5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com
Standard & High Temperature Open Frame DIP Sockets
Features:
• Multiple finger contact on all sockets
assures maximum reliability.
• Tapered entry for ease of insertion.
• Closed bottom sleeve for 100% anti-
wicking of solder.
• To fit .100” (2.54 mm) pitch.
• Easily customized to fit your application.
• For surface mount applications use HLS
only.
Standard Sockets
LS -
Insulator Material:
Glass Filled Thermoplastic Polyester (P.B.T.)
U.L. Rated 94V-O, -60˚C to 140˚C (-76˚F to 284˚F)
How To Order
LS
Body Type
Standard Open Frame DIP
DIP Spacing
3 - .300" (7.62 mm)
4 - .400" (10.16 mm)
6 - .600" (15.24 mm)
9 - .900" (22.86 mm)
3
16
-01
T
G
Contact Plating
G - Gold
T - Tin-Lead
Terminal Plating
G - Gold
T - Tin-Lead
Terminal Type
See next page
for terminal types.
Terminals and Contacts:
Terminal: Brass - Copper Alloy (C36000)
ASTM-B-16
Contact: Beryllium Copper - Copper Alloy
(C17200) ASTM-B-194
Solder Preform:
63% Tin, 37% Lead
Number of Pins
(8 to 64)
Plating:
Terminal: Gold over Nickel or
Tin-Lead over Nickel
Contact: Gold over Nickel or
Tin-Lead over Nickel
Gold per MIL-G-45204
Tin-Lead per MIL-P-81728
Nickel per QQ-N-290
High Temperature Sockets
HLS -
Insulator Material:
High Temp. Glass Filled Thermoplastic
U.L. Rated 94V-O, -60˚C to 260˚C (-76˚F to 500˚F)
How To Order
HLS
Body Type
High Temp. Open Frame DIP
DIP Spacing
3 - .300" (7.62 mm)
4 - .400" (10.16 mm)
6 - .600" (15.24 mm)
9 - .900" (22.86 mm)
3
16
-01
T
G
Contact Plating
G - Gold
T - Tin-Lead
Terminal Plating
G - Gold
T - Tin-Lead
Terminal Type
See next page
for terminal types.
Number of Pins
(8 to 64)
Page 82
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
inch/(mm)
Open Frame
Dual In-Line Sockets
5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com
Standard & High Temperature Open Frame DIP Sockets
Terminal Information
Low Profile Solder Tail
Type -01
Low Profile Solder Tail
Type -29
Low Profile Solder Tail
Type -30
A
C
B
.165
(4.19)
.050*
(1.27)
.125
(3.18)
.020 Dia.
(.51)
.020 Dia.
(.51)
.165
(4.19)
.170
(4.32)
.020 Dia.
(.51)
.165
(4.19)
.275
(6.99)
Dimensional Information
# of
Pins
8
14
16
18
20
22
24
28
22
24
24
28
32
40
48*
64*
A
.300
(7.62)
.300
(7.62)
.300
(7.62)
.300
(7.62)
.300
(7.62)
.300
(7.62)
.300
(7.62)
.300
(7.62)
.400
(10.16)
.400
(10.16)
.600
(15.24)
.600
(15.24)
.600
(15.24)
.600
(15.24)
.600
(15.24)
.900
(22.86)
B
.400
(10.16)
.400
(10.16)
.400
(10.16)
.400
(10.16)
.400
(10.16)
.400
(10.16)
.400
(10.16)
.400
(10.16)
.500
(12.70)
.500
(12.70)
.700
(17.78)
.700
(17.78)
.700
(17.78)
.700
(17.78)
.700
(17.78)
1.000
(25.40)
C
.400
(10.16)
.700
(17.78)
.800
(20.32)
.900
(22.86)
1.000
(25.40)
1.100
(27.94)
1.200
(30.48)
1.400
(35.56)
1.100
(27.54)
1.200
(30.48)
1.200
(30.48)
1.400
(35.56)
1.600
(40.64)
2.000
(50.80)
2.400
(60.96)
3.200
(81.28)
DIP
Low Profile Solder Tail
Type -51
Super Low Profile
Type -04
Super Low Profile
Type -38
.130
(3.30)
.110
(2.79)
.020 Dia.
(.51)
.028 Dia.
(.71)
.120
(3.05)
.110
(2.79)
.028 Dia.
(.71)
.120
(3.05)
.140
(3.56)
Ultra Low Profile
Type -49
Ultra Low Profile
Type -299
Surface Mount
Type -237
HLS Only
.095
(2.41)
.095
(2.41)
.028 Dia.
(.71)
.025 Dia.
(.64)
.083
(2.11)
.082
(2.08)
.155
(3.94)
.052 Dia.
(1.32)
Quick turn delivery available on standard terminal types.
Additional terminal types available.
See terminal section for detailed terminal information.
*Socket body thickness is .100/(2.54)
for 48 and 64 positions
Solder Preform Terminals
Available on HLS Body Type
Type -150
.072 Dia.
(1.83)
Type -151
.072 Dia.
(1.83)
.072 Dia.
(1.83)
.165
.165
(4.19)
(4.19)
Solder
Preform
.125
.125
(3.18)
(3.18)
.020 Dia.
(.51)
.130
(3.30)
Solder
Preform
.110
(2.79)
.020 Dia.
(.51)
.020 Dia.
(.51)
See page 81 for complete details.
inch/(mm)
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
Page 83
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Embedded System
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