VIB0010TFJ
PRELIMINARY DATASHEET
S
C
NRTL
US
BCM
DC to DC
Bus Converter Module
TM
FEATURES
•
352 Vdc – 12.5 Vdc 300 W Bus Converter Module
•
High efficiency (>95%) reduces system power
consumption
•
High power density (>1000 W/in
3
)
reduces power system footprint by >40%
•
“Full Chip” V
•
I Chip package enables surface mount,
low impedance interconnect to system board
•
Contains built-in protection features: undervoltage,
overvoltage lockout, overcurrent protection, short
circuit protection, overtemperature protection.
DESCRIPTION
The V
•
I Chip Bus Converter Module is a high efficiency (>95%)
Sine Amplitude Converter (SAC)
TM
operating from a 330 to 365
Vdc primary bus to deliver an isolated 11.79 – 13.04 V nominal,
unregulated secondary. The SAC offers a low AC impedance
beyond the bandwidth of most downstream regulators, mean-
ing that input capacitance normally located at the input of a
regulator can be located at the input to the SAC. Since the K
factor of the VIB0010TFJ is 1/28, that capacitance value can be
reduced by a factor of 784x, resulting in savings of board area,
materials and total system cost.
The VIB0010TFJ is provided in a V
•
I Chip package compatible
with standard pick-and-place and surface mount assembly
processes. The V
•
I Chip package provides flexible thermal
management through its low junction-to-case and junction-to-
board thermal resistance. With high conversion efficiency the
VIB0010TFJ increases overall system efficiency and lowers
operating costs compared to conventional approaches.
•
Provides enable/disable control, internal temperature
monitoring
•
ZVS/ZCS Resonant Sine Amplitude Converter topology
•
Can be paralleled to create multi-kW arrays
TYPICAL APPLICATIONS
V
IN
= 330 – 365 V
V
OUT
= 11.79 – 13.04 V (
NO LOAD
)
P
OUT
= 300 W(
NOM
)
K = 1/28
•
High End Computing Systems
•
Automated Test Equipment
•
High Density Power Supplies
•
•
TYPICAL APPLICATION
enable / disable
switch
SW1
F1
PC
TM
POL
BCM
+In
+Out
V
OUT
-In
-Out
C1
1 µF
POL
POL
POL
(8)
V
IN
V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
v i c o r p o w e r. c o m
Rev. 1.1
9/2009
Page 1 of 16
VIB0010TFJ
PRELIMINARY DATASHEET
ABSOLUTE MAXIMUM RATINGS
+IN to –IN . . . . . . . . . . . . . . . . . . . . . . . . -1.0 Vdc – +400 Vdc
PC to –IN . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 Vdc – +20 Vdc
TM to –IN . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 Vdc – +7 Vdc
+IN/-IN to +OUT/-OUT . . . . . . . . . . . . . . . . . . . 4242 V (Hi Pot)
+IN/-IN to +OUT/-OUT . . . . . . . . . . . . . . . . . . . 500 V (working)
+OUT to –OUT . . . . . . . . . . . . . . . . . . . . . . -1.0 Vdc - +16 Vdc
Temperature during reflow . . . . . . . . . . . . . . . . . 225°C (MSL5)
PACKAGE ORDERING INFORMATION
CONTROL PIN SPECIFICATIONS
See section 5.0 for further application details and guidelines
.
PC (V
•
I Chip BCM Primary Control)
The PC pin can enable and disable the BCM. When held below
V
PC
_
DIS
the BCM shall be disabled. When allowed to float with
an impedance to –IN of greater than 50 kΩ the module will
start. When connected to another BCM PC pin, the BCMs will
start simultaneously when enabled. The PC pin is capable of
being driven high by an either external logic signal or internal
pull up to 5 V (operating).
TM (V
•
I Chip BCM Temperature Monitor)
The TM pin monitors the internal temperature of the BCM
within an accuracy of +5/-5°C. It has a room temperature
setpoint of ~3.0 V and an approximate gain of 10 mV/°C. It
can source up to 100 µA and may also be used as a “Power
Good” flag to verify that the BCM is operating.
4
A
3
2
1
A
B
C
D
E
+Out
B
C
D
E
+In
-Out
F
G
H
H
J
J
K
K
TM
RSV
PC
+Out
L
M
N
P
L
M
N
P
R
T
-In
-Out
R
T
Bottom View
Signal
Name
+In
–In
TM
RSV
PC
+Out
–Out
Designation
A1-E1, A2-E2
L1-T1, L2-T2
H1, H2
J1, J2
K1, K2
A3-D3, A4-D4,
J3-M3, J4-M4
E3-H3, E4-H4,
N3-T3, N4-T4
PART NUMBER
VIB0010TFJ
DESCRIPTION
-40°C – 125°C T
J
, J lead
V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
v i c o r p o w e r. c o m
Rev. 1.1
9/2009
Page 2 of 16
VIB0010TFJ
PRELIMINARY DATASHEET
1.0 ELECTRICAL CHARACTERISTICS
Specifications apply over all line and load conditions unless otherwise noted;
Boldface
specifications apply over the
temperature range of
-40°C < T
J
< 125°C (T-Grade);
All other specifications are at
T
J
= 25ºC
unless otherwise noted
ATTRIBUTE
Voltage range
dV/dt
Quiescent power
No load power dissipation
Inrush Current Peak
DC Input Current
K Factor
SYMBOL
V
IN
dV
IN
/dt
P
Q
P
NL
I
INR
_
P
I
IN
_
DC
K
P
OUT
P
OUT
_
P
V
OUT
I
OUT
η
η
η
R
OUT
R
OUT
R
OUT
C
OUT
F
SW
F
SW
_
RP
V
OUT
_
PP
T
ON
1
V
IN
= 352 V
DC
; See Figure 14
V
IN
= 330 – 365 V
DC
; See Figure 14
V
IN
= 352 V
DC
Average P
OUT
< = 300 W, Tpeak < 10 ms
Section 3.0 No load
Pout < = 300 W
V
IN
= 352 V, P
OUT
= 300 W
V
IN
= 330 V to 365 V, P
OUT
= 300 W
V
IN
= 352 V, T
J
= 100° C,P
OUT
= 300 W
60 W < P
OUT
< 300 W Max
T
J
= 25° C
T
J
= 125° C
T
J
= -40° C
CONDITIONS / NOTES
MIN
330
PC connected to -IN
V
IN
= 352 V
V
IN
= 330 to 365 V
V
IN
= 365 V C
OUT
= 1000 µF,
P
OUT
= 300 W
P
OUT
= 300 W
TYP
352
230
7.1
2
MAX
365
1
370
10
15
4.5
1
1/28
300
282
450
11.79
94.2
94
93.3
90
10
14
7
2.13
4.26
C
OUT
= 0 µF, P
OUT
= 300 W, V
IN
= 352 V,
Section 8.0
V
IN
= 352 V, C
PC
= 0; See Figure 16
12.5
16.5
10
2.25
4.5
200
460
390
18
25
14
1000
2.37
4.74
400
620
95.3
94.6
13.04
26
W
W
V
A
%
%
%
mΩ
mΩ
mΩ
uF
MHz
MHz
mV
ms
UNIT
Vdc
V/µs
mW
W
A
A
( )
V
OUT
V
IN
Output Power (Average)
Output Power (Peak)
Output Voltage
Output Current (Average)
Efficiency (Ambient)
Efficiency (Hot)
Minimum Efficiency
(Over Load Range)
Output Resistance (Ambient)
Output Resistance (Hot)
Output Resistance (Cold)
Load Capacitance
Switching Frequency
Ripple Frequency
Output Voltage Ripple
V
IN
to V
OUT
(Application of V
IN
)
PC
PC Voltage (Operating)
PC Voltage (Enable)
PC Voltage (Disable)
PC Source Current (Startup)
PC Source Current (Operating)
PC Internal Resistance
PC Capacitance (Internal)
PC Capacitance (External)
External PC Resistance
PC External Toggle Rate
PC to V
OUT
with PC Released
PC to V
OUT
, Disable PC
V
PC
V
PC
_
EN
V
PC
_
DIS
I
PC
_
EN
I
PC
_
OP
R
PC
_
SNK
C
PC
_
INT
C
PC
_
EXT
R
PC
F
PC
_
TOG
Ton2
T
PC
_
DIS
4.7
2
50
2
50
5
2.5
100
3.5
150
Internal pull down resistor
Section 5.0
External capacitance delays PC enable time
Connected to –V
IN
V
IN
= 352 V, Pre-applied
C
PC
= 0, C
OUT
= 0; See Figure 16
V
IN
= 352 V, Pre-applied
C
PC
= 0, C
OUT
= 0; See Figure 16
5.3
3
<2
300
5
400
1000
1000
1
50
50
100
4
150
10
V
V
V
uA
mA
kΩ
pF
pF
kΩ
Hz
µs
µs
V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
v i c o r p o w e r. c o m
Rev. 1.1
9/2009
Page 3 of 16
VIB0010TFJ
PRELIMINARY DATASHEET
1.0 ELECTRICAL CHARACTERISTICS (CONT.)
Specifications apply over all line and load conditions unless otherwise noted;
Boldface
specifications apply over the
temperature range of
-40°C < T
J
< 125°C (T-Grade);
All other specifications are at
T
J
= 25ºC
unless otherwise noted
ATTRIBUTE
TM
TM accuracy
TM Gain
TM Source Current
TM Internal Resistance
External TM Capacitance
TM Voltage Ripple
PROTECTION
Negative going OVLO
Positive going OVLO
Negative going UVLO
Positive going UVLO
Output Overcurrent Trip
Short Circuit Protection
Trip Current
Short Circuit Protection
Response Time
Thermal Shutdown
Junction setpoint
GENERAL SPECIFICATION
Isolation Voltage (Hi-Pot)
Working Voltage (IN – OUT)
Isolation Capacitance
Isolation Resistance
MTBF
Agency Approvals/Standards
SYMBOL
CONDITIONS / NOTES
MIN
TYP
MAX
UNIT
A
CTM
A
TM
I
TM
R
TM
_
SNK
C
TM
V
TM
_
PP
-5
10
100
25
C
TM
= 0µF, V
IN
= 365 V, P
OUT
= 300 W
50
40
100
+5
50
50
200
ºC
mV/°C
uA
kΩ
pF
mV
V
IN
_
OVLO
-
V
IN
_
OVLO
+
V
IN
_
UVLO
-
V
IN
_
UVLO
+
I
OCP
I
SCP
T
SCP
T
J
_
OTP
V
IN
= 352 V, 25°C
366
380
270
295
32
60
383
387
295
310
42
390
400
325
325
52
V
V
V
V
A
A
1.2
125
130
135
us
°C
V
HIPOT
V
WORKING
C
IN
_
OUT
R
IN
_
OUT
Unpowered unit
MIL HDBK 217F, 25° C, GB
cTUVus
CE Mark
ROHS 6 of 6
4242
500
10
660
4.2
500
800
V
V
pF
MΩ
Mhrs
V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
v i c o r p o w e r. c o m
Rev. 1.1
9/2009
Page 4 of 16
VIB0010TFJ
PRELIMINARY DATASHEET
1.1 APPLICATION CHARACTERISTICS
All specifications are at
T
J
= 25ºC
unless otherwise noted. See associated figures for general trend data.
ATTRIBUTE
No Load Power
Inrush Current Peak
Efficiency (Ambient)
Efficiency (Hot – 100°C)
Output Resistance (-40°C)
Output Resistance (25°C)
Output Resistance (100°C)
Output Voltage Ripple
V
OUT
Transient (Positive)
V
OUT
Transient (Negative)
Undervoltage Lockout
Response Time Constant
Output Overcurrent
Response Time Constant
Overvoltage Lockout
Response Time Constant
TM Voltage (Ambient)
SYMBOL
P
NL
I
NR
_
P
η
η
R
OUT
R
OUT
R
OUT
V
OUT
_
PP
V
OUT
_
TRAN
+
V
OUT
_
TRAN
-
T
UVLO
T
OCP
T
OVLO
V
TM
_
AMB
T
J
≅
27°C
32 < I
OCP
< 52 A
CONDITIONS / NOTES
V
IN
= 352 V, PC enabled; See Figure 1
C
OUT
= 1000 µF, P
OUT
= 300 W
V
IN
= 352 V, P
OUT
= 300 W
V
IN
= 352 V, P
OUT
= 300 W
V
IN
= 352 V
V
IN
= 352 V
V
IN
= 352 V
C
OUT
= 0 uF, P
OUT
= 300 W @ V
IN
= 352,
V
IN
= 352 V
I
OUT
_
STEP
= 0
TO
25 A,
I
SLEW
>10 A/us; See Figure 11
I
OUT
_
STEP
= 25 A to 0 A,
I
SLEW
> 10 A/us; See Figure 12
TYP
7.1
2
95.3
94.6
10
12.5
16.5
200
380
380
60
4.62
47
3
UNIT
W
A
%
%
mΩ
mΩ
mΩ
mV
mV
mV
µs
ms
µs
V
V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
v i c o r p o w e r. c o m
Rev. 1.1
9/2009
Page 5 of 16
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