256KX1 STANDARD SRAM, 20ns, PDIP24, 0.300 INCH, PLASTIC, DIP-24
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Motorola ( NXP ) |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 24 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 20 ns |
| I/O type | SEPARATE |
| JESD-30 code | R-PDIP-T24 |
| JESD-609 code | e0 |
| length | 29.59 mm |
| memory density | 262144 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 1 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 24 |
| word count | 262144 words |
| character code | 256000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 256KX1 |
| Output characteristics | 3-STATE |
| Exportable | NO |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 4.57 mm |
| Maximum standby current | 0.00005 A |
| Minimum standby current | 2 V |
| Maximum slew rate | 0.12 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| MCM62L07P20 | MCM62L07J25 | MCM62L07J35R2 | MCM62L07J25R2 | MCM62L07J20 | MCM62L07J20R2 | MCM62L07P35 | MCM62L07J35 | |
|---|---|---|---|---|---|---|---|---|
| Description | 256KX1 STANDARD SRAM, 20ns, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | 256KX1 STANDARD SRAM, 25ns, PDSO24, 0.300 INCH, PLASTIC, SOJ-24 | 256KX1 STANDARD SRAM, 35ns, PDSO24, 0.300 INCH, PLASTIC, SOJ-24 | 256KX1 STANDARD SRAM, 25ns, PDSO24, 0.300 INCH, PLASTIC, SOJ-24 | 256KX1 STANDARD SRAM, 20ns, PDSO24, 0.300 INCH, PLASTIC, SOJ-24 | 256KX1 STANDARD SRAM, 20ns, PDSO24, 0.300 INCH, PLASTIC, SOJ-24 | 256KX1 STANDARD SRAM, 35ns, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | 256KX1 STANDARD SRAM, 35ns, PDSO24, 0.300 INCH, PLASTIC, SOJ-24 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) |
| Parts packaging code | DIP | SOJ | SOJ | SOJ | SOJ | SOJ | DIP | SOJ |
| package instruction | DIP, | SOJ, SOJ24,.34 | SOJ, SOJ24,.34 | SOJ, SOJ24,.34 | SOJ, SOJ24,.34 | SOJ, SOJ24,.34 | DIP, | SOJ, SOJ24,.34 |
| Contacts | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 20 ns | 25 ns | 35 ns | 25 ns | 20 ns | 20 ns | 35 ns | 35 ns |
| I/O type | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE |
| JESD-30 code | R-PDIP-T24 | R-PDSO-J24 | R-PDSO-J24 | R-PDSO-J24 | R-PDSO-J24 | R-PDSO-J24 | R-PDIP-T24 | R-PDSO-J24 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| length | 29.59 mm | 15.875 mm | 15.875 mm | 15.875 mm | 15.875 mm | 15.875 mm | 29.59 mm | 15.875 mm |
| memory density | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bi |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| memory width | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of ports | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| word count | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| character code | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 256KX1 | 256KX1 | 256KX1 | 256KX1 | 256KX1 | 256KX1 | 256KX1 | 256KX1 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Exportable | NO | NO | NO | NO | NO | NO | NO | NO |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | SOJ | SOJ | SOJ | SOJ | SOJ | DIP | SOJ |
| Encapsulate equivalent code | DIP24,.3 | SOJ24,.34 | SOJ24,.34 | SOJ24,.34 | SOJ24,.34 | SOJ24,.34 | DIP24,.3 | SOJ24,.34 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 4.57 mm | 3.75 mm | 3.75 mm | 3.75 mm | 3.75 mm | 3.75 mm | 4.57 mm | 3.75 mm |
| Maximum standby current | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A |
| Minimum standby current | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V |
| Maximum slew rate | 0.12 mA | 0.12 mA | 0.11 mA | 0.12 mA | 0.12 mA | 0.12 mA | 0.11 mA | 0.11 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | YES | YES | YES | YES | NO | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | J BEND | J BEND | J BEND | J BEND | J BEND | THROUGH-HOLE | J BEND |
| Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
京公网安备 11010802033920号
EEWORLD
