EEWORLDEEWORLDEEWORLD

Part Number

Search

CDR31BX561BKSR

Description
Ceramic Capacitor, Multilayer, Ceramic, 100V, 10% +Tol, 10% -Tol, BX, 15% TC, 0.00056uF, Surface Mount, 0805, CHIP
CategoryPassive components    capacitor   
File Size1MB,10 Pages
ManufacturerKEMET
Websitehttp://www.kemet.com
Download Datasheet Parametric View All

CDR31BX561BKSR Overview

Ceramic Capacitor, Multilayer, Ceramic, 100V, 10% +Tol, 10% -Tol, BX, 15% TC, 0.00056uF, Surface Mount, 0805, CHIP

CDR31BX561BKSR Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerKEMET
package instruction, 0805
Reach Compliance Codenot_compliant
ECCN codeEAR99
Factory Lead Time85 weeks
capacitance0.00056 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
high1.3 mm
JESD-609 codee0
length2 mm
Manufacturer's serial numberCDR31
Installation featuresSURFACE MOUNT
multi-layerYes
negative tolerance1%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
Package formSMT
method of packingTR, 7 INCH
positive tolerance1%
Rated (DC) voltage (URdc)100 V
GuidelineMIL-PRF-55681
seriesC(SIZE)N
size code0805
surface mountYES
Temperature characteristic codeBX
Temperature Coefficient15% ppm/°C
Terminal surfaceTin/Lead (Sn60Pb40) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
width1.25 mm
CERAMIC CHIP/MIL-PRF-55681
CAPACITOR OUTLINE DRAWINGS
BW
DIMENSIONS—MILLIMETERS AND (INCHES)
STYLE
KEMET
SIZE
CODE
T
L
W
MIN.
MAX.
BW
CDR01
CDR02
CDR03
CDR04
CDR05
CDR06
CDR31
CDR32
CDR33
CDR34
CDR35
C0805
C1805
C1808
C1812
C1825
C2225
C0805
C1206
C1210
C1812
C1825
2.03 ±.38 (.080 ±.015)
4.57 ±.38 (.180 ±.015)
4.57 ±.38 (.180 ±.015)
4.57 ±.38 (.180 ±.015)
+.51
+.020
4.57
.180
–.38
–.015
5.72 ±.51 (.225 ±.020)
2.00 ±.20 (.078 ±.008)
3.20 ±.20 (.125 ±.008)
3.20 ±.25 (.125 ±.010)
4.50 ±.25 (.176 ±.010)
4.50 ±.30 (.176 ±.012)
(
)
1.27 ±.38 (.050 ±.015)
1.27 ±.38 (.050 ±.015)
2.03 ±.38 (.080 ±.015)
3.18 ±.38 (.125 ±.015)
+.51
+.020
6.35
.250
–.38
–.015
6.35 ±.51 (.250 ±.020)
1.25 ±.20 (.049 ±.008)
1.60 ±.20 (.062 ±.008)
2.50 ±.25 (.098 ±.010)
3.20 ±.25 (.125 ±.010)
6.40 ±.30 (.250 ±.012)
.56 (.022)
.56 (.022)
.56 (.022)
.56 (.022)
.51 (.020)
.51 (.020)
1.40 (.055)
1.40 (.055)
2.03 (.080)
2.03 (.080)
2.03 (.080)
2.03 (.080)
1.30 (.051)
1.30 (.051)
1.50 (.059)
1.50 (.059)
1.50 (.059)
.51 ± 0.25 (.020 ±.010)
.51 ± 0.25 (.020 ±.010)
.51 ± 0.25 (.020 ±.010)
.51 ± 0.25 (.020 ±.010)
.51 ± 0.25 (.020 ±.010)
.51 ± 0.25 (.020 ±.010)
.50 ± 0.20 (.020 ±.008)
.50 ± 0.20 (.020 ±.008)
.50 ± 0.25 (.020 ±.010)
.50 ± 0.25 (.020 ±.010)
.50 ± 0.30 (.020 ±.012)
(
)
Note:
For MIL-C55681 “S” Endmet, the length, width and thickness positive tolerances (including bandwidth) cited above are allowed to increase by the following
amounts:
Length
Width
Length
CDR01
0.51MM (.020)
0.38MM (.015)
CDR02-06
0.64MM (.025)
0.38MM (.015)
CDR31-35
0.60MM (.023)
0.30MM (.012)
MIL-PRF-55681 PART NUMBER ORDERING INFORMATION
CDR01
B P
101 B K
Z
M
STYLE & SIZE CODE
STYLE
C — Ceramic
D — Dielectric, Fixed Chip
R — Established Reliability
FAILURE RATE LEVEL
(%/1000 hrs.)
TERMINATION FINISH
S — Solder Coated, Final
(SolderGuard I)
U — Base Metalization—
Barrier Metal—Solder
Coated
(SolderGuard I)
W — Base Metalization—
Barrier Metal—Tinned
Tin or (Tin/Lead Alloy)
SolderGuard II
Y — Base Metalization
Barrier Metal—Tinned
(100% Tin)
Solderguard II
RATED TEMPERATURE
–55°C to +125°C
DIELECTRICS
P —± 30 PPM/°C—WITH OR WITHOUT VOLTAGE
X —± 15%—without voltage
+ 15%, –25%—with voltage
CAPACITANCE
Expressed in picofarads (pF).
First 2 digits represent significant figures and the last digit specifies the number of zeros to follow.
(Use 9 for 1.0 through 9.9pF. Example: 2.2pF = 229)
CAPACITANCE TOLERANCE
B
C
D
F
±.1 pF ±.25 pF ±.5 pF ±1%
J
±5%
K
M
±10% ±20%
Z – Base metallization -
barrier metal-tinned (tin/lead
alloy, with a min. of 4% lead)
RATED VOLTAGE
A — 50; B — 100
KEMET/MIL-PRF-55681 PART NUMBER EQUIVALENTS
C 0805
P 101 K
1 G M
L
CERAMIC
SIZE CODE
See Table Above
END METALIZATION
L — 70Sn/30Pb Plated (Military codes Z,W,U )
C— 100% Tin Plated (Military code Y)
H – Sn60 Coated (Military code S)
SPECIFICATION
P -MIL-PRF-55681 = CDR01-CDR06
N-MIL-PRF-55681 = CDR31-CDR35
FAILURE RATE
(%/1,000 hrs.)
R — 0.01
S — 0.001
M — 1.0
P — 0.1
CAPACITANCE CODE
Expressed in picofarads (pF).
First two digits represent significant figures.
Third digit specifies number of zeros. (Use 9
for 1.0 thru 9.9 pF. Example: 2.2 pF –229)
VOLTAGE TEMPERATURE CHARACTERISTIC
Designated by Capacitance
Change Over Temperature Range
G — BP (C0G/NP0) (±30 PPM/°C)
X — BX (±15% Without Voltage
+15% -25% With Voltage)
CAPACITANCE TOLERANCE
B
C
D
F
J
K
M
±
.1 pF
±
.25 pF
±
.5 pF
±
1%
±
5%
±
10%
±
20%
VOLTAGE
1 — 100V, 5 — 50V
*
Part Number Example: C0805P101K1GML
(14 digits - no spaces)
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
87
Ceramic Surface Mount
M — 1.0
P — 0.1
R — 0.01
S — 0.001
S7-200 PLC decryption software download is definitely available!!
S7-200 PLC decryption software download Absolutely can be downloaded!! http://www.tf168.cn/p/l/plc/atfile/S7-200.rarClick here to download http://www.tf168.cn/p/l/plc/atfile/s7200.rarClick here to dow...
qqwwe Analog electronics
GaN is here! Part 2: Measurement
[align=left][color=#000]In my last blog post[/url], I introduced body diode reverse recovery. Today, let's take a look at a method for measuring reverse recovery in a real circuit. [/color][/align][al...
maylove Analogue and Mixed Signal
Xianji Official Guide: Unlocking the 400MHz GPIO Switching Frequency of the HPM6700 Series
In this issue, the Pioneer technical officer will show you how to use the HPM6700 series to achieve a GPIO flip frequency of up to 400Mhz. Scroll down to learn more!--------- "Unlocking Journey" start...
谍纸天眼 Domestic Chip Exchange
Sanfen: I haven’t been in a very good mood these days, so I came here to complain!
I haven't been in a good mood these days, so I came here to complain! I wish you all a happy day. I want to add more points, but I...
chenxu124 Embedded System
How to debug the kernel and kernel modules
If you are doing Linux development, you must have had this idea, want to debug the kernel or a moduleSo how to do it? Many books mention GDB, so how to use GDB to debug the kernel?The following docume...
daicheng Linux and Android
Thanks Renesas
Thanks to Renesas and eeworld. I have received the electric baking pan. This is the first time in my life that I have won a prize worth more than 100 yuan. I will work hard......
908508455a Renesas Electronics MCUs

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 832  2440  2195  1053  331  17  50  45  22  7 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号