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DS25BR101

Description
3.125 Gbps LVDS Buffer with Transmit Pre-Emphasis and Receive Equalization
File Size393KB,16 Pages
ManufacturerNational Semiconductor(TI )
Websitehttp://www.ti.com
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DS25BR101 Overview

3.125 Gbps LVDS Buffer with Transmit Pre-Emphasis and Receive Equalization

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Description 3.125 Gbps LVDS Buffer with Transmit Pre-Emphasis and Receive Equalization 3.125 Gbps LVDS Buffer with Transmit Pre-Emphasis and Receive Equalization 3.125 Gbps LVDS Buffer with Transmit Pre-Emphasis and Receive Equalization 3.125 Gbps LVDS Buffer with Transmit Pre-Emphasis and Receive Equalization 3.125 Gbps LVDS Buffer with Transmit Pre-Emphasis and Receive Equalization 3.125 Gbps LVDS Buffer with Transmit Pre-Emphasis and Receive Equalization 3.125 Gbps LVDS Buffer with Transmit Pre-Emphasis
Is it Rohs certified? - incompatible - incompatible incompatible - incompatible
package instruction - 3 X 3 MM, LLP-8 - HVSON, SOLCC8,.12,20 HVSON, SOLCC8,.12,20 - 3 X 3 MM, LLP-8
Reach Compliance Code - _compli - compli compli - _compli
ECCN code - EAR99 - EAR99 EAR99 - EAR99
Differential output - YES - YES YES - YES
Number of drives - 1 - 1 1 - 1
Input properties - DIFFERENTIAL - DIFFERENTIAL DIFFERENTIAL - DIFFERENTIAL
Interface integrated circuit type - LINE DRIVER - LINE DRIVER LINE DRIVER - LINE DRIVER
Interface standards - GENERAL PURPOSE - GENERAL PURPOSE GENERAL PURPOSE - GENERAL PURPOSE
JESD-30 code - S-XDSO-N8 - S-XDSO-N8 S-XDSO-N8 - S-XDSO-N8
JESD-609 code - e0 - e0 e0 - e0
length - 3 mm - 3 mm 3 mm - 3 mm
Humidity sensitivity level - 1 - 3 3 - 1
Number of functions - 1 - 1 1 - 1
Number of terminals - 8 - 8 8 - 8
Maximum operating temperature - 85 °C - 85 °C 85 °C - 85 °C
Minimum operating temperature - -40 °C - -40 °C -40 °C - -40 °C
Package body material - UNSPECIFIED - UNSPECIFIED UNSPECIFIED - UNSPECIFIED
encapsulated code - HVSON - HVSON HVSON - HVSON
Encapsulate equivalent code - SOLCC8,.11,20 - SOLCC8,.12,20 SOLCC8,.12,20 - SOLCC8,.11,20
Package shape - SQUARE - SQUARE SQUARE - SQUARE
Package form - SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE - SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE - SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius) - 260 - 260 260 - 260
power supply - 3.3 V - 3.3 V 3.3 V - 3.3 V
Certification status - Not Qualified - Not Qualified Not Qualified - Not Qualified
Maximum seat height - 0.8 mm - 0.8 mm 0.8 mm - 0.8 mm
Maximum supply voltage - 3.6 V - 3.6 V 3.6 V - 3.6 V
Minimum supply voltage - 3 V - 3 V 3 V - 3 V
Nominal supply voltage - 3.3 V - 3.3 V 3.3 V - 3.3 V
surface mount - YES - YES YES - YES
Temperature level - INDUSTRIAL - INDUSTRIAL INDUSTRIAL - INDUSTRIAL
Terminal surface - Tin/Lead (Sn85Pb15) - TIN LEAD TIN LEAD - Tin/Lead (Sn85Pb15)
Terminal form - NO LEAD - NO LEAD NO LEAD - NO LEAD
Terminal pitch - 0.5 mm - 0.5 mm 0.5 mm - 0.5 mm
Terminal location - DUAL - DUAL DUAL - DUAL
Maximum time at peak reflow temperature - 40 - 40 40 - 40
maximum transmission delay - 0.465 ns - 0.465 ns 0.465 ns - 0.465 ns
width - 3 mm - 3 mm 3 mm - 3 mm
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