EEWORLDEEWORLDEEWORLD

Part Number

Search

M55342K09U681ES-TR

Description
Fixed Resistor, Metal Glaze/thick Film, 1W, 681000ohm, 200V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 2512, CHIP
CategoryPassive components    The resistor   
File Size97KB,1 Pages
ManufacturerState of the Art Inc.
Download Datasheet Parametric View All

M55342K09U681ES-TR Overview

Fixed Resistor, Metal Glaze/thick Film, 1W, 681000ohm, 200V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 2512, CHIP

M55342K09U681ES-TR Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerState of the Art Inc.
package instructionCHIP
Reach Compliance Codenot_compliant
ECCN codeEAR99
structureChip
JESD-609 codee4
Manufacturer's serial numberM55342/09
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-65 °C
Package height0.71 mm
Package length6.35 mm
Package shapeRECTANGULAR PACKAGE
Package formSMT
Package width3.02 mm
method of packingTR
Rated power dissipation(P)1 W
Rated temperature70 °C
GuidelineMIL-PRF-55342
resistance681000 Ω
Resistor typeFIXED RESISTOR
seriesM55342/09-THICKFILM
size code2512
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient100 ppm/°C
Terminal surfacePlatinum/Gold (Pt/Au)
Terminal shapeWRAPAROUND
Tolerance1%
Operating Voltage200 V
State of the Art, Inc.
Thick Film Chip Resistor
M55342/09 RM2512
GLASS
PASSIVATION
WRAPAROUND
TERMINATIONS
RESISTOR
FILM
96% ALUMINA CHIP
PERFORMANCE
TEMPERATURE RISE (°C)
Resistance Range
Tolerances
Maximum Power
Maximum Voltage
1
W
- 22M
W
1%, 2%, 5%, 10%
1000 mW
200 Volts
CHARACTERISTICS*
M
K
±100
±0.5%
±0.25%
±0.25%
±0.25%
±0.5%
±0.5%
±0.5%
±300
±0.5%
±0.5%
±0.5%
±0.25%
±0.5%
±2.0%
±1.0%
CURRENT NOISE
POWER DISSIPATION
fiber epoxy board
ceramic board
TESTS
TCR (-55 to +125
°
C) in ppm/
°
C
Thermal Shock
Low Temperature Operation
Short-time Overload
Resistance to Soldering Heat
Moisture Resistance
Life, 2,000 Hours
High Temperature Exposure
POWER DISSIPATION (WATTS)
LIFE TEST
POWER DERATING
*Maximum allowable change per MIL-PRF-55342,
typical change is 10% of these values.
PART NUMBERING
M55342 K 09 B 100D S - TR
PACKAGING CODE: TR = Tape & Reel W= Waffle Pack
PRODUCT LEVEL DESIGNATOR: M: 1% per 1000 hrs. R: 0.01% P: 0.1% S: 0.001% T: Space Level C: Non - ER
RESISTANCE AND TOLERANCE CODE:
Three significant digits, with a letter indicating the
decimal location, the tolerance, and the value range.
D: 1%
W
E: 1% K
W
F: 1% M
W
G: 2%
W
H: 2% K
W
T: 2% M
W
J: 5%
W
K: 5% K
W
L: 5% M
W
M: 10%
W
N: 10% K
W
P: 10% M
W
TERMINATION MATERIALS:
B: Solderable wraparound C: Epoxy bondable palladium/silver wraparound U: Epoxy bondable platinum/gold wraparound
W: Gold wire bondable
G: Gold wraparound
SIZE CODE: /09 = RM2512
TEMPERATURE CHARACTERISTIC: K: ± 100ppm M: ± 300ppm
PERFORMANCE SPECIFICATION MIL-PRF-55342
MECHANICAL
INCHES
MILLIMETERS
.300
MINIMUM
RECOMMENDED
MOUNTING
PADS
(INCHES)
Length
Width
Thickness
Top Term
Bottom Term
Gap
Approx. Weight
.250 (.244 - .268)
.119 (.119 - .129)
.028 (.015 - .033)
.020 (.015 - .025)
.019 (.015 - .025)
.212 (.208 - .216)
.0513 grams
6.35
3.02
0.71
0.51
0.48
5.39
(6.20 - 6.81)
(3.02 - 3.28)
(0.38 - 0.84)
(0.38 - 0.64)
(0.38 - 0.64)
(5.28 - 5.49)
.125
.202
.049
State of the Art, Inc.
2470 Fox Hill Road, State College, PA 16803-1797
Phone (814) 355-8004 Fax (814) 355-2714 Toll Free 1-800-458-3401
“Specifications subject to change without notice.”
www.resistor.com
04/09/08
Does STL take up a lot of memory?
Embedded platforms have limited memory. I wonder if STL will take up a lot of extra memory?...
美丽的错误 Embedded System
Anyone who is willing to work on "Smart Home System" is welcome to sign up!!!
Now do a survey, if there are more than 10 people willing to do smart home system, we will start to do it, if not this design will be aborted. If you are willing, please post below, thank you.This inv...
zhaojun_xf DIY/Open Source Hardware
Convex Optimization User Guide
Convex optimization theory has been increasingly used in the DSP field in recent years, including time-frequency analysis, location tracking, filter design, signal waveform design, etc. Convex optimiz...
FYRS DSP and ARM Processors
When the WAVECOM module is connected to the Internet, how can I receive text messages and what can I do?
When using the ANYDATA module to do such a function: when surfing the Internet, if a text message is received, the network remains connected, the text message content is read, and then the Internet is...
mingjing Embedded System
Here is a collector's edition of op amp books
mos运算放大器原理设计应用(李联著)...
lixiaohai8211 Analog electronics
TI Live: The latest reference solutions for video doorbells, network cameras, etc., and the core components for their implementation
Want to find the latest video doorbell and network camera solutions for reference? Or the prototype of the relevant solution has been finalized, what devices are suitable, cheap, easy to use, and what...
nmg TI Technology Forum

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 751  2700  413  2787  457  16  55  9  57  10 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号