3 V	2.5/3.3,3.3 V	2.5/3.3,3.3 V	2.5/3.3,3.3 V	2.5/3.3,3.3 V
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.6 mm	-	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm
Maximum standby current	0.03 A	-	0.03 A	0.03 A	0.03 A	0.03 A	0.03 A	0.03 A	0.03 A
Minimum standby current	3.14 V	-	3.14 V	3.14 V	3.14 V	3.14 V	3.14 V	3.14 V	3.14 V
Maximum slew rate	0.4 mA	-	0.4 mA	0.4 mA	0.4 mA	0.475 mA	0.475 mA	0.475 mA	0.475 mA
Maximum supply voltage (Vsup)	3.465 V	-	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V
Minimum supply voltage (Vsup)	3.135 V	-	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V
Nominal supply voltage (Vsup)	3.3 V	-	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	-	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	-	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	MATTE TIN	-	Tin/Lead (Sn/Pb)	MATTE TIN	Tin/Lead (Sn/Pb)	MATTE TIN	Tin/Lead (Sn/Pb)	MATTE TIN	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	-	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.65 mm	-	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm
Terminal location	QUAD	-	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	30	-	NOT SPECIFIED	30	NOT SPECIFIED	30	NOT SPECIFIED	30	NOT SPECIFIED
width	14 mm	-	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm

Recommended Resources

Even-numbered voltage doubler full-wave rectifier circuit d

Charging current adjustment circuit

Overload indicator circuit diagram

Negative reference voltage circuit diagram

Diyuan NTK-35D temperature regulating electric iron circuit diagram

Emitter amplitude modulation circuit

Discussion: Can the COVID-19 pandemic help companies related to 5G and wifi6 technology? Get 5-20 Chip Points!: The COVID-19 pandemic is a black swan that has unexpectedly hit the entire China. Today we will not talk about the medical staff who are on the front line, nor the various social forces running in the...; EEWORLD社区 RF/Wirelessly

Is this installed? ? ? Genuine rookie: First of all, I would like to thank the author of the video http://www.rtoslab.net/upload/2008/1/ Installing VxWorks Operating System on VMWare (Original Video).swf. I have completed the installation ...; cbl_rfid Embedded System

Analysis of RF Measurement Technology in the 4G Era: Due to the advantages of mobility and cost, the number of new users and new services in the field of wireless communication continues to increase, and the market demand for wireless communication tech...; kandy2059 Test/Measurement

Audio driver development emergency: Looking for help from experts: an audio driver in user layer, but need to rewrite USB audio driver, and then call, a bit like minidriver or com. There are related SDK documents, and finally generate E...; 三生石 Embedded System

Digital or analog power supply?: [align=left][color=rgb(82,82,82)][font=Arial, sans-serif][size=12px][b][size=5]An Engineer's Perspective By: Chris Hossack, PhD, Biricha Power Director, Texas Instruments (TI), and Richard Poley, TI F...; qwqwqw2088 Analogue and Mixed Signal

C51 shift problem solution: Background: We know that in assembly programs, there are instructions for shifting bytes or words, RRL and RRC. But in C language, how to shift data? For example, if I want to shift 20 bytes at a time...; eeleader 51mcu

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

Popular Components