EEWORLDEEWORLDEEWORLD

Part Number

Search

380LJ018M16

Description
EMI/RFI Non-Environmental Backshell with Strain Relief
File Size82KB,2 Pages
ManufacturerGlenair
Websitehttp://www.glenair.com/
Download Datasheet View All

380LJ018M16 Overview

EMI/RFI Non-Environmental Backshell with Strain Relief

380-018
EMI/RFI Non-Environmental Backshell
with Strain Relief
Type E - Rotatable Coupling - Standard Profile
38
CONNECTOR
DESIGNATORS
380 F J 018 M 24 12 D A
Product Series
Connector
Designator
Angular Function
H = 45°
J = 90°
See page 38-84 for straight
Basic Part No.
Finish (Table II)
Strain Relief Style
(H, A, M, D)
Termination (Note 4)
D = 2 Rings
T = 3 Rings
Dash No. (Table X, XI)
Shell Size (Table I)
A-F-H-L-S
ROTATABLE
COUPLING
TYPE E INDIVIDUAL
AND/OR OVERALL
SHIELD TERMINATION
A Thread
(Table I)
E
(Table III)
G
(Table III)
F (Table III)
C Typ.
(Table I)
H (Table III)
.88 (22.4)
Max
STYLE 2
(See Note 1)
STYLE H
Heavy Duty
(Table X)
T
STYLE A
Medium Duty
(Table XI)
W
Add “-445” to Specify Glenair’s Non-Detent,
("NESTOR") Spring-Loaded, Self-Locking Coupling.
See Page 41 for Details.
STYLE M
Medium Duty
(Table XI)
X
STYLE D
Medium Duty
(Table XI)
.135 (3.4)
Max
Cable
Range
V
Cable
Range
Y
Cable
Range
Y
Cable
Entry
Z
© 2005 Glenair, Inc.
CAGE Code 06324
Printed in U.S.A.
GLENAIR, INC.
1211 AIR WAY
GLENDALE, CA 91201-2497
818-247-6000
FAX 818-500-9912
www.glenair.com
E-Mail: sales@glenair.com
Series 38 - Page 88

Recommended Resources

How are the results of CST PCB simulation displayed?
Where can I display the results of CST PCB simulation? It seems that the simulation is completed, but I don’t know where to open the simulation results...
lingking Integrated technical exchanges
Beijing Qingyun Innovation Company recruits R&D engineers
Job Responsibilities: 1. Undertake the design and technical change tasks of FPGA liquid crystal driver board and graphic card, and be responsible for the sorting and archiving of the technical documen...
qycxhr Recruitment
VCA810 does not output waveform, please help.
Hi everyone:I am making the above circuit. I use a breadboard to connect it. Vin inputs a 500 mVp-p, and Vc uses a VR to adjust the voltage, but the output voltage is 0V. I tried 3 samples and the res...
PSIR Analog electronics
Request WinCE.Net ASP to call text file method
I'm looking for a method to call a text file from an ASP page in WinCE.Net. I've tried but can't create a Scripting.FileSystemObject object and an ADODB.Stream object in a WinCE.Net ASP page. Do you h...
iyj Embedded System
Reliable packaging technology - bonding [transfer]
Bonding: Bonding in English, literally translated as "chip wire bonding". Bonding is a wire bonding method in the chip production process. It is generally used to connect the internal circuit of the c...
呱呱 FPGA/CPLD
Arrow Live: Focus on "TI FPD-Link III Automotive Chipset", the ideal solution for automotive video transmission
As cars become smarter, there will be more and more onboard cameras and information display screens in cars. All of these devices need to be connected to a processor. The TI FPD-Link III chipset provi...
EEWORLD社区 TI Technology Forum

Popular Articles

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 180  53  2085  1653  2672  4  2  42  34  54 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号