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AS7C4096A-10TC

Description
512K X 8 STANDARD SRAM, 12 ns, PDSO36
Categorystorage    storage   
File Size288KB,10 Pages
ManufacturerALSC [Alliance Semiconductor Corporation]
Download Datasheet Parametric View All

AS7C4096A-10TC Overview

512K X 8 STANDARD SRAM, 12 ns, PDSO36

AS7C4096A-10TC Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerALSC [Alliance Semiconductor Corporation]
Parts packaging codeTSOP2
package instructionTSOP2,
Contacts44
Reach Compliance Codeunknow
ECCN code3A991.B.2.A
Maximum access time10 ns
JESD-30 codeR-PDSO-G44
JESD-609 codee0
length18.415 mm
memory density4194304 bi
Memory IC TypeSTANDARD SRAM
memory width8
Number of functions1
Number of terminals44
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512KX8
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP2
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTIN LEAD
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width10.16 mm
May 2005
Preliminary
®
AS7C4096A
5.0V 512K × 8 CMOS SRAM
Features
• Pin compatible to AS7C4096
• Industrial and commercial temperature
• Organization: 524,288 words × 8 bits
• Center power and ground pins
• High speed
- 10/12/15/20 ns address access time
- 5/6 ns output enable access time
• Equal access and cycle times
• Easy memory expansion with CE, OE inputs
• TTL-compatible, three-state I/O
• JEDEC standard packages
• ESD protection
2000 volts
• Latch-up current
200 mA
- 400 mil 36-pin SOJ
- 44-pin TSOP 2
• Low power consumption: ACTIVE
- 880mW/max @ 10 ns
• Low power consumption: STANDBY
- 55mW/max CMOS
Logic block diagram
V
CC
GND
Input buffer
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
I/O1
Pin arrangement
s
36-pin SOJ (400 mil)
A0
A1
A2
A3
A4
CE
I/O1
I/O2
V
CC
GND
I/O3
I/O4
WE
A5
A6
A7
A8
A9
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
NC
A18
A17
A16
A15
OE
I/O8
I/O7
GND
V
CC
I/O6
I/O5
A14
A13
A12
A11
A10
NC
NC
NC
A0
A1
A2
A3
A4
CE
I/O1
I/O2
V
CC
GND
I/O3
I/O4
WE
A5
A6
A7
A8
A9
NC
NC
44-pin TSOP 2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
NC
NC
NC
A18
A17
A16
A15
OE
I/O8
I/O7
GND
V
CC
I/O6
I/O5
A14
A13
A12
A11
A10
NC
NC
NC
Row decoder
524,288 × 8
Array
(4,194,304)
Sense amp
I/O8
Column decoder
A10
A11
A12
A13
A14
A15
A16
A17
A18
WE
OE
CE
Control
Circuit
Selection guide
Maximum address access time
Maximum outputenable access time
Maximum operating current
Maximum CMOS standby current
–10
10
5
160
10
–12
12
6
140
10
–15
15
6
120
10
–20
20
6
100
10
Unit
ns
ns
mA
mA
5/27/05, v. 1.1
Alliance Semiconductor
P. 1 of 10
Copyright © Alliance Semiconductor. All rights reserved.

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