SRAM Module, 128KX2, 70ns, CMOS, CDIP40
| Parameter Name | Attribute value |
| Maker | Twilight Technology Inc. |
| package instruction | DIP, DIP40,.9 |
| Reach Compliance Code | unknown |
| Maximum access time | 70 ns |
| I/O type | SEPARATE |
| JESD-30 code | R-XDIP-T40 |
| memory density | 262144 bit |
| Memory IC Type | SRAM MODULE |
| memory width | 2 |
| Number of terminals | 40 |
| word count | 131072 words |
| character code | 128000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 128KX2 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP40,.9 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| power supply | 5 V |
| Maximum standby current | 0.0009 A |
| Minimum standby current | 2 V |
| Maximum slew rate | 0.275 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| DPS166167-70I | DPS166167-70C | |
|---|---|---|
| Description | SRAM Module, 128KX2, 70ns, CMOS, CDIP40 | SRAM Module, 128KX2, 70ns, CMOS, CDIP40 |
| Maker | Twilight Technology Inc. | Twilight Technology Inc. |
| package instruction | DIP, DIP40,.9 | DIP, DIP40,.9 |
| Reach Compliance Code | unknown | unknown |
| Maximum access time | 70 ns | 70 ns |
| I/O type | SEPARATE | SEPARATE |
| JESD-30 code | R-XDIP-T40 | R-XDIP-T40 |
| memory density | 262144 bit | 262144 bit |
| Memory IC Type | SRAM MODULE | SRAM MODULE |
| memory width | 2 | 2 |
| Number of terminals | 40 | 40 |
| word count | 131072 words | 131072 words |
| character code | 128000 | 128000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C | 70 °C |
| organize | 128KX2 | 128KX2 |
| Output characteristics | 3-STATE | 3-STATE |
| Package body material | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP |
| Encapsulate equivalent code | DIP40,.9 | DIP40,.9 |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL |
| power supply | 5 V | 5 V |
| Maximum standby current | 0.0009 A | 0.000425 A |
| Minimum standby current | 2 V | 2 V |
| Maximum slew rate | 0.275 mA | 0.28 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V |
| surface mount | NO | NO |
| technology | CMOS | CMOS |
| Temperature level | INDUSTRIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL |