SSFP3N20
StarMOS
T
Power MOSFET
■
■
Extremely high dv/dt capability
Low Gate Charge Qg results in
Simple Drive Requirement
100% avalanche tested
Gate charge minimized
Very low intrinsic capacitances
Very good manufacturing repeatability
V
DSS
= 200V
I
D25
=2.5A
R
DS(ON)
=1.5Ω
■
■
■
■
Description
StarMOS is a new generation of high voltage
N–Channel enhancement mode power MOSFETs.
This new technology minimises the JFET effect,
increases packing density and reduces the
on-resistance. StarMOS also achieves faster
switching speeds through optimised gate layout
with planar stripe DMOS technology.
Pin1–Gate
Pin2–Drain
Pin1–Source
Application
■
Switching application
Absolute Maximum Ratings
Parameter
I
D
@Tc=25ْ C
I
D
@Tc=100ْC
I
DM
P
D
@T
C
=25ْC
V
GS
E
AS
I
AR
E
AR
dv/dt
T
J
T
STG
Continuous Drain Current,V
GS
@10V
Continuous Drain Current,V
GS
@10V
Pulsed Drain Current
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
①
①
③
②
①
Max.
2.5
1.5
10
20
0.34
±20
44
3.3
3.8
5.0
–25
to +150
300(1.6mm from case)
10 Ibf in(1.1N m)
●
●
Units
A
W
W/ْ C
V
mJ
A
mJ
V/ns
ْ
C
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Mounting Torque,6-32 or M3 screw
Thermal Resistance
Parameter
R
θJC
R
θCS
R
θJA
Junction-to-case
Case-to-Sink,Flat,Greased Surface
Junction-to-Ambient
Min.
—
－
—
Typ.
—
0.5
—
Max.
6.4
—
80
ْ
C/W
Units
1
SSFP3N20
StarMOS
T
Power MOSFET
Electrical Characteristics @T
J
=25
ْ
C(unless otherwise specified)
Parameter
V
(BR)DSS
R
DS(on)
V
GS(th)
g
fs
I
DSS
Drain-to-Source Breakdown Voltage
Static Drain-to-Source On-resistance
Gate Threshold Voltage
Forward Transconductance
Drain-to-Source Leakage current
Gate-to-Source Forward leakage
Gate-to-Source Reverse leakage
Total Gate Charge
Gate-to-Source charge
Gate-to-Drain("Miller") charge
Turn-on Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Internal Drain Inductance
△
V
(BR)DSS
/
△
T
J
Breakdown Voltage Temp.Coefficient
Min.
200
—
—
2.0
0.8
—
—
—
—
—
—
—
—
—
—
—
—
Typ.
—
0.27
－
—
－
—
—
—
—
－
1.2
3.0
－
－
－
－
4.5
Max. Units
—
—
1.5
4.0
—
25
250
100
-100
7.5
—
—
15
25
V
Test Conditions
V
GS
=0V,I
D
=
250μA
V/ْC Reference to 25ْC,I
D
=1mA
Ω
V
GS
=10V,I
D
=1.25A
V
S
V
DS
=V
GS
,I
D
=250μA
V
DS
=10V,I
D
=1.25A
V
DS
=Rated V
DSS
,V
GS
=0V
μA
V
DS
=0.8
×
Rated V
DSS
,
V
GS
=0V,T
J
=125ْC
nA
V
GS
=20V
V
GS
=-20V
I
GSS
Q
g
Q
gs
Q
gd
t
d(on)
tr
t
d(off)
tf
L
D
I
D
=3.0A
nC V
DD
=45V
V
DD
=50V
I
D
=1.25A
nS
V
GS
=10V
R
GEN
=50Ω
15
15
—
R
GS
=50Ω
L
S
C
iss
C
oss
C
rss
Internal Source Inductance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
－
—
—
—
7.5
200
80
25
—
—
—
—
Between lead,
6mm(0.25in.)
nH from package
and center of
die contact
V
GS
=0V
pF V
DS
=25V
f
=1.0MH
Z
See Figure 5
Source-Drain Ratings and Characteristics
Parameter
I
S
I
SM
V
SD
t
rr
Q
rr
t
on
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode)
①
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
Forward Turn-on Time
.
.
Min.
—
—
—
－
0.33
Typ.
—
—
—
290
0.9
Max.
3.3
A
8.0
2.0
－
1.4
V
nS
nC
Units
Test Conditions
MOSFET symbol
showing the
integral reverse
p-n junction diode.
T
J
=25ْC,I
S
=2.5A,V
GS
=0V
④
T
J
=25ْC,I
F
=2.5A
di/dt=25A/μs
④
Intrinsic turn-on time is negligible (turn-on is dominated by Ls + L
D
)
Notes:
①
Repetitive rating;pulse width limited by
max.junction temperature(see figure 11)
③
I
SD
≤2.5A,di/dt≤140A/μS,V
DD
≤V
(BR)DSS
,
TJ≤150ْ C
④
Pulse width≤80μS; duty cycle≤1%
②
L =6.4mH, I
AS
= 3.3 A, V
DD
= 50V,
R
G
= 25Ω, Starting T
J
= 25°C
2
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