MLCC
Surface Mount EMI Filters E01 & E07
Electrical Details
Capacitance Range
Temperature Coefficient of
Capacitance (TCC)
C0G/NP0
X7R
C0G/NP0
X7R
Insulation Resistance (IR)
Dielectric Withstand Voltage (DWV)
C0G/NP0
Ageing Rate
X7R
<2% per time decade
10pF to 1.8µF
0 ± 30ppm/˚C
±15% from -55˚C to +125˚C
Cr > 50pF ≤0.0015
Cr ≤ 50pF = 0.0015(15÷Cr+0.7)
≤ 0.025
100G or 1000secs (whichever is the less)
Voltage applied for 5 ±1 seconds, 50mA
charging current maximum
Zero
EMI filters E01 & E07 feedthrough capacitors
The Syfer E01 and E07 ranges of feedthrough MLCC
chip ‘C’ filters are 3 terminal chip devices designed to
offer reduced inductance compared to conventional
MLCCs when used in signal line filtering.
The filtered signal passes through the chip internal
electrodes and the noise is filtered to the grounded side
contacts, resulting in reduced length noise transmission
paths.
Available in C0G/NP0 & X7R dielectrics, with current
ratings of 300mA, 1A, 2A, 3A and voltage ratings of
25Vdv to 200Vdc. Also available with FlexiCap™
termination which is strongly recommended for new
designs.
Commonly used in automotive applications, a range
qualified to AEC-Q200 is also available.
Dissipation Factor
E01
300mA,
E07
1A/2A/3A
Dimensions
0603
L
W
T
B1
B2
1.6 ± 0.2
(0.063 ± 0.008)
0.8 ± 0.2
(0.003 ± 0.008)
0.5 ± 0.15
(0.02 ± 0.006)
0.3 ± 0.2
(0.012 ± 0.008)
0.2 ± 0.1
(0.008 ± 0.004)
0805
2.0 ± 0.3
(0.079 ± 0.012)
1.25 ± 0.2
(0.049 ± 0.008)
1.0 ± 0.15
(0.039 ± 0.006)
0.60 ± 0.2
(0.024 ± 0.008)
0.3 ± 0.15
(0.012 ± 0.006)
1206
3.2 ± 0.3
(0.126 ± 0.012)
1.6 ± 0.2
(0.063 ± 0.008)
1.1 ± 0.2
(0.043 ± 0.008)
0.95 ± 0.3
(0.037 ± 0.012)
0.5 ± 0.25
(0.02 ± 0.01)
1806
4.5 ± 0.35
(0.177 ± 0.014)
1.6 ± 0.2
(0.063 ± 0.008)
1.1 ± 0.2
(0.043 ± 0.008)
1.4 ± 0.3
(0.055 ± 0.012)
0.5 ± 0.25
(0.02 ± 0.01)
1812
4.5 ± 0.35
0.18 ± 0.014
3.2 ± 0.3
0.126 ± 0.012
2.1
0.08
1.45±
0.35
(0.057
± 0.014)
0.75±
0.25
(0.03
± 0.01)
0603
A
B
C
D
E
Notes: 1)
2)
3)
4)
0.6 (0.024)
0.6 (0.024)
0.4 (0.016)
0.2 (0.008)
0.4 (0.016)
0805
0.95 (0.037)
0.9 (0.035)
0.3 (0.012)
0.4 (0.016)
0.75 (0.030)
1206
1.2 (0.047)
0.9 (0.035)
0.6 (0.024)
0.8 (0.031)
1.0 (0.039)
1806
1.2 (0.047)
1.4 (0.055)
0.8 (0.031)
1.4 (0.055)
1.0 (0.039)
1812
2.65
1.4 (0.055)
0.8 (0.031)
1.4 (0.055)
2.05 (0.081)
All dimensions mm (inches).
Pad widths less than chip width gives improved mechanical performance.
The solder stencil should place 4 discrete solder pads. The unprinted distance between ground pads is shown as
dimension E.
Insulating the earth track underneath the filters is acceptable and can help avoid displacement of filter during
soldering but can result in residue entrapment under the chip.
Syfer Technology Ltd.
Old Stoke Road, Arminghall
Norwich, Norfolk, NR14 8SQ
United Kingdom
Tel: +44 1603 723300 | Email sales@syfer.co.uk | www.syfer.com
E01E07Datasheet Issue 2 (P108015) Release Date 15/08/13
Page 1 of 8
Type
Chip Size
Max Current
Rated Voltage
25Vdc
Dielectric
C0G/NP0
X7R
C0G/NP0
X7R
C0G/NP0
X7R
C0G/NP0
X7R
10pF-390pF
2.7nF-18nF
10pF-56pF
2.7nF-12nF
-
-
-
-
0603
300mA
0805
300mA
E01
1206
300mA
1806
300mA
Minimum and maximum capacitance values
180pF-1.5nF
470pF-100nF
22pF-820pF
560pF-68nF
22pF-560pF
560pF-27nF
-
-
560pF-3.9nF
5.6nF-330nF
22pF-3.3nF
4.7nF-220nF
22pF-2.2nF
1.8nF-100nF
560pF-1.2nF
2.7nF-56nF
820pF-4.7nF
3.9nF-560nF
22pF-3.9nF
3.3nF-330nF
22pF-3.3nF
3.3nF-180nF
56pF-1nF
3.9nF-100nF
50Vdc
100Vdc
200Vdc
Note:
1) Unshaded E01 cells indicate AEC-Q200 qualified range.
Type
Chip Size
Max Current
Rated Voltage
25Vdc
Dielectric
C0G/NP0
X7R
C0G/NP0
X7R
C0G/NP0
X7R
C0G/NP0
X7R
10pF-390pF
2.7nF-18nF
12pF-56pF
2.7nF-12nF
-
-
-
-
0603
1A
0805
2A
E07
1206
2A
1806
2A
1812
3A
Minimum and maximum capacitance values
180pF-1.5nF
820pF-100nF
10pF-220pF
1nF-68nF
10pF-120pF
1nF-27nF
-
-
560pF-3.9nF
10nF-330nF
22pF-1nF
10nF-220nF
22pF-560pF
10nF-100nF
15pF-180pF
12nF-56nF
820pF-4.7nF
22nF-560nF
100pF-2.2nF
22nF-330nF
100pF-680pF
22nF-180nF
56pF-470pF
22nF-100nF
-
560nF-1.8µF
-
330nF-1.5µF
-
180nF-820nF
-
100nF-270nF
50Vdc
100Vdc
200Vdc
E07 25Vdc C0G/NP0 0805 to 1806 have a maximum current of 1A.
Ordering Information – E01 & E07 feedthrough capacitors
1206
Chip Size
0603
0805
1206
1806
1812
Y
Termination
J
= Nickel Barrier (Tin)
*Y = FlexiCap™ (Tin -
X7R only)
A
= (Tin/Lead) Not
RoHS compliant.
*H = FlexiCap™
(Tin/Lead) Not RoHS
compliant.
100
Rated Voltage
025
= 25V
050
= 50V
100
= 100V
200
= 200V
0103
Capacitance in Pico
farads (pF)
First digit is 0. Second and
third digits are significant
figures of capacitance code.
The fourth digit is number of
zeros following
Example:
0103=10000pF.
M
Capacitance
Tolerance
M
= ±20%
X
Dielectric
Codes
A
= C0G/NP0
AEC-Q200
C
= C0G/NP0
E
= X7R
AEC-Q200
X
= X7R
T
Packaging
T
= 178mm
(7”) reel
R
= 330mm
(13”) reel
B
= Bulk pack
– tubs or trays
E07
Type
E01
E07
Note: * FlexiCap™ termination only available in X7R material. Please contact our Sales Office for any special requirements.
Syfer Technology Ltd: E01E07Datasheet Issue 2 (P108015)
Release Date 15/08/13
Page 2 of 8
Open board insertion loss performance in 50 system
Open Board Performance
Capacitance
10pF
22pF
33pF
47pF
68pF
100pF
150pF
220pF
330pF
470pF
560pF
680pF
820pF
1nF
1.5nF
2.2nF
3.3nF
4.7nF
6.8nF
10nF
15nF
22nF
33nF
47nF
68nF
100nF
150nF
220nF
330nF
470nF
560nF
0.1MHz
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
2
4
6
8
10
13
16
18
1MHz
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
2
3
5
8
12
14
17
20
24
26
30
33
36
39
10MHz
0
0
0
0
0
0
0
0
1
2
3
4
5
7
9
12
14
18
21
24
27
31
34
38
41
45
48
52
55
60
65
100MHz
0
0
1
2
3
5
8
12
15
18
20
22
24
27
31
34
39
46
50
48
45
43
40
40
40
40
40
40
40
40
40
1GHz
7.5
16
22
28
41
28
24
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
Resonance Freq (MHz) approx.
2200
1600
1350
1150
900
800
700
600
500
425
350
300
260
220
200
170
135
110
90
80
65
56
40
34
30
28
24
17
15.5
14
12
Syfer Technology Ltd: E01E07Datasheet Issue 2 (P108015)
Release Date 15/08/13
Page 3 of 8
Soldering Information
Syfer MLCCs are compatible with all recognised
soldering/mounting methods for chip capacitors. A detailed
application note is available at syfer.com
Reflow Soldering
Syfer recommend reflow soldering as the preferred method for
mounting MLCCs. Syfer MLCCs can be reflow soldered using a
reflow profile generally defined in IPC/FEDEC J-STD-020. Sn
plated termination chip capacitors are compatible with both
conventional and lead free soldering with peak temperatures of
260 to 270˚C acceptable.
The heating ramp rate should be such that components see a
temperature rise of 1.5 to 4˚C per second to maintain
temperature uniformity through the MLCC.
The time for which the solder is molten should be maintained
at a minimum, so as to prevent solder leaching. Extended
times above 230˚C can cause problems with oxidation of Sn
plating. Use of an inert atmosphere can help if this problem is
encountered. Palladium/Silver (Pd/Ag) terminations can be
particularly susceptible to leaching with free lead, tin rich
solders and trials are recommended for this combination.
Cooling to ambient temperature should be allowed to occur
naturally, particularly if larger chip sizes are being soldered.
Natural cooling allows a gradual relaxation of thermal
mismatch stresses in the solder joints. Forced cooling should
be avoided as this can induce thermal breakage.
Wave Soldering
Wave soldering is generally acceptable, but the thermal
stresses caused by the wave have been shown to lead to
potential problems with larger or thicker chips. Particular care
should be taken when soldering SM chips larger than size 1210
and with a thickness greater than 1.0mm for this reason.
Maximum permissible wave temperature is 270˚C for SM
chips.
The total immersion time in solder should be kept to a
minimum. It is strongly recommended that Sn/Ni plated
terminations are specified for wave soldering applications.
Solder Leaching
Leaching is the term for the dissolution of silver into the solder
causing a failure of the termination system which causes
increased ESR, tan δ and open circuit faults, including
ultimately the possibility of the chip becoming detached.
Leaching occurs more readily with higher temperature solders
and solders with a high tin content. Pb free solders can be very
prone to leaching certain termination systems. To prevent
leaching, exercise care when choosing solder allows and
minimize both maximum temperature and dwell time with the
molten solder.
Plated terminations with nickel or copper anti-leaching barrier
layers are available in a range of top coat finishes to prevent
leaching occurring. These finishes also include Syfer FlexiCap
TM
for improved stress resistance post soldering.
Multilayer ceramic chip with nickel or copper barrier
termination
Rework of Chip Capacitors
Syfer recommend hot air/gas as the preferred method of
applying heat for rework. Apply even heat surrounding the
component to minimise internal thermal gradients. Soldering
irons or other techniques that apply direct heat to the chip or
surrounding area should not be used as these can result in
micro cracks being generated.
Minimise the rework heat duration and allow components to
cool naturally after soldering.
Use of Silver Loaded Epoxy Adhesives
Chip capacitors can be mounted to circuit boards using silver
loaded adhesive provided the termination material of the
capacitor is selected to be compatible with the adhesive. This
is normally PdAg. Standard tin finishes are often not
recommended for use with silver loaded epoxies as there can
be electrical and mechanical issues with the joint integrity due
to material mismatch.
Handling & Storage
Components should never be handled with fingers;
perspiration and skin oils can inhibit solderability and will
aggravate cleaning.
Chip capacitors should never be handled with metallic
instruments. Metal tweezers should never be used as these
can chip the product and leave abraded metal tracks on the
product surface. Plastic or plastic coated metal types are
readily available and recommended – these should be used
with an absolute minimum of applied pressure.
Incorrect storage can lead to problems for the user. Rapid
tarnishing of the terminations, with an associated degradation
of solderability, will occur if the product comes into contact
with industrial gases such as sulphur dioxide and chlorine.
Storage in free air, particularly moist or polluted air, can result
in termination oxidation.
Packaging should not be opened until the MLCs are required
for use. If opened, the pack should be re-sealed as soon as
practicable. Alternatively, the contents could be kept in a
sealed container with an environmental control agent.
Long term storage conditions, ideally, should be temperature
controlled between -5 and +40˚C and humidity controlled
between 40% and 60% R.H.
Taped product should be stored out of direct sunlight, which
might promote deterioration in tape or adhesive performance.
Product, stored under the conditions recommended above, in
its “as received” packaging, has a minimum shelf life of 2
years.
SM Pad Design
Syfer conventional 2-terminal chip capacitors can generally be
mounted using pad designs in accordance with IPC-7351,
Generic Requirements for Surface Mount Design and Land
Pattern Standards, but there are some other factors that have
been shown to reduce mechanical stress, such as reducing the
pad width to less than the chip width. In addition, the position
of the chip on the board should also be considered.
3-terminal components are not specifically covered by IPC-
7351, but recommended pad dimensions are included in the
Syfer catalogue/website for these components.
Syfer Technology Ltd: E01E07Datasheet Issue 2 (P108015)
Release Date 15/08/13
Page 4 of 8
FlexiCap
TM
Termination
FlexiCap
TM
has been developed as a result of listening to
customer’s experiences of stress damage to MLCCs from many
manufacturers, often caused by variations in production
processes.
Our answer is a proprietary flexible epoxy polymer termination
material that is applied to the device under the usual nickel
barrier finish. FlexiCap
TM
will accommodate a greater degree of
board bending than conventional capacitors.
REACH (Registration, Evaluation, Authorisation and
restriction of Chemicals) Statement
The main purpose of REACH is to improve the protection of
human health and the environment from the risks arising from
the use of chemicals.
Syfer Technology Ltd maintains both ISO 14001,
Environmental Management System and OHSAS 18001 Health
& Safety Management System approvals that require and
ensure compliance with corresponding legislation such as
REACH.
For further information, please contact the sales office at
sales@syfer.co.uk
Ranges are available with FlexiCap
TM
termination material
offering increased reliability and superior mechanical
performance (board flex and temperature cycling) when
compared with standard termination materials. Refer to Syfer
application note reference AN0001. FlexiCap
TM
capacitors
enable the board to be bent almost twice as much as before
mechanical cracking occurs. Refer to application note AN0002.
FlexiCap
TM
is also suitable for space applications having passed
thermal vacuum outgassing tests. Refer to Syfer application
note reference AN0026.
RoHS Compliance
Syfer routinely monitors world wide material restrictions (e.g.,
EU/China and Korea RoHS mandates) and is actively involved
in shaping future legislation.
All standard C0G/NPO, X7R, X5R and High Q Syfer MLCC
products are compliant with the EU RoHS directive (see below
for special exemptions) and those with plated terminations are
suitable for soldering common lead free solder alloys (refer to
‘Soldering Information’ for more details on soldering
limitations). Compliance with EU RoHS directive automatically
signifies compliance with some other legislation (e.g., Korea
RoHS). Please refer to the Sales Office for details of
compliance with other materials legislation.
Breakdown of material content, SGS analysis reports and tin
whisker test results are available on request.
Most Syfer MLCC components are available with non-RoHS
compliant tin/lead (SnPb) Solderable termination finish for
exempt applications and where pure tin is not acceptable.
Other tin free termination finishes may also be available –
please refer to the Sales Office for further details.
X8R ranges <250Vdc are not RoHS 2011/65/EU compliant.
Syfer has delivered millions of FlexiCap
TM
components and
during that time has collected substantial test and reliability
data, working in partnership with customers world wide, to
eliminate mechanical cracking.
An additional benefit of FlexiCap
TM
is that MLCCs can withstand
temperature cycling from -55 to 125˚C in excess of 1,000
times without cracking.
FlexiCap
TM
termination has no adverse effect on any electrical
parameters, nor affects the operation of the MLCC in any way.
Application Notes
FlexiCap
TM
may be handled, stored and transported in the
same manner as standard terminated capacitors. The
requirements for mounting and soldering FlexiCap
TM
are the
same as for standard SMD capacitors.
For customers currently using standard terminated capacitors
there should be requirement to change the assembly process
when converting to FlexiCap
TM
.
Based upon the board bend tests in accordance with IEC
60384-1 the amount of board bending required to
mechanically crack a FlexiCap
TM
terminated capacitor is
significantly increased compared with standard terminated
capacitors.
Product: X7R
Standard
Termination
FlexiCap
TM
Typical bend performance under
AEC-Q200 test conditions
2mm to 3mm
Typically 8mm to 10mm
Check the website, www.syfer.com for latest RoHS update.
Export Controls and Dual-use Regulations
Certain Syfer catalogue components are defined as ‘dual-use’
items under international export controls – those that can be
used for civil and military purposes which meet certain
specified technical standards.
The defining criteria for a dual-use component with respect to
Syfer products is one with a voltage rating of >750V and a
capacitance value >250nF and a series inductance <10nH.
Components defined as ‘dual-use’ under the above criteria
automatically require a licence for export outside the EU, and
may require a licence for export with the EU.
The application for a licence is routine, but customers for these
products will be asked to supply further information.
Please refer to the sales office if you require any further
information on export restrictions.
Other special components may additionally need to comply
with export regulations.
Syfer Technology Ltd: E01E07Datasheet Issue 2 (P108015)
Release Date 15/08/13
Page 5 of 8
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