This device is a silicon, glass PIN diode surmount chip
fabricated with M/A-COM’s patented HMIC
TM
process.
This device features two silicon pedestals embedded in a
low loss, low dispersion glass. The diode is formed on the
top of one pedestal and connections to the backside of the
device are facilitated by making the pedestal sidewalls
electrically conductive. Selective backside metallization is
applied producing a surface mount device. This vertical
topology provides for exceptional heat transfer. The
topside is fully encapsulated with silicon nitride and has an
additional polymer layer for scratch and impact protection.
These protective coatings prevent damage to the junction
and the anode air-bridge during handling and assembly.
Applications
These packageless devices are suitable for usage in
moderate incident power, ≤50dBm/C.W. or where the peak
power is ≤75dBm, pulse width is 1μS, and duty cycle is
0.01%. Their low parasitic inductance, 0.4 nH, and
excellent RC constant, make these devices a superior
choice for higher frequency switch elements when
compared to their plastic package counterparts
.
Chip Dimensions
DIM
A
B
C
D
E
F
G
Notes:
1) Backside metal: 0.1microns thick.
2) Yellow area with hatch lines indicate backside ohmic gold
contacts.
3) Both devices have same outline dimensions ( A to G).
INCHES
Min
0.060
0.031
0.004
0.019
0.019
0.019
0.029
Max
0.062
0.032
0.008
0.021
0.021
0.021
0.031
Min
1.525
0.775
0.102
0.475
0.475
0.475
0.725
MM
Max
1.575
0.825
0.203
0.525
0.525
0.525
0.775
Absolute Maximum Ratings
1
@ TA = +25°C
(unless otherwise specified)
Parameter
Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Junction Temperature
C.W. Incident Power
Mounting Temperature
Absolute Maximum
500 mA
- 135 V
-55°C to +125°C
-55 °C to +150°C
+175°C
50dBm
+280°C for 30 seconds
1) Exceeding these limits may cause permanent damage
1
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MADP-017025-1314
MADP-030025-1314
SURMOUNT™ 25μM PIN Diodes
RoHS Compliant
Electrical Specifications @ T
A
= 25°C (unless otherwise noted)
Parameter
Capacitance
1
Capacitance
1
Capacitance
1
, 85°C
Resistance
2
Resistance
2
Resistance
2
, 85°C
Resistance
2
, 85°C
Forward Voltage
Reverse Leakage
Current
Third Order
Intercept Point
C.W.
Thermal Resistance
Lifetime
Rev. V5
Symbol
C
T
C
T
C
T
R
S
R
S
R
S
R
S
V
F
I
R
Conditions
- 40V, 1MHz
1
- 40V, 1GHz
1,3
- 40V, 1GHz
1,3
+10mA, 1GHz
2,3
+70mA, 1GHz
2,3
+10mA, 1GHz
2,3
+70mA, 1GHz
2,3
+10mA
| -135V |
F1 = 1800MHz
F2 = 1810MHz
Input Power = +39dBm CW
I bias = +70mA
I
H
= 0.5A, I
L
= 10mA
+10mA / -6mA
( 50 % - 90 % V )
Units
pF
pF
pF
Ω
Ω
Ω
Ω
V
μA
Min
Typ
0.23
0.23
0.22
1.01
0.64
1.48
1.03
0.74
-
Max
0.29
Min
Typ
0.50
0.50
-
0.65
0.45
-
-
Max
0.56
MADP-017025
MADP-030025
0.90
10
0.73
-
0.90
10
IP3
dBm
76
77
R
qJL
°C/W
30
13
T
L
uS
2.3
2.8
Notes:
1) Total capacitance, C
T
, is equivalent to the sum of Junction Capacitance ,C
j
, and Parasitic Capacitance, C
par
.
2)
3)
Series resistance R
S
is equivalent to the total diode resistance : R
s
= R
j
( Junction Resistance) + R
c
( Ohmic Resistance)
R
s
and C
T
are measured on an HP4291A Impedance Analyzer with die mounted in an ODS213 package with 80/20,
Au/Sn solder.
MADP-0XX025 Series
Typical Spice Parameters @ +25°C
Spice Parameter
Units
MADP-017025-1314
MADP-030025-1314
2
N
-
1.1
1.1
RS
1.4
1.3
IS
A
5.1E-15
7.8E-15
IK
BV
IBV
Ct
CJO
VJ
M
-
0.50
0.50
FC
-
0.12
0.07
Cpar_Cj
(F)
2.7E-13
5.3E-13
(mA) (Volts) (A)
12.6
12.7
175
175
10
10
(pF) (pF) (Volts)
0.38
0.80
0.10
0.27
0.17
0.12
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MADP-017025-1314
MADP-030025-1314
SURMOUNT™ 25μM PIN Diodes
RoHS Compliant
MADP-0XXX15
Series Typical Performance Curves @ +25°C
Ct vs. V
1.00
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0.00
0
10.00
Rs @ 1GHz (ohm)
Rev. V5
Rs vs. I
Ct @ 1GHz (pF)
MADP-030025
1.00
MADP-030025
MADP-017025
MADP-017025
10
20
Voltage (V)
30
40
0.10
0.001
0.01
Current (A)
0.1
Ct vs. Freq.
0.8
0.6
Ct (pF)
Ls @ 5, 10, 20mA (nH)
Ls vs. Freq.
0.2
0.18
0.16
0.14
0.12
0.1
0.08
0.06
0.04
0.02
0
0
0.2
0.4
0.7
0.5
0.4
0.3
0.2
0.1
0
0
0V
10V
40V
0V
10V
40V
MADP-17025
0.2
0.4
0.6
0.8
1
MADP-30025
MADP-17025
MADP-30025
1.2
1.4
1.6
1.8
0.6
0.8
1
1.2
1.4
1.6
1.8
Frequency (GHz)
Frequency (GHz)
Rs vs. Freq.
1.6
1.4
1.2
Rs (ohm)
Ls vs. I
0.20
0.18
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0.00
0
MADP-017025
MADP-017025
Ls @ 1GHz (nH)
5m
A
10mA
20mA
5m
A
10mA
20mA
MADP-030025
1.0
0.8
0.6
0.4
0.2
0.0
0.0
0.2
MADP-030025
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
0.02
0.04
0.06
0.08
0.1
Frequency (GHz)
3
Current (A)
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MADP-017025-1314
MADP-030025-1314
SURMOUNT™ 25μM PIN Diodes
RoHS Compliant
Assembly Guidelines
Handling
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin
oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components.
Bulk handling should insure that abrasion and mechanical shock are minimized.
Rev. V5
Bonding
Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are
conveniently located on the bottom surface of these devices and are removed from the active junction locations.
These devices are well suited for solder or conductive epoxy attachment onto hard and soft substrates. The use
of 60/40, Pb/Sn, 80/20, Au/Sn or any other lead-free solder is recommended to achieve the lowest series
resistance and optimum heat sink.
When soldering these devices to a hard substrate, hot gas die bonding is preferred. We recommend utilizing a
vacuum tip and applying a force of 40 - 60 grams to the top surface of the device. When soldering, position the die
so that its mounting pads are aligned with the circuit board mounting pads and reflow the solder by heating the
circuit trace near the mounting pads while applying 40 to 60 grams of force perpendicular to the top surface of the
die. Both mounting pads should be heated simultaneously so that the solder under both pads flows at the same
time. The solder joint should not be made one at a time. By doing so, would create an un-equal heat flow and
potentially create thermal stress to the chip.
Solder reflow should not be performed by causing heat to flow through the top surface of the die. Die should be
uniformly heated in a re-flow oven. Proper flow is easily determined looking down from the top since the HMIC
glass is transparent and the edges of the mounting pads can be visually inspected through the die after
attachment is complete. A typical
soldering
process profile and handling instructions are provided in
Application Notes,
M538 Surface Mounting Instructions
and
M541 Bonding and Handling Procedures
on the
MA-COM website at
www.macomtech.com.
Conductive silver epoxy may also be used for die attachment, in lower Incident power applications where the
average power is < 1 W. Apply a thin controlled amount approximately 1- 2 mils thick to minimize ohmic and
thermal stresses. Take care not to bridge the gap between the chip pads with epoxy. A thin epoxy fillet should be
visible around the perimeter of the pads after placement to ensure full coverage. Cure per epoxy per
manufacturer’s recommended schedule.
Ordering Information
Part Number
MADP-017025-13140G
MADP-017025-13140P
MADP-030025-13140G
MADP-030025-13140P
4
Package
100 piece gel pack
3000 piece reel
100 piece gel pack
3000 piece reel
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MADP-017025-1314
MADP-030025-1314
SURMOUNT™ 25μM PIN Diodes
RoHS Compliant
Rev. V5
M/A-COM Technology Solutions Inc. All rights reserved.
Information in this document is provided in connection with M/A-COM Technology Solutions Inc ("MACOM")
products. These materials are provided by MACOM as a service to its customers and may be used for
informational purposes only. Except as provided in MACOM's Terms and Conditions of Sale for such products or
in any separate agreement related to this document, MACOM assumes no liability whatsoever. MACOM
assumes no responsibility for errors or omissions in these materials. MACOM may make changes to
specifications and product descriptions at any time, without notice. MACOM makes no commitment to update
the information and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future
changes to its specifications and product descriptions. No license, express or implied, by estoppels or otherwise,
to any intellectual property rights is granted by this document.
THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR
IMPLIED, RELATING TO SALE AND/OR USE OF MACOM PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, CONSEQUENTIAL OR
INCIDENTAL DAMAGES, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR
OTHER INTELLECTUAL PROPERTY RIGHT. MACOM FURTHER DOES NOT WARRANT THE ACCURACY
OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN
THESE MATERIALS. MACOM SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR
CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS,
WHICH MAY RESULT FROM THE USE OF THESE MATERIALS.
MACOM products are not intended for use in medical, lifesaving or life sustaining applications. MACOM
customers using or selling MACOM products for use in such applications do so at their own risk and agree to
fully indemnify MACOM for any damages resulting from such improper use or sale.
5
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
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