3500 Series/Low Thermal EMF Reed Relays
L
OW
T
HERMAL
EMF R
EED
R
ELAYS
The 3500 Series is ideally suited to the needs of Instrumentation, Data
Acquisition and Process Control. The specification tables allow you to
select the appropriate relay for your particular application. Recommended
for use in high accuracy DVM’s, Multiplexers and Digital or Analog
Multipoint Recorders. If your requirements differ from the selection
options, please consult Coto’s Factory to discuss a custom reed relay.
Refer to page 41 for Thermal EMF test methods.
3500 S
ERIES
F
EATURES
u
u
u
u
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Low Thermal EMF: < 10 µV through < 0.5
µV
with 50 nV stability.
Patented Low Thermal Design. Patent #4,084,142.
Low power coils to ensure low thermal EMF.
High Insulation Resistance - 10
12
Ω
Control/Signal isolation of 1500 VDC
High reliability, hermetically sealed contacts.
Form A, Dry or Hg Wet contacts. High Dielectric Strength.
Epoxy coated steel shell provides magnetic shielding.
(For Model #’s
3501 & 3540)
(For Model #’s
3502, 3520, 3541)
Bottom
View
2
Dimensions in Inches (Millimeters)
COTO TECHNOLOGY
RHOPOINT COMPONENTS LTD,
Email: components@rhopoint.co.uk Website: www.rhopoint.co.uk
3500 Series/Low Thermal EMF Reed Relays
Model Number
Parameters
THERMAL EMF
….OPTIONS
3501
2
Test Conditions
Units
1 Form A
3502
2
2 Form A
3520
2,3
2 Form A
3540
2
1 Form A
High Voltage
3541
2
2 Form A
High Voltage
Measured after 5 minutes
at nominal coil voltage
Refer to Reed Relay
Technical Section for Details
µ
V
Individual
<5
µ
V
<3
µ
V
<1
µ
V
<0.5
µ
V
5
12
350 2000
3.8 9.0
0.4 1.0
Differential
<5
µ
V
<3
µ
V
<1
µ
V
<0.5
µ
V
5
12
350 2000
3.8 9.0
0.4 1.0
Differential
<10
µ
V
<5
µ
V
-
-
Individual
<5
µ
V
<3
µ
V
-
-
Differential
<5
µ
V
<3
µ
V
-
-
COIL SPECS.
Nom. Coil Voltage
Coil Resistance
Operate Voltage
Release Voltage
CONTACT RATING
Switching Voltage
Switching Current
Carry Current
Contact Rating
Life Expectancy-Typical
1
Static Contact
Resistance (max. init.)
Dynamic Contact
Resistance (max. init.)
RELAY SPECIFICATIONS
Insulation Resistance
(minimum)
Capacitance - Typical
Across Open Contacts
Dielectric Strength
(minimum)
Operate Time - including
bounce - Typical
Release Time - Typical
VDC
+/- 10%, 25° C
Must Operate by
Must Release by
Ω
VDC - Max.
VDC - Min.
5
200
3.8
0.4
12
850
9.0
1.0
5
12
200 1500
3.8 9.0
0.4 1.0
5
12
200 1500
3.8 9.0
0.4 1.0
Max DC/Peak AC Resist.
Max DC/Peak AC Resist.
Max DC/Peak AC Resist.
Max DC/Peak AC Resist.
Signal Level 1.0V, 10mA
50mV, 10mA
0.5V, 50mA
at 100 Hz, 1.5 msec
Volts
Amps
Amps
Watts
x 10
6
Ops.
Ω
Ω
200
0.5
1.5
10
500
0.200
0.300
200
0.5
1.5
10
100
0.100
0.200
500
1.0
2.0
28
1000
0.050
0.100
500
0.5
2.0
10
100
0.200
0.300
500
0.5
2.0
10
100
0.100
0.200
Between all Isolated Pins
at 100V, 25°C, 40% RH
Without shield
Shield Guarding
Between Contacts
Contacts to Shield
Contacts/Shield to Coil
At Nominal Coil Voltage,
30 Hz Square Wave
Zener-Diode Suppression
4
Ω
pF
pF
VDC/peak AC
VDC/peak AC
VDC/peak AC
msec.
msec.
x
10
12
3.0
1.9
700
1000
1500
0.75
0.1
x
10
12
1.7
0.2
350
1000
1500
0.75
0.1
x
10
12
1.7
0.2
1000
1000
1500
2.0
1.0
x
10
12
3.0
1.9
1500
1000
1500
1.0
0.2
x
10
12
1.7
0.2
1500
1000
1500
1.0
0.2
Top View:
Dot stamped on top of relay refers to pin #1 location
Grid = .1"x.1" (2.54mm x 2.54mm)
Notes:
1
Environmental Ratings
Storage Temp: -35°C to +100°C;
Operating Temp: -20°C to +85°C
Solder Temp: 270°C max; 10 sec. max
The operate and release voltage and the coil
resistance are specified at 25°C. These values
vary by approximately 0.4%/°C as the ambient
temperature varies.
Vibration: 20 G’s to 2000 Hz; Shock: 50 G’s
Consult factory for life expectancy at other switching loads.
2
Models 3501 and 3540, optional electrostatic shield is tied to
pin #5. Models 3502, 3520 and 3541, optional electrostatic
shield is tied to pin #13.
3
Model 3520 has Hg wet contacts - position sensitive, must be
mounted within 30° of vertical plane. See schematic.
4
Consists of 20V Zener-diode and 1N4002 diode in series,
connected in parallel with coil
COTO TECHNOLOGY
RHOPOINT COMPONENTS LTD
Holland Rd, Hurst Green, Oxted, Surrey, RH8 9AX,ENGLAND
Embedded System
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