M55342M09U21F0M-TR datasheet, PDF

Datasheet> All Categories > Passive components> The resistor> M55342M09U21F0M-TR

M55342M09U21F0M-TR: DescriptionFixed Resistor, Metal Glaze/thick Film, 1W, 21000000ohm, 200V, 1% +/-Tol, 300ppm/Cel, Surface Mount, 2512, CHIP; CategoryPassive components The resistor; File Size97KB，1 Pages; ManufacturerState of the Art Inc.

Download Datasheet Parametric View All

M55342M09U21F0M-TR Overview

Fixed Resistor, Metal Glaze/thick Film, 1W, 21000000ohm, 200V, 1% +/-Tol, 300ppm/Cel, Surface Mount, 2512, CHIP

M55342M09U21F0M-TR Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	State of the Art Inc.
package instruction	CHIP
Reach Compliance Code	not_compliant
ECCN code	EAR99
structure	Chip
JESD-609 code	e4
Manufacturer's serial number	M55342/09
Installation features	SURFACE MOUNT
Number of terminals	2
Maximum operating temperature	150 °C
Minimum operating temperature	-65 °C
Package height	0.71 mm
Package length	6.35 mm
Package shape	RECTANGULAR PACKAGE
Package form	SMT
Package width	3.02 mm
method of packing	TR
Rated power dissipation(P)	1 W
Rated temperature	70 °C
Guideline	MIL-PRF-55342
resistance	21000000 Ω
Resistor type	FIXED RESISTOR
series	M55342/09-THICKFILM
size code	2512
surface mount	YES
technology	METAL GLAZE/THICK FILM
Temperature Coefficient	300 ppm/°C
Terminal surface	Platinum/Gold (Pt/Au)
Terminal shape	WRAPAROUND
Tolerance	1%
Operating Voltage	200 V

Preview

Download Datasheet

View All

State of the Art, Inc.

Thick Film Chip Resistor

M55342/09 RM2512

GLASS

PASSIVATION

WRAPAROUND

TERMINATIONS

RESISTOR

FILM

96% ALUMINA CHIP

PERFORMANCE

TEMPERATURE RISE (°C)

Resistance Range

Tolerances

Maximum Power

Maximum Voltage

- 22M

1%, 2%, 5%, 10%

1000 mW

200 Volts

CHARACTERISTICS*

±100

±0.5%

±0.25%

±0.5%

±300

±0.5%

±0.25%

±0.5%

±2.0%

±1.0%

CURRENT NOISE

POWER DISSIPATION

fiber epoxy board

ceramic board

TESTS

TCR (-55 to +125

C) in ppm/

Thermal Shock

Low Temperature Operation

Short-time Overload

Resistance to Soldering Heat

Moisture Resistance

Life, 2,000 Hours

High Temperature Exposure

POWER DISSIPATION (WATTS)

LIFE TEST

POWER DERATING

*Maximum allowable change per MIL-PRF-55342,

typical change is 10% of these values.

PART NUMBERING

M55342 K 09 B 100D S - TR

PACKAGING CODE: TR = Tape & Reel W= Waffle Pack

PRODUCT LEVEL DESIGNATOR: M: 1% per 1000 hrs. R: 0.01% P: 0.1% S: 0.001% T: Space Level C: Non - ER

RESISTANCE AND TOLERANCE CODE:

Three significant digits, with a letter indicating the

decimal location, the tolerance, and the value range.

D: 1%

E: 1% K

F: 1% M

G: 2%

H: 2% K

T: 2% M

J: 5%

K: 5% K

L: 5% M

M: 10%

N: 10% K

P: 10% M

TERMINATION MATERIALS:

B: Solderable wraparound C: Epoxy bondable palladium/silver wraparound U: Epoxy bondable platinum/gold wraparound

W: Gold wire bondable

G: Gold wraparound

SIZE CODE: /09 = RM2512

TEMPERATURE CHARACTERISTIC: K: ± 100ppm M: ± 300ppm

PERFORMANCE SPECIFICATION MIL-PRF-55342

MECHANICAL

INCHES

MILLIMETERS

.300

MINIMUM

RECOMMENDED

MOUNTING

PADS

(INCHES)

Length

Width

Thickness

Top Term

Bottom Term

Gap

Approx. Weight

.250 (.244 - .268)

.119 (.119 - .129)

.028 (.015 - .033)

.020 (.015 - .025)

.019 (.015 - .025)

.212 (.208 - .216)

.0513 grams

6.35

3.02

0.71

0.51

0.48

5.39

(6.20 - 6.81)

(3.02 - 3.28)

(0.38 - 0.84)

(0.38 - 0.64)

(5.28 - 5.49)

.125

.202

.049

State of the Art, Inc.

2470 Fox Hill Road, State College, PA 16803-1797

Phone (814) 355-8004 Fax (814) 355-2714 Toll Free 1-800-458-3401

“Specifications subject to change without notice.”

www.resistor.com

04/09/08

Recommended Resources

One article to understand the intermediate bus structure

TMP86C807MG chip internal structure diagram

Zoomlion F-9500A preamplifier (a)

Music IC as a delay light controller circuit

875p computer motherboard circuit diagram_079

Homemade PCB circuit board made by engraving machine: I bought the engraving machine more than a year ago. I usually use it to process samples of shells and hardware, but I have never used it to make PCB circuit boards. When I bought this machine, I also...; fsyicheng PCB Design

Change the image display size during DIRECTSHOW preview: I use DIRECTSHOW and want to change the size of the image when previewing? Does anyone know how?...; dj0930 Embedded System

Take the first step in embedded software development: Although it is embedded software development, the knowledge required varies greatly depending on the part of the entire system. For example, the development of serial communication and LCD screen cont...; 空中楼阁 Robotics Development

LM014LC1S02: LM014LC1S02...; lorant MCU

Technical characteristics and wide application of embedded systems: Based on the concept of embedded system, this paper expounds the key technologies, embedded development and wide applications of embedded system. This paper analyzes the technical characteristics of e...; Nuli-IT Embedded System

STM8S103 serial port problem, two days ago: The chip used is STM8S103F3. Use serial port 1, internal clock, query transmission, interrupt or query reception. Question: Is the STM8 multiplexing? If you configure the serial port, the correspondin...; xingkong911 stm32/stm8

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

Popular Components