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CN35JTNS161

Description
Array/Network Resistor, Bussed, Metal Glaze/thick Film, 0.0625W, 160ohm, 25V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 1206, CHIP, LEAD FREE
CategoryPassive components    The resistor   
File Size758KB,12 Pages
ManufacturerTA-I Technology Co., Ltd.
Environmental Compliance
Download Datasheet Parametric View All

CN35JTNS161 Overview

Array/Network Resistor, Bussed, Metal Glaze/thick Film, 0.0625W, 160ohm, 25V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 1206, CHIP, LEAD FREE

CN35JTNS161 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerTA-I Technology Co., Ltd.
package instructionSMT, 1206
Reach Compliance Codecompliant
ECCN codeEAR99
structureChip
The first element resistor160 Ω
JESD-609 codee3
Installation featuresSURFACE MOUNT
Network TypeBUSSED
Number of components8
Number of functions1
Number of terminals10
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package height0.5 mm
Package length3.2 mm
Package shapeRECTANGULAR PACKAGE
Package formSMT
Package width1.6 mm
method of packingTR, PAPER, 7/10 INCH
Rated power dissipation(P)0.0625 W
Rated temperature70 °C
resistance160 Ω
Resistor typeARRAY/NETWORK RESISTOR
size code1206
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient200 ppm/°C
Terminal surfaceTin (Sn) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
Tolerance5%
Operating Voltage25 V
Thick Film Chip Resistor Arrays
Thick Film Chip Resistor Networks
Document No.
TCN-XX0S001O
Revise Date
page number
2011/06/24
1 /12
(Lead-Free for CN Series Standard)
1. Scope :
This specification applies for the CN series of thick film chip resistor arrays & chip resistor networks made
by TA-I.
2. Construction , Dimensions , Schematic :
2.1 Construction :
Over Coat
Conductor:
(Lead-free )
Resistive Element
Plating
Ni + Sn
Ceramic Substrate
2.1.1 Chip Resistor Arrays :
CN22
CN24/34
CN32
CN28
d
TA-I TECHNOLOGY CO., LTD
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