KAI-11002-ABA-CD-B2 datasheet, PDF

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KAI-11002-ABA-CD-B2: DescriptionCCD Sensor, 4008 Horiz pixels, 2672 Vert pixels, Rectangular, Through Hole Mount, CERAMIC, DIP-40; CategoryThe sensor; File Size2MB，44 Pages; ManufacturerEastman Kodak Company

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KAI-11002-ABA-CD-B2 Overview

CCD Sensor, 4008 Horiz pixels, 2672 Vert pixels, Rectangular, Through Hole Mount, CERAMIC, DIP-40

KAI-11002-ABA-CD-B2 Parametric

Parameter Name	Attribute value
Maker	Eastman Kodak Company
Reach Compliance Code	unknown
Other features	SENSITIVITY IS 13 UV/ELECTRON, ELECTRONIC SHUTTER
array type	INTERLINE
body width	32.99 mm
body height	5.97 mm
Body length or diameter	37.2 mm
Dynamic Range	28 dB
horizontal pixels	4008
Installation features	THROUGH HOLE MOUNT
Output type	ANALOG VOLTAGE
Package Shape/Form	RECTANGULAR
Pixel size	9X9 µm
Sensor/temperature sensor type	IMAGE SENSOR,CCD
Maximum supply voltage	15.5 V
Minimum supply voltage	14.5 V
surface mount	NO
Termination type	SOLDER
vertical pixels	2672

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DEVICE PERFORMANCE SPECIFICATION

Revision 1.0 MTD/PS-0938

January 30,

2006

KODAK

KAI-11002 IMAGE SENSOR

4008(H) X 2672(V) INTERLINE CCD IMAGE SENSOR

TABLE OF CONTENTS

Summary Specification ...................................................................................................................................................................5

Device Description ..........................................................................................................................................................................6

Architecture.................................................................................................................................................................................6

Pixel .............................................................................................................................................................................................7

Vertical to Horizontal Tranfer .....................................................................................................................................................8

Horizontal Register to Floating Diffusion...................................................................................................................................9

Horizontal Register Split...........................................................................................................................................................10

Single Output Operation........................................................................................................................................................10

Dual Output Operation...........................................................................................................................................................10

Output ........................................................................................................................................................................................11

Pin Description and Physical Orientation.................................................................................................................................12

Performance .................................................................................................................................................................................13

Power - Estimated.....................................................................................................................................................................13

Frame Rates – Continuous Mode .............................................................................................................................................13

Imaging Performance ...............................................................................................................................................................14

Imaging Performance Operational Conditions ....................................................................................................................14

Imaging Performance Specifications ...................................................................................................................................14

Defect Definitions ..................................................................................................................................................................16

Quantum Efficiency................................................................................................................................................................17

Angular Quantum Efficiency .................................................................................................................................................19

Test Definitions .............................................................................................................................................................................20

Test Regions of Interest ............................................................................................................................................................20

OverClocking .............................................................................................................................................................................20

Tests...........................................................................................................................................................................................21

Operation .......................................................................................................................................................................................22

Maximum Ratings .....................................................................................................................................................................22

Maximum Voltage Ratings Between Pins ................................................................................................................................22

DC Bias Operating Conditions ..................................................................................................................................................22

AC Operating Conditions...........................................................................................................................................................23

Clock Levels...........................................................................................................................................................................23

Clock Line Capacitances .......................................................................................................................................................23

Timing Requirements................................................................................................................................................................23

Main Timing – Continuous Mode ..............................................................................................................................................24

Frame Timing – Continuous Mode ...........................................................................................................................................25

Frame Timing without Binning .............................................................................................................................................25

Frame Timing for Vertical Binning by 2................................................................................................................................25

Frame Timing Edge Alignment .............................................................................................................................................26

Line Timing – Continuous Mode ...............................................................................................................................................27

Line Timing Single Output.....................................................................................................................................................27

Line Timing Dual Output – Left Output.................................................................................................................................27

Line Timing Dual Output – Right Output ..............................................................................................................................28

Line Timing Vertical Binning by 2 .........................................................................................................................................28

Line Timing Detail .................................................................................................................................................................29

Line Timing Binning by 2 Detail ............................................................................................................................................29

Line Timing Edge Alignment.................................................................................................................................................30

Pixel Timing – Continuous Mode ..............................................................................................................................................31

©Eastman Kodak Company, 2006

www.kodak.com/go/imagers

Revision 1.0 MTD/PS-0938 p2

Pixel Timing Detail.................................................................................................................................................................31

Fast Line Dump Timing.............................................................................................................................................................32

Electronic Shutter .....................................................................................................................................................................33

Electronic Shutter Line Timing .............................................................................................................................................33

Electronic Shutter – Integration Time Definition .................................................................................................................33

Electronic Shutter Description .............................................................................................................................................34

Storage and Handling ...................................................................................................................................................................35

Mechanical Drawings....................................................................................................................................................................36

Package .....................................................................................................................................................................................36

Die to Package Alignment.........................................................................................................................................................37

Glass ..........................................................................................................................................................................................38

Glass Transmission...................................................................................................................................................................39

Quality Assurance and Reliability.................................................................................................................................................40

Ordering Information ....................................................................................................................................................................41

Revision Changes..........................................................................................................................................................................42

©Eastman Kodak Company, 2006

www.kodak.com/go/imagers

Revision 1.0 MTD/PS-0938 p3

TABLE OF FIGURES

Figure 1: Sensor Architecture ........................................................................................................................................................6

Figure 2: Pixel Architecture............................................................................................................................................................7

Figure 3: Vertical to Horizontal Transfer Architecture..................................................................................................................8

Figure 4: Horizontal Register to Floating Diffusion Architecture .................................................................................................9

Figure 5: Horizontal Register .......................................................................................................................................................10

Figure 6: Output Architecture.......................................................................................................................................................11

Figure 7: Pin Description ..............................................................................................................................................................12

Figure 8: Power .............................................................................................................................................................................13

Figure 9: Frame Rates ..................................................................................................................................................................13

Figure 10: Color with Microlens Quantum Efficiency Using AR Glass .......................................................................................17

Figure 11: Color without Microlens Quantum Efficiency Using AR Glass ..................................................................................17

Figure 12: Monochrome with Microlens Quantum Efficiency .....................................................................................................18

Figure 13: Monochrome without Microlens Quantum Efficiency................................................................................................18

Figure 14: Monochrome with Lenslets Angular Quantum Efficiency .........................................................................................19

Figure 15: Color with Lenslets Angular Quantum Efficiency ......................................................................................................19

Figure 16: Overclock Regions of Interest.....................................................................................................................................20

Figure 17: Main Timing - Continuous Mode.................................................................................................................................24

Figure 18: Framing Timing without Binning ................................................................................................................................25

Figure 19: Frame Timing for Vertical Binning by 2......................................................................................................................25

Figure 20: Frame Timing Edge Alignment...................................................................................................................................26

Figure 21: Line Timing Single Output...........................................................................................................................................27

Figure 22: Line Timing Dual Output – Left Output.......................................................................................................................27

Figure 23: Line Timing Dual Output – Right Output ....................................................................................................................28

Figure 24: Line Timing Vertical Binning by 2 ...............................................................................................................................28

Figure 25: Line Timing Detail .......................................................................................................................................................29

Figure 26: Line Timing by 2 Detail................................................................................................................................................29

Figure 27: Line Timing Edge Alignment.......................................................................................................................................30

Figure 28: Pixel Timing .................................................................................................................................................................31

Figure 29: Pixel Timing Detail ......................................................................................................................................................31

Figure 30: Fast Line Dump Timing...............................................................................................................................................32

Figure 31: Electronic Shutter Line Timing...................................................................................................................................33

Figure 32: Integration Time Definition .........................................................................................................................................33

Figure 33: Package Drawing ........................................................................................................................................................36

Figure 34: Die to Package Alignment...........................................................................................................................................37

Figure 35: Glass Drawing .............................................................................................................................................................38

Figure 36: Glass Transmission.....................................................................................................................................................39

www.kodak.com/go/imagers

Revision 1.0 MTD/PS-0938 p4

KAI-11002-ABA-CD-B2 Related Products

	KAI-11002-ABA-CD-B2	KAI-11002-AAA-CR-B2	KAI-11002-AAA-CR-AE	KAI-11002-ABA-CD-BX	KAI-11002-ABA-CD-B0	KAI-11002-ABA-CD-B1
Description	CCD Sensor, 4008 Horiz pixels, 2672 Vert pixels, Rectangular, Through Hole Mount, CERAMIC, DIP-40	CCD Sensor, 4008 Horiz pixels, 2672 Vert pixels, Rectangular, Through Hole Mount, CERAMIC, DIP-40	CCD Sensor, 4008 Horiz pixels, 2672 Vert pixels, Rectangular, Through Hole Mount, CERAMIC, DIP-40	CCD Sensor, 4008 Horiz pixels, 2672 Vert pixels, Rectangular, Through Hole Mount, CERAMIC, DIP-40	CCD Sensor, 4008 Horiz pixels, 2672 Vert pixels, Rectangular, Through Hole Mount, CERAMIC, DIP-40	CCD Sensor, 4008 Horiz pixels, 2672 Vert pixels, Rectangular, Through Hole Mount, CERAMIC, DIP-40
Maker	Eastman Kodak Company	Eastman Kodak Company	Eastman Kodak Company	Eastman Kodak Company	Eastman Kodak Company	Eastman Kodak Company
Reach Compliance Code	unknown	unknown	unknown	unknown	unknow	unknow
Other features	SENSITIVITY IS 13 UV/ELECTRON, ELECTRONIC SHUTTER	SENSITIVITY IS 13 UV/ELECTRON, ELECTRONIC SHUTTER	SENSITIVITY IS 13 UV/ELECTRON, ELECTRONIC SHUTTER	SENSITIVITY IS 13 UV/ELECTRON, ELECTRONIC SHUTTER	SENSITIVITY IS 13 UV/ELECTRON, ELECTRONIC SHUTTER	SENSITIVITY IS 13 UV/ELECTRON, ELECTRONIC SHUTTER
array type	INTERLINE	INTERLINE	INTERLINE	INTERLINE	INTERLINE	INTERLINE
body width	32.99 mm	32.99 mm	32.99 mm	32.99 mm	32.99 mm	32.99 mm
body height	5.97 mm	5.97 mm	5.97 mm	5.97 mm	5.97 mm	5.97 mm
Body length or diameter	37.2 mm	37.2 mm	37.2 mm	37.2 mm	37.2 mm	37.2 mm
Dynamic Range	28 dB	28 dB	28 dB	28 dB	28 dB	28 dB
horizontal pixels	4008	4008	4008	4008	4008	4008
Installation features	THROUGH HOLE MOUNT	THROUGH HOLE MOUNT	THROUGH HOLE MOUNT	THROUGH HOLE MOUNT	THROUGH HOLE MOUNT	THROUGH HOLE MOUNT
Output type	ANALOG VOLTAGE	ANALOG VOLTAGE	ANALOG VOLTAGE	ANALOG VOLTAGE	ANALOG VOLTAGE	ANALOG VOLTAGE
Package Shape/Form	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Pixel size	9X9 µm	9X9 µm	9X9 µm	9X9 µm	9X9 µm	9X9 µm
Maximum supply voltage	15.5 V	15.5 V	15.5 V	15.5 V	15.5 V	15.5 V
Minimum supply voltage	14.5 V	14.5 V	14.5 V	14.5 V	14.5 V	14.5 V
surface mount	NO	NO	NO	NO	NO	NO
Termination type	SOLDER	SOLDER	SOLDER	SOLDER	SOLDER	SOLDER
vertical pixels	2672	2672	2672	2672	2672	2672
Sensor/temperature sensor type	IMAGE SENSOR,CCD	-	IMAGE SENSOR,CCD	IMAGE SENSOR,CCD	IMAGE SENSOR,CCD	IMAGE SENSOR,CCD

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