EEWORLDEEWORLDEEWORLD

Part Number

Search

OX01F10-E48Y-1B-Z

Description
CMOS Sensor,
CategoryThe sensor   
File Size518KB,2 Pages
ManufacturerOmniVision
Websitehttps://www.ovt.com
Download Datasheet Parametric View All

OX01F10-E48Y-1B-Z Overview

CMOS Sensor,

OX01F10-E48Y-1B-Z Parametric

Parameter NameAttribute value
MakerOmniVision
package instructionCSP-48
Reach Compliance Codeunknown
Other featuresAEC-Q100, ROLLING SHUTTER
array typeFRAME
Dynamic Range120 dB
Frame rate30 fps
horizontal pixels1340
Installation featuresSURFACE MOUNT
Maximum operating temperature105 °C
Minimum operating temperature-40 °C
optical format1/4 inch
Package Shape/FormRECTANGULAR
Pixel size3X3 µm
Sensor/temperature sensor typeIMAGE SENSOR,CMOS
surface mountYES
Termination typeSOLDER
vertical pixels1020
OX01F10
1.3MP
product brief
lead free
available in
a lead-free
package
SoC Offers Rear and Surround View Cameras
Industry's Best Low-Light Performance,
Lowest Power and Smallest Size
OmniVision's OX01F10 is a 1.3MP SoC, providing automotive
designers with the industry's best imaging performance across
a wide range of challenging lighting conditions, along with the
most compact form factor and lowest power consumption. In a
single, 1/4" optical format package, the OX01F10 integrates a
3.0 micron image sensor and an advanced image signal
processor (ISP) with OmniVision's PureCel®Plus technology for
low noise, solving the automotive rear view camera (RVC) and
surround view system (SVS) challenges of achieving a small
form factor with excellent low-light performance, ultra-low
power and reduced cost while improving reliability by using
only one printed circuit board (PCB).
This SoC employs dual conversion gain (DCG) technology to
achieve a high dynamic range of 120 dB with only two captures,
as opposed to three required by the competition, which
minimizes motion artifacts while reducing power consumption
and boosting low-light performance.
The OX01F10 features <300 mW typical power consumption,
which is 30% lower than competitors and significantly reduces
the temperature. It is the only imaging device today that does
not require a metal heat sink, allowing for the use of plastic
camera module bodies to reduce costs. With its compact
package size, it also enables smaller cameras that can fit in
much tighter spaces. In addition, by integrating both the image
sensor and ISP into a single chip, designers can save on both
cost and space by eliminating the second PCB in typical two-
chip implementations.
This SoC provides 1.3MP resolution and a 1340 x 1020 array
size at 30 fps, offering ample resolution for calibration. It also
enables output flexibility with both 2-lane MIPI and 10-bit DVP
interfaces, and is AEC-Q100 Grade 2 certified.
Find out more at www.ovt.com.

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2698  204  2318  2142  711  55  5  47  44  15 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号