4309T-101-1102DB datasheet, PDF

Datasheet> All Categories > Passive components> The resistor> 4309T-101-1102DB

4309T-101-1102DB: DescriptionArray/Network Resistor, Bussed, Thin Film, 1.13W, 11000ohm, 50V, 0.5% +/-Tol, 50ppm/Cel, Through Hole Mount, 8808, SIP; CategoryPassive components The resistor; File Size198KB，2 Pages; ManufacturerBourns; Websitehttp://www.bourns.com

Download Datasheet Parametric View All

4309T-101-1102DB Overview

Array/Network Resistor, Bussed, Thin Film, 1.13W, 11000ohm, 50V, 0.5% +/-Tol, 50ppm/Cel, Through Hole Mount, 8808, SIP

4309T-101-1102DB Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Bourns
package instruction	SIP
Reach Compliance Code	not_compliant
ECCN code	EAR99
structure	Molded
Component power consumption	0.1 W
The first element resistor	11000 Ω
JESD-609 code	e0
Lead length	3.43 mm
lead spacing	2.54 mm
Manufacturer's serial number	4300T
Installation features	THROUGH HOLE MOUNT
Network Type	BUSSED
Number of components	8
Number of functions	1
Number of terminals	9
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package height	4.95 mm
Package length	22.45 mm
Package shape	RECTANGULAR PACKAGE
Package form	SIP
Package width	2.16 mm
Rated power dissipation(P)	1.13 W
Rated temperature	70 °C
resistance	11000 Ω
Resistor type	ARRAY/NETWORK RESISTOR
series	4300T
size code	8808
surface mount	NO
technology	THIN FILM
Temperature Coefficient	50 ppm/°C
Temperature coefficient tracking	5 ppm/°C
Terminal surface	Tin/Lead (Sn/Pb)
Terminal shape	FLAT
Tolerance	0.5%
Operating Voltage	50 V

Preview

Download Datasheet

View All

VE S CO

AV R M

AI SIO PL

LA N IA

BL S NT

Features

■

RoHS compliant* (see How to Order

“Termination” option)

Low profile provides compatibility with

DIPs

Also available in medium profile (4300S -

.250 ”) and high profile (4300K - .350 ”)

Marking on contrasting background

■

Custom circuits available per factory

4300T, S, K Series - Thin Film Molded SIP

Product Characteristics

Resistance Range

Bussed ...................49.9 to 100K ohms

Isolated ......................20 to 200K ohms

Series.........................20 to 100K ohms

Resistance Tolerance

.........................±0.1 %, ±0.5 %, ±1 %

Temperature Coefficient

..................±100 ppm/°C, ±50 ppm/°C,

±25 ppm/°C

Temperature Range ....-55 °C to +125 °C

Insulation Resistance

..................10,000 megohms minimum

TCR Tracking .........................±5 ppm/°C

Maximum Operating Voltage............50 V

Environmental Characteristics

Thermal Shock and

Power Conditioning ...................... 0.1 %

Short Time Overload ..................... 0.1 %

Terminal Strength ........................ 0.25 %

Resistance to Soldering Heat ....... 0.1 %

Moisture Resistance ..................... 0.1 %

Life .............................................. 0.50 %

Physical Characteristics

Body Material Flammability

...........................Conforms to UL94V-0

Lead Frame Material

..........................Copper, solder coated

Body Material ..................Novolac epoxy

How To Order

Package Power Temp. Derating Curve

(Low Profile, 4300T)

(

)

1.75

1.50

4311T

WATTS

1.25

1.00

.75

.50

.25

4310T

4309T

4308T

4306T

Product Dimensions

27.53

MAX.

(1.084)

22.45

MAX.

(.884)

14.83 MAX.

(.584)

24.99

MAX.

(.984)

19.92

MAX.

(.784)

PIN #1 REF.

4.95

(.195)

MAX.

.381 + .127/ - .000

(.015 + .005/ - 000)

2.54

.07

(.100

.003*)

TYP.

NON-ACCUM.

3.43 + .38/ - .25

(.135 + .015/ - .010)

1.02

.12

(.040

.005)

.483

.050

TYP.

(.020

.002)

2.16

.10

(.085

.004)

150

125

AMBIENT TEMPERATURE (

C )

Package Power Ratings at 70°C

4304 .......... ............ 0.60...... 0.80 watts

4306 ...... 0.75.......... 0.90...... 1.20 watts

4308 ...... 1.00.......... 1.20...... 1.60 watts

4309 ...... 1.13 ................................watts

4310 ...... 1.25.......... 1.50...... 2.00 watts

4311 ...... 1.38 ................................watts

1.02

.05

(.0425

.002)

.254

.050

(.010

.002)

Governing dimensions are in metric. Dimensions in parentheses

are inches and are approximate.

*Terminal centerline to centerline measurements made at point of

emergence of the lead from the body.

43 11 T - 101 - 2222 F A B __

Model

(43 = Molded SIP)

Number of Pins

Physical Config.

•T = Low Profile Thin Film

•S = Med. Profile Thin Film

•K = High Profile Thin Film

Electrical Configuration

•101 = Bussed

•102 = Isolated

•106 = Series

Resistance Code

•First 3 digits are significant

•Fourth digit represents the

number of zeros to follow.

Absolute Tolerance Code

•B = ±0.1%

•F = ±1%

•D = ±0.5%

Temperature Coefficient Code

•A = ±100ppm/°C •C = ±25ppm/°C

•B = ±50ppm/°C

Ratio Tolerance (Optional)

•A = ±0.05% to R1 •D = ±0.5% to R1

•B = ±0.1% to R1

Terminations

• L = Tin-plated (RoHS compliant version)

• Blank = Tin/Lead-plated

Consult factory for other available options.

Typical Part Marking

Represents total content. Layout may vary.

PART

NUMBER

4311T-101-

1003BB

YYWW

CIRCUIT

RESISTANCE

CODE

DATE CODE

PIN ONE

INDICATOR

MANUFACTURER'S

TRADEMARK

*RoHS Directive 2002/95/EC Jan 27 2003 including Annex

Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

Recommended Resources

High-precision non-contact temperature control circuit 4b

Touch type electric fan speed regulating circuit

Infrared anti-theft alarm circuit

M50460-001P/FP (TV) infrared remote control transmitter microprocessor circuit

Inductive Boost Converter LED Driver

LED fuse/indicator circuit diagram

The emulator cannot recognize the CC2530 chip, please give me the HEX file!: [b][align=left][size=12px]I have a CC2530 programmer (emulator) with a C8051F320 main control chip (old model in emulators). I have also made a batch of CC2530 emulators. I use a C8051 dedicated progr...; dingshidong TI Technology Forum

Power Feedback Design: Power Feedback Design...; flyingfox Power technology

TI launches fastest Hercules MCU: TI introduces the fastest Hercules MCU yet - Meeting the functional safety needs of developers in industrial, medical, automotive and transportation designs [/size][/font][/backcolor][/color][/align] ...; 莫妮卡 Microcontroller MCU

Program to transfer files between MSP430F149 MCU and PC HyperTerminal using Xmodem protocol: [code]/********************************************************** Date: 2007-06-04 Author: Li Meng Function: 430 MCU receives the file first and then sends it to PC ***********************************...; qinkaiabc Microcontroller MCU

Discussion on Configuration of Emergency Stop System: Abstract : Emergency Shutdown Device (ESD) is a special safety protection device developed in the 1990s. Based on the actual application of the emergency shutdown system in Maoming Petrochemical, this...; frozenviolet Automotive Electronics

Or is it about I2C, how to handle the interference of interrupts?: I transplanted a program for hardware I2C reading and writing 24C01. There is no problem running this program alone. I have read and written thousands of times without error. But once an interrupt is ...; xia_23 stm32/stm8

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

Popular Components