LUXEON FlipChip
Chip Scale Package LED
Introduction
Philips Lumileds LUXEON FlipChip LED Technology enables the next generation of lighting applications. Customers
now have complete design flexibility to access Lumileds’ industry leading performance at the die level and customize
the phosphor and packaging to best suit their lighting applications.
LUXEON FlipChip is a real Chip Scale Package LED that can be attached by reflow without additional packaging.
Traditional wire bonding limits the packing and power density of LEDs. LUXEON FlipChip LEDs can be packaged
closer and can be driven at a higher current density, therefore requiring fewer emitters to achieve a higher lumen
output at higher lumen densities.
This document contains the performance data needed to design and engineer Philips Lumileds LUXEON FlipChip
based application.
Features
•
High drive current up to
1A/mm
2
•
1.0mm x 1.0mm 5-sided emitter
•
445-460nm wavelength range
•
Low typical forward voltage of 2.9V
•
Low thermal resistance
•
Symmetric, larger bond pads with
under bump metallization finishing
Benefits
•
High current density for high
lumen and lm/$ at high lm/W
•
High-packaging density
•
5-sided emitter for dispense and
remote phosphor applications
•
Surface mount capable
•
No wire bonds
•
Robust design with proven
Lumileds reliability
Key Applications
•
High-power LED emitters
•
Chip on board
applications
•
Remote phosphor
applications
LUXEON FlipChip DS116 ©2014 Philips Lumileds Lighting Company.
Table of Contents
General Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Mechanical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Characteristic Curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Radiation Patterns . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Bin Structure for LUXEON FlipChip. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
LUXEON FlipChip DS116 20140723 ©2014 Philips Lumileds Lighting Company.
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General Information
Product Nomenclature
The part number designation for LUXEON FlipChip follows:
L0F2-BxxxSIZEyyyy1
Where:
L0F2 – designates for package level 0 flip chip generation 2
B
xxx
– designates for color blue
- designates minimum peak wavelength bin (450 for 450nm min peak wavelength bin)
SIZE - designates die dimension (1000 for 1.000mm
2
)
yyyy - minimum radiometric power performance (0500 for 500mW power bin)
Environmental Compliance
Philips Lumileds is committed to providing environmentally friendly products to the solid-state lighting market.
LUXEON FlipChip is compliant to the European Union directives on the restriction of hazardous substances
in electronic equipment, namely the RoHS and REACH directives. Philips Lumileds will not intentionally add
the following restricted material to the LUXEON FlipChip: lead, mercury, cadmium, hexavalent chromium,
polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE).
LUXEON FlipChip DS116 20140723 ©2014 Philips Lumileds Lighting Company.
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Product Performance and Characterization Guide
Table 1. Optical Characteristics at T
j
= 25°C, I
f
= 350mA
Part
Number
L0F2-B445100000001
L0F2-B450100000001
L0F2-B455100000001
Dominant Wavelength (nm)
[1,2]
Min.
445
450
455
Max.
450
455
460
24
0.05
Typical Spectra
Half-width
(nm)
Typical Temperature
Coefficient of
Peak Wavelength
[3]
(nm/°C)
Notes for Table 1:
1. Philips Lumileds maintains a tolerance of ± 2nm for dominant wavelength measurements.
2. Please see Figure 8 for typical translation from peak wavelength to dominant wavelength.
3. Measured between 25°C and 85°C at If= 350mA.
Table 2. Performance Characteristics at T
j
= 25°C, I
f
= 350mA
Part Number
L0F2-B445100005001
L0F2-B450100005001
L0F2-B455100005001
Min. Radiometric Power (mW)
[1,2]
500
500
500
0.95
Typical H/C factor
[3]
Notes for Table 2:
1. Radiometric power values are based on a die packaged on ceramic tile with high reflective surface and dome encapsulation.
2. Philips Lumileds maintains a tolerance of ± 6.5% on radiometric power measurements.
3. H/C factor is the radiometric power ratio between 25°C and 85°C at If= 350mA.
Table 3. Electrical Characteristics at T
j
= 25°C, I
f
= 350mA
Part Number
L0F2-B445100005001
Forward Voltage (V)
[1]
Min.
2.7
Typ.
2.9
Max.
3.1
Typical Temperature Coefficient of Forward Voltage
[2]
(mV/°C)
DV
f
/DT
J
-2 to -3
Notes for Table 3:
1. Philips Lumileds maintains a tolerance of ±0.06V on forward voltage measurements.
2. Measured between 25°C and 85°C at If= 350mA.
LUXEON FlipChip DS116 20140723 ©2014 Philips Lumileds Lighting Company.
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Absolute Maximum Ratings
Table 4. Operating Condition and Ratings
Parameter
DC Forward Current
[1] [2]
Peak Pulsed Forward Current
[3]
Storage Temperature
LED Junction Temperature
[1]
ESD Sensitivity
[4]
Maximum Performance
1050mA
1300mA
-40°C - 135°C
135°C
≤
200V (HBM, CLASS 0B per JS-001-2012)
LUXEON FlipChip is not designed to be driven in reverse bias.
Reverse Voltage
Notes for Table 4:
1. Proper current de-rating must be observed to maintain the junction temperature below the specified maximum junction temperature.
2. Residual periodic variations due to power conversion from alternating current (AC) to direct current (DC), also called “ripple”, with frequencies
≥
100Hz and amplitude
≤
250mA are acceptable,
assuming the average current throughout each cycle does not exceed the specified maximum DC forward current and the junction temperature is kept below the specified maximum junction
temperature.
3. Pulsed operation with a peak drive current of 1300mA is acceptable if the pulse on-time is
≤
5ms per cycle and the duty cycle is
≤
50%.
4. Please see the LUXEON FlipChip application brief for additional information on ESD protection.
Mechanical Dimensions
Figure 1. Mechanical Dimensions, LUXEON FlipChip LHDF-RB10 xxxx xxxx x.
Notes for Figure 1:
1. Drawing is not scale.
2. All dimensions are in micrometers .
3. A notch in the bond pad center indicates the anode.
4. The bond pads are finished with under bump metallization without solder paste material. Stencil solder paste printing on the substrate is requested before reflow LUXEONF FlipChip.
5. LUXEON FlipChip is qualified for AuSn/SAC die attach and reflow on various substrates (Ceramic, MCPCB and even FR4 if uses SAC solder) when AuSn/SAC solder paste are stencil printed
onto the substrate.
LUXEON FlipChip DS116 20140723 ©2014 Philips Lumileds Lighting Company.
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