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LOP-628-S083-95

Description
IC Socket, DIP28, 28 Contact(s), 2.54mm Term Pitch, 0.6inch Row Spacing, Solder
CategoryThe connector    socket   
File Size117KB,1 Pages
ManufacturerE-tec Interconnect Ltd.
Environmental Compliance
Download Datasheet Parametric View All

LOP-628-S083-95 Overview

IC Socket, DIP28, 28 Contact(s), 2.54mm Term Pitch, 0.6inch Row Spacing, Solder

LOP-628-S083-95 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerE-tec Interconnect Ltd.
Reach Compliance Codecompliant
Other featuresROHS COMPLIANT
body width0.7 inch
subject depth0.049 inch
body length1.4 inch
Contact completed and terminatedTin (Sn)
Contact materialBE-CU
Contact styleRND PIN-SKT
current rating1 A
Device slot typeIC SOCKET
Type of equipment usedDIP28
Dielectric withstand voltage500VAC V
Shell materialPOLYBUTYLENE TEREPHTHALATE
Insulation resistance5000000000 Ω
JESD-609 codee3
Manufacturer's serial numberLOP
Plug contact pitch0.1 inch
Installation methodSTRAIGHT
Number of contacts28
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
PCB contact patternRECTANGULAR
PCB contact row spacing0.6 mm
Terminal pitch2.54 mm
Termination typeSOLDER
LOP/SLP - Series
“low profile“
Low profile DIP sockets
2,54mm pitch
Sockets & Strips
LOP Series
Low profile strips
SLP Series
height above PCB 2.41mm / .095"
height above PCB 2.41mm / .095"
Insulator
Pin
14
16
18
20
24
24
28
Dimensions
mm/inch
"A"
17,78/.700
20,32/.800
22,86/.900
25,40/1.000
30,48/1.200
7,62
.300
Ordering Code
LOP - 314 - S083 -
95
LOP - 316 - S083 -
95
LOP - 318 - S083 -
95
LOP - 320 - S083 -
95
LOP - 324 - S083 -
95
LOP - 624 - S083 -
95
LOP - 628 - S083 -
95
"B"
30,48/1.200
35,56/1.400
15,24
.600
32
40
40,64/1.600
50,80/2.000
15,24
.600
LOP - 632 - S083 -
95
LOP - 640 - S083 -
95
SLP - 110 - S083 -
95
35,56/1.400
SLP - 114 - S083 -
95
14
Other sizes and flush head version on request
10
25,40/1.000
Pin-outs
Other pin-outs available on request.
Despite the very low profile of these sockets the
IC legs can be inserted completely.
Recommended PCB Layout
Recommended drilling hole dia
0,8mm/.031“
Low Profile Terminal
Plating
Standard:
-
95
=
tin/gold
(tin leadfree)
Alternative
-
55
-
99
083
2.41mm / .095“ over PCB
=
=
gold/gold
tin/ tin
(leadfree)
Specifications
Mechanical data
Insertion force
Extraction force
Contact life
Solderability
Contact security:
-Vibration
-Shock
Material
Insulator
(RoHS compliant)
Terminal
(RoHS compliant)
Contact
(RoHS compliant)
1,80 N (avg)
0,90 N (avg)
100 cycles
as per IEC 60068-2-58
as per EN60352-4
as per EN60352-4
Electrical data
Contact resistance at 1A
Current rating
Contact capacitance at 1MHz
Insulation resistance at 500V DC
Breakdown voltage at 60 Hz
Contact resistance
Operating temperature
Pitch
PBT UL 94 V-0
CuZn
BeCu
4,3 m typ.
1A max., 100V
2 pF max.
5
10
9
min.
500 V AC
7
m
-55° C to +125° C
2,54 mm (.100")
More information, for example about testresult
please ref. to page 49 or contact E-tec.
17

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