9.39
版数
VER.
年月日
D A T E
CN NO.
変 更 内 容
DESCRIPTION
½ 図
DR.
担 ½
CHK.
査 閲
APPD.
承 認
APPD.
1
8.2
2-1.6
±0.05
0.1 X Y
2-2.1
±0.05
7.2
±0.05
A1
A12
Z
LOT NO.(NOTE.4)
9.65
2-1.1
±0.05
2-0.6
±0.05
0.05 X Y Z
0
1.4
1.6
(CENTER HEIGHT)
2.54
-0.02
+0.06
+0.06
8.34
-0.02
A
2-1.6
±0.05
0.1 X Y
Z
6.9
8
0.8
4.4
0.7
-0.3
(ALL T/H)
6.05
(BOSS)
A1
6
A12
4
5
0
0.7
-0.3
2-2.1
±0.05
2-0.6
±0.05
0.05
X
Y
Z
0
X
2-1.1
±0.05
1
8.2
B12
0.6
±0.025
7.2
±0.08
1
C
B1
4-0.2
±0.03
0.35
M
A-B C
D
2-1.2
±0.05
0.3
M
A-B
2-1.2
±0.05
0.3
M
A-B
1.4
4.4
0.8
3.34
TOP SURFACE OF BRACKET
Z
APPLICABLE P.C.B DIMENSION(REF.)
適合基板寸法(参考）
0.85 (A1)
1.35 (A2)
1.85 (A3)
2.35 (A4)
2.85 (A5)
3.35 (A6)
3.85 (A7)
4.35 (A8)
4.85 (A9)
5.35 (A10)
5.85 (A11)
6.35 (A12)
8.2
0
0.8 (B12)
1.2 (B11)
2 (B10)
2.4 (B9)
2.8 (B8)
3.2 (B7)
4 (B6)
4.4 (B5)
4.8 (B4)
5.2 (B3)
6 (B2)
6.4 (B1)
12-1.1
±0.03
0.05 X Y
A2
A1
Y
0
12-0.3
±0.03
0.05 X Y Z
0.95
±0.05
Z
12-0.15
±0.05
0.15
M
A-B C
7
12-0.12
±0.03
0.15
M
A-B D
0.66
0
0.75
±0.025
0.65
1.35
9
3
1.35
0.65
0
0.91
±0.15
A
2
B
MOUNTING CONDITION
(5 : 1)
6.65
±0.1
1.15
5.5
±0.2
MATING BOTTOM FACE
0.8 (B12)
1.2 (B11)
2 (B10)
2.4 (B9)
2.8 (B8)
3.2 (B7)
4 (B6)
4.4 (B5)
4.8 (B4)
5.2 (B3)
6 (B2)
6.4 (B1)
1
0
0.75
±0.025
0.65
±0.05
12- 0.4
±0.05
0.05 X Y
Z
12-0.2
±0.05
0.1
M
A-B C D
A
(10 : 1)
6.5 max.
0
0.85 (A1)
1.35 (A2)
1.85 (A3)
2.35 (A4)
2.85 (A5)
3.35 (A6)
3.85 (A7)
4.35 (A8)
4.85 (A9)
5.35 (A10)
5.85 (A11)
6.35 (A12)
TABLE 2. PIN DEFINE
A12
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
PIN
GND
SSRXp2
SSRXn2
VBUS
SUB1
Dn1
Dp1
CC1
VBUS
SSTXn1
SSTXp1
GND
SIGNAL NAME
B1
B2
B3
B4
B5
B6
B7
B8
B9
B10
B11
B12
PIN
GND
SSTXp2
SSTXn2
VBUS
CC2
Dp2
Dn2
SUB2
VBUS
SSRXn1
SSRXp1
GND
SIGNAL NAME
10 REAR SHIELD
9 LOCATOR
8 BRACKET
7 SHELL
6 GND PLATE
5 GND MID PLATE
4 INSULATOR
3 CONTACT C
2 CONTACT B
1 CONTACT A
符号
NO.
名 称
DESCRIPTION
1
1
1
1
2
1
1
6
6
12
個 数
QTY.
STAINLESS STEEL
THERMOPLASTIC RESIN
STAINLESS STEEL
STAINLESS STEEL
STAINLESS STEEL
STAINLESS STEEL
THERMOPLASTIC RESIN
COPPER ALLOY
COPPER ALLOY
COPPER ALLOY
材 料
MATERIAL
NICKEL PLATING
COLOR:BLACK
NICKEL PLATING
BLACK NICKEL PLATING
NICKEL PLATING
NICKEL PLATING
COLOR:BLACK
TABLE 1
TABLE 1
TABLE 1
仕 上
FINISH
PLATING THICKNESS:1μm Min.
HALOGEN-FREE
PLATING THICKNESS:1μm Min.
PLATING THICKNESS:1μm Min.
PLATING THICKNESS:0.8μm Min.
PLATING THICKNESS:1μm Min.
HALOGEN-FREE
3.35
MATED CONDITION
(5 : 1)
10
2.8
6.05
DCF-C-213H(12.08)
NOTE 1.COPLANARITY OF SMT TERMINAL IS 0.1 MAX
NOTE 2.RECOMMENDED METAL MASK THICKNESS:120 um
NOTE 3.THE SHELL LENGTH IS LESS THAN THE MINIMUM SPECIFIED BY THE USB STANDARD.
AS SUCH IT CANNOT INDEPENDENTLY BE GUARANTEED TO MEET ALL TYPE C MECHANICAL REQUIREMENTS.
THE SYSTEM IMPLEMENTER IS RESPONSIBLE FOR ACHIEVING PRODUCT RELIABILITY AND PASSING USB COMPLIANCE TESTING.
REFERENCE THE USB TYPE C SPECIFICATION RELEASE 1.1,SECTION 3.2.1,NOTE7.
NOTE 4.LOT NUMBER IS MARKED AS INDIDATED.
(EX) 5 6 15 1
EQUIPMENT No. (NUMBER OR ALPHABET)
DAY (TWO-DIGITS NUMBER)
MONTH (NUN. TO SEP.:1 TO 9, OCT.:O, NOV.:X, DEC.:Y)
YEAR (END OF DIGIT AT CHRISTIAN ERA)
10
20
30
40
50
60
70
80
90
100
TABLE 1
FINISH
PLATING THICKNESS
備 考
REMARKS
仕様書(SPECIFICATION)
第1版(ORIGINAL DATE)
½図
DR.
16/JUN/2015
尺度(SCALE)
シリーズ(SERIES)
GOLD FLASH
NICKEL:2μm MIN.
CONTACT AREA OVER PLLADIUM-NICKEL PALLADIUM-NICKEL:0.75μm MIN.
OVER NICKEL
GOLD FLASH:0.05μm MIN.
SOLDER TALES GOLD FLASH OVER NICKEL
NICKEL:2μm MIN.
GOLD FLASH:0.03μm MIN.
名称(TITLE)
寸法(DIMENSION)
．
．
．
．
±
0.8
±
0.4
±
0.1
±
角度(ANGLES)
°
’
°
±
±
担½
CHK.
査閲
APPD.
承認
APPD.
M.SASAKI
―
T.MASUMOTO
DX07S024XJ1
図面番号(DRAWING NO.)
質量(MASS)
版数
(VER.)
単½(UNIT)：㎜
SJ116123
0
S/W
JAE Connector DIV. Proprietary.Copyright(C) 2015, Japan Aviation Electronics Industry, LTD.
SIZE
一般公差(GENERAL TOLERANCE)
JAPAN AVIATION
ELECTRONICS
INDUSTRY,LTD.
A2
5:1
DX07
日本航空電子工業株式会社
1
2015/06/18
5 6 15 1
図面番号(DRAWING NO.)
SJ116123
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