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W2A21C102MAT2A

Description
Array/Network Capacitor, 100V, X7R, 0.001uF, Surface Mount, CHIP-4, CHIP, ROHS COMPLIANT
CategoryPassive components    capacitor   
File Size287KB,6 Pages
ManufacturerAVX
Environmental Compliance  
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W2A21C102MAT2A Overview

Array/Network Capacitor, 100V, X7R, 0.001uF, Surface Mount, CHIP-4, CHIP, ROHS COMPLIANT

W2A21C102MAT2A Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerAVX
package instructionCHIP,
Reach Compliance Codecompliant
ECCN codeEAR99
Factory Lead Time18 weeks
capacitance0.001 µF
Capacitor typeARRAY/NETWORK CAPACITOR
JESD-609 codee3
length2.1 mm
Installation featuresSURFACE MOUNT
negative tolerance20%
Network TypeISOLATED C NETWORK
Number of components1
Number of functions2
Number of terminals4
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
encapsulated codeCHIP
Package shapeRECTANGULAR PACKAGE
method of packingTR, PAPER, 7 INCH
positive tolerance20%
Rated (DC) voltage (URdc)100 V
Maximum seat height0.94 mm
surface mountYES
Temperature characteristic codeX7R
Temperature Coefficient15% ppm/°C
Terminal surfaceMatte Tin (Sn) - with Nickel (Ni) barrier
Terminal pitch1 mm
Terminal shapeWRAPAROUND
width1.3 mm
Capacitor Array
Capacitor Array (IPC)
BENEFITS OF USING CAPACITOR
ARRAYS
AVX capacitor arrays offer designers the opportunity to
lower placement costs, increase assembly line output
through lower component count per board and to reduce
real estate requirements.
For high volume users of cap arrays using the very latest
placement equipment capable of placing 10 components per
second, the increase in throughput can be very significant and
can have the overall effect of reducing the number of place-
ment machines required to mount components:
If 120 million 2-element arrays or 40 million 4-element arrays
were placed in a year, the requirement for placement
equipment would be reduced by one machine.
During a 20Hr operational day a machine places 720K
components. Over a working year of 167 days the machine
can place approximately 120 million. If 2-element arrays are
mounted instead of discrete components, then the number
of placements is reduced by a factor of two and in the
scenario where 120 million 2-element arrays are placed there
is a saving of one pick and place machine.
Smaller volume users can also benefit from replacing
discrete components with arrays. The total number of place-
ments is reduced thus creating spare capacity on placement
machines. This in turn generates the opportunity to increase
overall production output without further investment in new
equipment.
Reduced Costs
Placement costs are greatly reduced by effectively placing
one device instead of four or two. This results in increased
throughput and translates into savings on machine time.
Inventory levels are lowered and further savings are made
on solder materials, etc.
Space Saving
Space savings can be quite dramatic when compared to
the use of discrete chip capacitors. As an example, the
0508 4-element array offers a space reduction of >40% vs.
4 x 0402 discrete capacitors and of >70% vs. 4 x 0603
discrete capacitors. (This calculation is dependent on the
spacing of the discrete components.)
Increased Throughput
Assuming that there are 220 passive components placed in a
mobile phone:
A reduction in the passive count to 200 (by replacing
discrete components with arrays) results in an increase in
throughput of approximately 9%.
A reduction of 40 placements increases throughput by 18%.
W2A (0508) Capacitor Arrays
4 pcs 0402 Capacitors
=
1 pc 0508 Array
1.4
1.0
(0.055) (0.039)
1.88
(0.074)
5.0 (0.197)
AREA = 7.0mm
2
(0.276 in
2
)
2.1 (0.083)
AREA = 3.95mm
2
(0.156 in
2
)
The 0508 4-element capacitor array gives a PCB space saving of over 40%
vs four 0402 discretes and over 70% vs four 0603 discrete capacitors.
W3A (0612) Capacitor Arrays
4 pcs 0603 Capacitors
=
1 pc 0612 Array
2.3
1.5
(0.091) (0.059)
2.0
(0.079)
6.0 (0.236)
AREA = 13.8mm
2
(0.543 in
2
)
3.2 (0.126)
AREA = 6.4mm
2
(0.252 in
2
)
The 0612 4-element capacitor array gives a PCB space saving of over 50%
vs four 0603 discretes and over 70% vs four 0805 discrete capacitors.
60

W2A21C102MAT2A Related Products

W2A21C102MAT2A PHCR10020156KKB W2A4ZC104KAT2A W3A4YC104MAT2A W2A4YC102MAT2A
Description Array/Network Capacitor, 100V, X7R, 0.001uF, Surface Mount, CHIP-4, CHIP, ROHS COMPLIANT Fixed Resistor, Metal Glaze/thick Film, 2W, 15000000ohm, 5000V, 10% +/-Tol, 100ppm/Cel, Surface Mount, CHIP, ROHS COMPLIANT Array/Network Capacitor, 10V, X7R, 0.1uF, Surface Mount, CHIP-8, CHIP, ROHS COMPLIANT Array/Network Capacitor, 16V, X7R, 0.1uF, Surface Mount, CHIP-8, CHIP, ROHS COMPLIANT Array/Network Capacitor, 16V, X7R, 0.001uF, Surface Mount, CHIP-8, CHIP, ROHS COMPLIANT
Is it lead-free? Lead free Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to conform to
package instruction CHIP, CHIP, ROHS COMPLIANT CHIP, CHIP, ROHS COMPLIANT CHIP,
Reach Compliance Code compliant compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99
JESD-609 code e3 e3 e3 e3 e3
Installation features SURFACE MOUNT SURFACE MOUNT SURFACE MOUNT SURFACE MOUNT SURFACE MOUNT
Number of terminals 4 2 8 8 8
Maximum operating temperature 125 °C 150 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C
Package shape RECTANGULAR PACKAGE RECTANGULAR PACKAGE RECTANGULAR PACKAGE RECTANGULAR PACKAGE RECTANGULAR PACKAGE
method of packing TR, PAPER, 7 INCH BULK TR, EMBOSSED/PAPER, 7 INCH TR, EMBOSSED/PAPER, 7 INCH TR, EMBOSSED/PAPER, 7 INCH
surface mount YES YES YES YES YES
Temperature Coefficient 15% ppm/°C 100 ppm/°C 15% ppm/°C 15% ppm/°C 15% ppm/°C
Terminal surface Matte Tin (Sn) - with Nickel (Ni) barrier Matte Tin (Sn) - with Nickel (Ni) barrier Matte Tin (Sn) - with Nickel (Ni) barrier Matte Tin (Sn) - with Nickel (Ni) barrier Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal shape WRAPAROUND WRAPAROUND WRAPAROUND WRAPAROUND WRAPAROUND
Maker AVX - - AVX AVX
Factory Lead Time 18 weeks - - 18 weeks 18 weeks
capacitance 0.001 µF - 0.1 µF 0.1 µF 0.001 µF
Capacitor type ARRAY/NETWORK CAPACITOR - ARRAY/NETWORK CAPACITOR ARRAY/NETWORK CAPACITOR ARRAY/NETWORK CAPACITOR
length 2.1 mm - 2.1 mm 3.2 mm 2.1 mm
negative tolerance 20% - 10% 20% 20%
Network Type ISOLATED C NETWORK - ISOLATED C NETWORK ISOLATED C NETWORK ISOLATED C NETWORK
Number of components 1 - 1 1 1
Number of functions 2 - 4 4 4
encapsulated code CHIP - CHIP CHIP CHIP
positive tolerance 20% - 10% 20% 20%
Rated (DC) voltage (URdc) 100 V - 10 V 16 V 16 V
Maximum seat height 0.94 mm - 0.94 mm 1.35 mm 0.94 mm
Temperature characteristic code X7R - X7R X7R X7R
Terminal pitch 1 mm - 0.5 mm 0.76 mm 0.5 mm
width 1.3 mm - 1.3 mm 1.6 mm 1.3 mm

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