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BL-R3139B

Description
Chip material: GaAsP /GaP
CategoryLED optoelectronic/LED    photoelectric   
File Size122KB,2 Pages
ManufacturerBRIGHT
Websitehttp://www.brightled.co.kr/
Download Datasheet Parametric View All

BL-R3139B Overview

Chip material: GaAsP /GaP

BL-R3139B Parametric

Parameter NameAttribute value
MakerBRIGHT
package instructionL-102, 2 PIN
Reach Compliance Codeunknow
colorYELLOW
ConfigurationSINGLE
Maximum forward current0.03 A
Lens typeDIFFUSED
Nominal luminous intensity6.0 mcd
Installation featuresRADIAL MOUNT
Number of functions1
Number of terminals2
Optoelectronic device typesSINGLE COLOR LED
total height9.5 mm
method of packingBULK
peak wavelength585 nm
shapeRECTANGULAR
size7 mm
surface mountNO
Terminal pitch2.54 mm
perspective120 deg
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-R3139B
Features:
1. Chip material: GaAsP /GaP
2. Emitted color : Yellow
3. Lens Appearance : Yellow Diffused
4. Low power consumption.
5. Most suitable for use like level indicator.
6. Excellent uniformity of light emittance.
7. Long life solid state reliability.
8. Compatible.
9. This product don’t contained restriction
substance, compliance ROHS standard.
Package dimensions:
4.8(.189)
4.0(.157)
5.0(.197)
7.0(.276)
4.5(.177)
1.5(.059) MAX.
25.4(1.00) MIN.
Cathode
0.5(.020) SQ.TYP.
7.1(.280)
2.54(.100) NOM.
1.0(.039) MIN.
5.1(.201)
Notes:
Applications:
1. TV set
2. Monitor
3. Telephone
4. Computer
5. Circuit board
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25mm (0.01”) unless otherwise specified.
3. Lead spacing is measured where the leads emerge from
the package.
4. Specifications are subject to change without notice.
Absolute maximum ratings(Ta=25℃)
Parameter
Power Dissipation
Forward Current
Peak Forward Current*
1
Reverse
Voltage
Operating Temperature
Storage Temperature
Soldering Temperature
Symbol
Pd
I
F
I
FP
V
R
Topr
Tstg
Tsol
Rating
80
30
150
5
-40
~80
-40
~85
260
(for 5 seconds)
Unit
mW
mA
mA
V
*
1
Condition for I
FP
is pulse of 1/10 duty and 0.1msec width.
Ver.1.0 Page: 1 of 2
1.1

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